STMicroelectronics STIPQ3M60T-HZ

Overview

STIPQ3M60T-HZ from STMicroelectronics is a 3-phase intelligent power module (IPM) integrating six N-channel MDmesh™ DM2 Power MOSFETs (600 V, 3 A, R_DS(on) ≤ 1.6 Ω), three half-bridge HVIC gate drivers, op-amp, comparator, NTC thermistor, and internal bootstrap diodes in an N2DIP-26L type Z package. It delivers compact, low-EMI motor drive for built-in appliance applications including refrigerator compressors and kitchen hood fans.

For engineers reviewing the STIPQ3M60T-HZ datasheet, STIPQ3M60T-HZ pinout, STIPQ3M60T-HZ application, or STIPQ3M60T-HZ equivalent, this IPM enables direct MCU interface without optocouplers, supports 3.3 V/5 V/15 V logic inputs with hysteresis, integrates fault protection via CIN comparator and T/SD/OD shutdown, and provides thermal monitoring via NTC-connected pin with UL 1434 CA2/CA4 compliance.

Technical Context

This SLLIMM-nano IPM implements a fully integrated 3-phase inverter bridge with independent high- and low-side gate driving per phase, interlocking logic to prevent shoot-through, and undervoltage lockout on both V_CC and V_BOOT rails. The embedded op-amp is uncommitted and rail-to-rail capable (±14.7 V output swing, 8–12 MHz GBWP), while the comparator features 0.54 V internal reference and 90–130 ns propagation delay for fast overcurrent response.

The module uses MDmesh™ DM2 MOSFETs with intrinsic fast-recovery diodes and optimized switching transitions (t_on = 220 ns typ., t_off = 225 ns typ.) to minimize EMI. Thermal design is enhanced by exposed GND pad (internally connected), 10 °C/W junction-to-case resistance per MOSFET, and screw-mount heatsink compatibility per N2DIP-26L mechanical outline.

Key Specifications

Pinout & Package

The STIPQ3M60T-HZ uses the N2DIP-26L type Z package: a 32.2 mm × 12.5 mm × 5.1 mm molded module with exposed GND pad (internally connected), isolated screw-mounting holes, and 26 leads arranged in dual-row configuration. Pin 1 is marked with dot; pins 17–26 are high-voltage outputs and bootstrap nodes requiring low-inductance layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase IPM motor drive applications.

Compared with FSTB1060A and FSBB15CH60C, STIPQ3M60T-HZ uniquely integrates an uncommitted op-amp, comparator with internal reference, and UL-certified NTC in a compact 26-pin package-enabling complete analog signal chain and thermal monitoring without external components, critical for space-limited appliance designs.

Availability

STIPQ3M60T-HZ is available at Aetrix Electronics and suitable for refrigerator compressor drives, kitchen hood fan control, and dishwasher drain pump applications requiring stable component supply, long-term lifecycle support, and UL-recognized isolation.

Supply support for STIPQ3M60T-HZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for automotive, industrial, and consumer markets.

The SLLIMM-nano product line delivers compact, high-efficiency intelligent power modules optimized for low-power (<300 W) built-in motor applications where thermal density, EMI, and board space are critical constraints.

FAQ

What logic voltage levels does STIPQ3M60T-HZ support for HIN/LIN inputs?

The device accepts 3.3 V, 5 V, and 15 V CMOS/TTL logic inputs with hysteresis. High-level threshold is 2.25 V minimum, low-level is 0.8 V maximum, and each input includes a 375 kΩ internal pull-down resistor. No external level shifting is required for direct MCU interfacing.

How is thermal protection implemented using the T/SD/OD pin?

The T/SD/OD pin connects internally to an NTC thermistor and a pull-down resistor network (RPD_SD). As temperature rises, NTC resistance drops, lowering the pin voltage. With appropriate external pull-up (1 kΩ @ 3.3 V, 2.2 kΩ @ 5 V), this creates a monotonic voltage-vs.-temperature curve used by the MCU for thermal monitoring or automatic shutdown.

Can the integrated op-amp be used for current sensing amplification?

Yes-the op-amp is fully uncommitted with rail-to-rail output (0–14.7 V), 8–12 MHz gain-bandwidth, and 2.5–3.8 V/µs slew rate. It can amplify shunt resistor voltage prior to feeding the CIN comparator, enabling precise 0.5–3 A current measurement with minimal external components.

What is the recommended layout practice for the V_BOOT and OUT pins?

V_BOOT and corresponding OUT pins (e.g., V_BOOTU and U,OUT) must be decoupled with low-ESR/ESL ceramic capacitors (C_boot + C₃, 100–220 nF) placed ≤2 mm away. Bootstrap negative electrodes must connect directly to their respective OUT pins-not to shared ground-to prevent high-frequency ground bounce from disrupting gate drive.