STMicroelectronics STIPN2M50T-HL

Overview

STIPN2M50T-HL from STMicroelectronics is a SLLIMM-nano intelligent power module (IPM) integrating six 500 V, 2 A MOSFETs and three half-bridge high-voltage ICs (HVICs) for gate driving in a single NDIP-26L package. It delivers a complete 3-phase inverter bridge with integrated op-amp, comparator-based fault protection (overcurrent/overtemperature), NTC thermistor interface, bootstrap diodes, interlocking logic, and ±2 kV HBM ESD protection - designed for compact, low-EMI motor drives in white goods.

For engineers reviewing the STIPN2M50T-HL datasheet, STIPN2M50T-HL pinout, STIPN2M50T-HL application, or STIPN2M50T-HL equivalent, key selection considerations include its 1.7 Ω max R_DS(on), 500 V blocking voltage, 25 kHz PWM capability, dual-function T/SD/OD pins supporting both NTC sensing and active-low shutdown, and built-in dead-time control with 180 ns propagation delay.

Technical Context

This IPM implements a fully integrated 3-phase inverter topology with independent U/V/W half-bridge drivers, each featuring internal bootstrap diodes and dedicated V_BOOT pins. The control section includes CMOS/TTL-compatible 3.3 V/5 V/15 V logic inputs with built-in 375 kΩ pull-down resistors and interlocking logic to prevent shoot-through.

The embedded op-amp (gain bandwidth product: 8–12 MHz, slew rate: 2.5–3.8 V/µs) and comparator (reference voltage: 0.54 V typ., delay: 90–130 ns) enable real-time current sensing and fast fault response - with shutdown propagation delays of 50–200 ns to U-phase drivers and RC-dependent timing for V/W phases per AN4966.

Key Specifications

Pinout & Package

STIPN2M50T-HL uses the NDIP-26L in-line package: 26-pin, single-row, plastic DIP with internal heatsink pad (exposed metal base) for direct thermal coupling to PCB copper or heatsink. Dimensions: 29.2 mm × 12.5 mm × 4.4 mm (L × W × A), pitch 1.8 mm, creepage ≥ 5.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase inverter IPM applications.

Compared with FSB50850 and IRSM836-054MH, STIPN2M50T-HL uniquely combines op-amp, comparator, dual NTC/SD pins, and bootstrap diodes in a 2 A-class NDIP-26L footprint - making it optimal for space-constrained, thermally monitored, low-noise white goods inverters where BOM reduction and design simplicity are critical.

Availability

STIPN2M50T-HL is available at Aetrix Electronics and suitable for dishwasher drain pumps, refrigerator compressors, and air-conditioning fans requiring stable component supply, long-lifecycle support, and consistent thermal performance across production batches.

Supply support for STIPN2M50T-HL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, microcontrollers, sensors, and automotive ICs - with over 40 years of IPM innovation.

The SLLIMM-nano product line targets compact, high-efficiency AC motor drives for white goods and small appliances, emphasizing thermal optimization, EMI reduction, and system-level integration to replace discrete inverter designs.

FAQ

What is the maximum recommended PWM frequency for STIPN2M50T-HL?

The datasheet specifies 25 kHz as the maximum recommended PWM frequency under normal operating conditions (T_C < 100 °C). This limit ensures thermal stability and keeps switching losses within the 10.4 W per-MOSFET power dissipation rating. Higher frequencies increase core and switching losses, requiring derating below 2 A continuous current or enhanced heatsinking.

How does the T/SD/OD pin function during normal operation versus fault condition?

In normal operation, T/SD/OD acts as an NTC thermistor terminal - its voltage drops predictably with rising temperature (e.g., 4.5 V at 25 °C → 2.5 V at 100 °C with 2.2 kΩ pull-up). During overtemperature or comparator-triggered fault, it switches to open-drain mode and pulls low (<0.5 V) to signal shutdown to the MCU, simultaneously disabling U-phase outputs immediately and V/W phases after RC delay.

Can the integrated op-amp be used for voltage sensing instead of current sensing?

Yes - the op-amp is uncommitted and rail-to-rail, supporting both inverting and non-inverting configurations. Its 14.7 V high-level output and 75 mV low-level output (at V_CC = 15 V) allow direct interfacing with 3.3 V or 5 V ADCs. However, its primary design intent is current sensing via shunt resistors; voltage sensing requires external scaling resistors and careful offset calibration due to 6 mV input offset voltage.

Is external bootstrap diode required when using STIPN2M50T-HL?

No - STIPN2M50T-HL integrates internal bootstrap diodes for all three phases, eliminating the need for external diodes. This reduces component count, PCB area, and potential failure points. External bootstrap capacitors (C_BOOT) are still required and must be placed within 5 mm of each V_BOOT/OUT pair, with ceramic decoupling (C₃) in parallel to suppress high-frequency ringing.