STMicroelectronics STPS10L45CG-TR

Overview

STPS10L45CG-TR from STMicroelectronics is a dual center-tap low-drop Schottky rectifier optimized for high-frequency DC-DC converters and SMPS outputs, featuring 45 V repetitive peak reverse voltage, 10 A average forward current per device (5 A per diode), 0.46 V maximum forward voltage at 125°C/10 A, and D²PAK package with insulated thermal path. It enables efficient low-voltage power conversion in server VRMs and telecom rectifiers.

For engineers reviewing the STPS10L45CG-TR datasheet, STPS10L45CG-TR pinout, STPS10L45CG-TR application, or STPS10L45CG-TR equivalent, key selection criteria include forward voltage drop at high junction temperature, avalanche energy rating (2700 W peak), thermal resistance (1.7 °C/W junction-to-case per diode), and isolation capability (2000 V DC) in the D²PAK variant.

Technical Context

This dual-diode Schottky rectifier integrates two independent anode-cathode paths sharing a common cathode terminal (center-tap configuration), enabling synchronous rectification in half-bridge and full-wave topologies. Its low dV/dt rating (10,000 V/µs) supports fast-switching GaN and SiC gate drivers without parasitic turn-on.

The device operates up to 150°C junction temperature with specified avalanche capability and exhibits low junction capacitance (12 pF at 1 MHz, 0 V), minimizing switching losses in >500 kHz converters. Thermal design relies on direct conduction cooling via the exposed copper tab, with R_th(j-c) = 1.7 °C/W per diode in D²PAK.

Key Specifications

Pinout & Package

STPS10L45CG-TR is housed in a surface-mount D²PAK (TO-263AB) package with an exposed metal tab serving as the common cathode (K) terminal. The package provides 2000 V DC insulation between tab and leads, enabling safe mounting on grounded heatsinks without isolation pads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual center-tap Schottky rectifier applications.

Compared with VS-10CTH04-M3/45 and SB1040, STPS10L45CG-TR delivers lower conduction loss, integrated insulation, and rated avalanche energy-making it uniquely suitable for space-constrained, high-reliability industrial and telecom power stages where thermal management and fault tolerance are critical.

Availability

STPS10L45CG-TR is available at Aetrix Electronics and suitable for server VRM output rectification, telecom DC-DC converters, and industrial PLC power modules requiring stable component supply across multi-year production cycles.

Supply support for STPS10L45CG-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

This device belongs to ST's "Low Drop Power Schottky Rectifier" product line, engineered specifically for high-efficiency, high-frequency power conversion in space- and thermally-constrained applications such as data center PSUs and 5G infrastructure.

FAQ

What is the maximum allowable case temperature for continuous operation?

The STPS10L45CG-TR supports continuous operation with case temperature (T_c) up to 135°C when delivering 10 A average current per device (5 A per diode) at 50% duty cycle. Exceeding this requires derating per Figure 2 in the datasheet, where ambient temperature and copper area directly impact thermal margin.

Can this part be used in non-isolated buck converter topologies?

Yes - its center-tap configuration is not required for buck operation. A1 and K terminals serve as the freewheeling path, while A2 remains unused or tied to ground. The low V_F and fast switching minimize losses in high-duty-cycle, low-V_OUT applications like CPU core supplies.

Does the D²PAK package require solder paste stencil optimization?

Yes - the large exposed copper tab demands controlled solder volume. ST recommends a 0.15 mm thick stencil with 80% area ratio openings for the tab pad to ensure void-free thermal attachment and mechanical reliability under thermal cycling per JESD22-A104.

How does the 2000 V DC insulation rating affect PCB layout?

The 2000 V DC isolation between the tab and leads permits direct mounting to a grounded metal chassis without insulating hardware. Layout must maintain ≥2.5 mm creepage distance from tab edges to any adjacent high-voltage trace, per IEC 62368-1 clearance requirements for functional insulation.