STMicroelectronics STPMIC1BPQR

Overview

STPMIC1BPQR from STMicroelectronics is a highly integrated power management IC (PMIC) designed as a companion chip for the STM32MP1 microprocessor unit. It delivers six LDOs-including DDR3 termination (sink-source), USB PHY, and reference voltage rails-four adaptive COT buck converters, a 5.2 V/1.1 A boost converter with bypass mode, two 500 mA power switches, and I²C/digital IO control. Its NVM-programmed configuration (Rank-based startup, default LDO2=2.9 V, BUCK3=1.8 V) targets low-power embedded MPU systems.

For engineers reviewing the STPMIC1BPQR datasheet, STPMIC1BPQR pinout, STPMIC1BPQR application, or STPMIC1BPQR equivalent, this page provides verified technical context, exact pin functions, real-world use cases in wearable IoT and smart home devices, and validated alternative parts with documented functional differences-not generic drop-in claims.

Technical Context

The STPMIC1BPQR implements four adaptive constant-on-time (COT) buck converters with integrated PLL-synchronized PWM operation to minimize EMI, plus PFM-to-PWM seamless transition for high efficiency (up to 90%) across load ranges. Its LDO3 supports three modes-normal (1.8–3.3 V, 100 mA), sink-source (±120 mARMS, VREFDDR = VOUT2/2), and bypass (R_DS(on) = 0.45 Ω)-enabling dynamic DDR3/LPDDR3 termination.

Startup sequencing is controlled via non-volatile memory (NVM) with four programmable ranks (Rank0–Rank3); STPMIC1BPQR defaults to Rank2 for BUCK1/BUCK2 and Rank1 for BUCK3, ensuring coordinated power-up of core, DDR, and auxiliary rails. The boost converter supports dual-input sourcing (battery or 5 V adapter) and powers up to three USB ports with automatic VBUS regulation.

Key Specifications

Pinout & Package

WFQFN 44L (5×6×0.8 mm) package with exposed thermal pad (EPGND) requiring solder connection to PCB ground plane for thermal management and noise reduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with TPS650860A1RSLR and MAX20029ATPA/V+T, STPMIC1BPQR uniquely integrates DDR3 sink-source termination, NVM-configurable sequencing, and USB-aware boost in a single WFQFN44 package-reducing total solution size by ≥35% and eliminating 3–5 external components in STM32MP1-based designs.

Availability

STPMIC1BPQR is available at Aetrix Electronics and suitable for wearable health monitors, smart home hubs, industrial HMIs, and portable medical diagnostic tools requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for STPMIC1BPQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, power management, sensors, and automotive ICs with over 45 years of analog/mixed-signal design expertise.

The STPMIC1 product line delivers highly integrated, NVM-programmable PMICs optimized specifically for ST's STM32MP1 series of heterogeneous MPUs-enabling compact, low-power, and thermally robust embedded computing platforms.

FAQ

What is the default NVM configuration for STPMIC1BPQR?

STPMIC1BPQR is factory-programmed with LDO2 = 2.9 V (Rank2), BUCK1/BUCK2 = 1.2 V (Rank2), BUCK3 = 1.8 V (Rank1), and BUCK4 = 3.3 V (Rank2). Startup sequence begins automatically after PONKEYn assertion, with no host initialization required. All NVM registers-including I²C slave address and VINOK thresholds-are pre-set per Table 1 in DS12792 Rev 10.

How does LDO3 operate in sink-source mode for DDR3 termination?

In sink-source mode, LDO3 regulates VREFDDR to exactly half of VOUT2 (e.g., 0.675 V when VOUT2 = 1.35 V), sourcing or sinking up to ±120 mARMS to maintain termination voltage during DDR3 data transitions. This eliminates need for external op-amp circuits and reduces layout sensitivity to PCB trace inductance.

Can STPMIC1BPQR support USB OTG and host simultaneously?

Yes-its 5.2 V/1.1 A boost converter powers VBUSOTG (Pin 35), while SWOUT (Pin 38) delivers 500 mA to a second USB port. The internal power mux and automatic source detection allow concurrent OTG negotiation and host enumeration without external switches or arbitration logic.

What thermal management is required for WFQFN44 package at 125 °C junction?

The WFQFN44 package requires the exposed ePad (EPGND) to be soldered to a minimum 100 mm² copper pour connected to ≥4 thermal vias (0.3 mm diameter) to an internal ground plane. With this layout, θ_JA remains ≤29 °C/W, enabling full 1.1 A boost output at 105 °C ambient per DS12792 thermal characterization.