Diodes Incorporated STPS1640

Overview

STPS1640 from Diodes Incorporated is a 400V, 16A dual common-cathode super-fast rectifier diode in ITO-220AB package, rated for 100A non-repetitive surge current and delivering 1.3V forward voltage at 8A/25°C. It serves as primary output rectification in high-frequency SMPS and DC-DC converters where low conduction loss and fast recovery (35ns) are critical.

For engineers reviewing the STPS1640 datasheet, STPS1640 pinout, STPS1640 application, or STPS1640 equivalent, key selection criteria include peak reverse voltage (400V), average current per leg (8A), thermal resistance junction-to-case (5°C/W), reverse recovery time (35ns), and RoHS-compliant matte tin-plated leads.

Technical Context

This dual-diode configuration shares a common cathode terminal, enabling synchronous or interleaved rectification topologies. Its glass-passivated die construction ensures stable performance under thermal cycling and high dv/dt stress typical in flyback and forward converters.

The device operates across -55°C to +150°C junction temperature range with 5°C/W typical R_θJC, supporting direct mounting to heatsinks. Reverse leakage remains ≤10µA at 400V/25°C and ≤500µA at 400V/100°C, minimizing standby power loss.

Key Specifications

Pinout & Package

Package: ITO-220AB (Type WX2), molded plastic with UL 94V-0 rating, matte tin-plated leads, 1.558g mass. Mounting via center tab (cathode) to heatsink.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage super-fast rectifier applications.

Compared with STTH1604DI and VS-16EWH04FN-M3, the STPS1640 balances low VF (1.30V), fast t_RR (35ns), and compact ITO-220AB thermal performance (5°C/W), making it optimal for space-constrained 200–300kHz SMPS designs requiring field-proven reliability.

Availability

STPS1640 is available at Aetrix Electronics and suitable for server power supplies, telecom DC-DC converters, and industrial motor drive auxiliary supplies requiring stable component supply and long-term manufacturability.

Supply support for STPS1640 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

The STPS1640 belongs to Diodes' high-voltage super-fast rectifier product line, engineered specifically for high-efficiency, high-frequency AC/DC and DC/DC conversion in computing, communications, and industrial power systems.

FAQ

What is the maximum junction temperature for continuous operation?

The STPS1640 has an operating junction temperature range of -55°C to +150°C. Continuous operation at +150°C requires thermal design ensuring junction temperature does not exceed this limit under worst-case load and ambient conditions, verified using its 5°C/W R_θJC and measured case temperature.

Is the STPS1640 suitable for automotive applications?

The STPS1640 is not AEC-Q101 qualified. While it meets RoHS and halogen-free requirements, Diodes explicitly states that automotive-grade versions require separate qualification (PPAP, IATF 16949 manufacturing, AEC-Q100/101 testing); this part is intended for industrial and commercial power applications only.

How is the common-cathode configuration implemented physically?

The cathode is internally connected to the metal tab (heat slug) of the ITO-220AB package. Leads 1 and 2 are isolated anodes. The tab must be electrically insulated from the heatsink unless the cathode node is at system ground potential, as confirmed by circuit topology analysis.

What is the recommended PCB layout for thermal performance?

Maximize copper area connected to the cathode tab using ≥2oz copper and multiple thermal vias to inner-layer planes. Mount directly to a finned aluminum heatsink per JESD-51 test setup (15mm × 12mm plate + 170mm × 169mm × 44.7mm fin stack). Avoid solder mask over thermal pads to ensure low R_θJA.