STMicroelectronics STPS15L45CBY-TR

Overview

STPS15L45CBY-TR from STMicroelectronics is a dual-center-tab AEC-Q101-qualified Schottky rectifier in DPAK package, rated for 45 V repetitive peak reverse voltage and 2 × 7.5 A average forward current per diode at T_c = 140 °C. It delivers low forward voltage drop (0.40 V typ. at 7.5 A, 125 °C), negligible switching losses, and avalanche capability-optimized for automotive DC/DC converters and reverse polarity protection.

For engineers reviewing the STPS15L45CBY-TR datasheet, STPS15L45CBY-TR pinout, STPS15L45CBY-TR application, or STPS15L45CBY-TR equivalent, key selection criteria include junction-to-case thermal resistance (2.4 °C/W total), dual-diode thermal coupling behavior, AEC-Q101 qualification status, and conduction loss equation (P = 0.29 × I_F(AV) + 0.023 × I_F(RMS)²).

Technical Context

This dual Schottky rectifier integrates two independent anode-cathode junctions sharing a common center tab (K–A1–A2–K configuration), enabling simultaneous or independent operation in high-frequency SMPS topologies. Its low Q_rr and absence of minority-carrier storage eliminate reverse recovery loss-critical for >100 kHz switching in automotive DC/DC stages.

Thermal design requires explicit handling of inter-diode coupling: power dissipated in Diode 2 raises Diode 1's junction temperature via R_th(c) = 0.7 °C/W, as defined in Table 2. Maximum junction temperature is limited to 150 °C, with derated avalanche power (266 W at 10 µs, T_j = 125 °C) validated per AEC-Q101 stress test conditions.

Key Specifications

Pinout & Package

Package: DPAK (TO-252), surface-mount, single-row 3-lead outline with dual cathode tabs (K) and two anode terminals (A1, A2). Center tab is electrically isolated and thermally connected to both cathodes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with NSS15D45MC and VS-15BQ040-M3, STPS15L45CBY-TR uniquely combines AEC-Q101 qualification, dual-diode DPAK integration, 45 V rating, and sub-0.45 V V_F at 125 °C-making it the only option meeting full automotive SMPS requirements in compact SMT form factor.

Availability

STPS15L45CBY-TR is available at Aetrix Electronics and suitable for automotive DC/DC converters, reverse polarity protection circuits, and freewheeling diode applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for STPS15L45CBY-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.

This device belongs to ST's Automotive Power Schottky Rectifier product line, engineered specifically for high-efficiency, high-reliability rectification in 12 V/24 V/48 V automotive subsystems where thermal performance and AEC-Q101 compliance are mandatory.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The absolute maximum junction temperature is 150 °C, as specified in Table 1. Operation above this limit risks permanent degradation of Schottky barrier integrity and accelerated parametric drift. Derating is required above T_c = 140 °C, where I_F(AV) per diode drops linearly to zero at 150 °C junction temperature.

How is the dual-diode thermal coupling quantified in layout design?

Thermal coupling between diodes is modeled using R_th(c) = 0.7 °C/W (Table 2): power dissipated in Diode 2 raises Diode 1's junction temperature by ΔT = P₂ × 0.7 °C. Layout must ensure symmetric copper area under both K tabs and avoid localized hot spots that exceed the 2.4 °C/W total R_th(j-c) limit.

Does STPS15L45CBY-TR support paralleling of its two diodes for higher current?

Yes-both diodes share the same V_F characteristics and thermal environment, enabling safe current sharing up to 15 A total (7.5 A per diode) when mounted on a common heatsink. No external balancing resistors are needed due to matched forward voltage curves across temperature and current.

What is the recommended PCB footprint for optimal thermal performance?

The recommended DPAK footprint (Figure 10) specifies 6.3 mm × 10.7 mm copper pad with ≥25 cm² total thermal plane connected via ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch). This achieves R_th(j-a) ≈ 70 °C/W, allowing full 7.5 A per diode at T_a = 85 °C ambient.