STMicroelectronics STPS1H100AFN

Overview

STPS1H100AFN from STMicroelectronics is a 100 V, 1 A surface-mount Schottky rectifier in SMA Flat Notch package, optimized for high-frequency DC/DC converters and LED lighting power supplies. It delivers low forward voltage drop (0.62 V max at 1 A, 125 °C), negligible switching losses, and avalanche-rated operation up to 108 W (10 µs pulse). Its 175 °C maximum junction temperature supports compact thermal design in space-constrained telecom adapters.

For engineers reviewing the STPS1H100AFN datasheet, STPS1H100AFN pinout, STPS1H100AFN application, or STPS1H100AFN equivalent, key selection criteria include reverse leakage current (<0.5 mA at 125 °C), thermal resistance (20 °C/W junction-to-lead), and ECOPACK2 halogen-free compliance - all critical for high-reliability, thermally dense power stages.

Technical Context

This Schottky rectifier uses a planar silicon structure with metal-semiconductor junction to eliminate minority-carrier storage delay, enabling zero reverse recovery time and minimal switching loss in 100–500 kHz SMPS topologies. Its low VF/IR trade-off is achieved via controlled barrier height and optimized doping profile.

The device is rated for repetitive peak reverse voltage of 100 V and surge non-repetitive forward current of 50 A (10 ms sinusoidal), with specified avalanche capability under transient overvoltage conditions. Thermal performance is defined by R_th(j-l) = 20 °C/W and T_j(max) = 175 °C, supporting operation without forced cooling in SMB/SMA Flat Notch footprints.

Key Specifications

Pinout & Package

STPS1H100AFN is housed in an SMA Flat Notch surface-mount package with cathode indicated by a band. The package features enhanced thermal conduction via notched lead geometry and optimized copper pad layout per Figure 20 in DS1228 Rev 8.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SB1100-TB and VS-1EH100-M3/5BT, STPS1H100AFN uniquely combines 20 °C/W thermal resistance, 108 W avalanche rating, and 0.62 V V_F in SMA Flat Notch - delivering superior power density and transient robustness in thermally constrained, high-reliability DC/DC stages.

Availability

STPS1H100AFN is available at Aetrix Electronics and suitable for LED lighting power supplies, telecom DC/DC converters, and USB-C PD adapters requiring stable component supply, halogen-free compliance, and high-temperature reliability.

Supply support for STPS1H100AFN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

STPS1H100AFN belongs to ST's high-efficiency Schottky rectifier product line, engineered specifically for miniaturized, high-frequency switched-mode power supplies where low conduction loss and thermal resilience are critical.

FAQ

What is the maximum allowable PCB copper area for optimal thermal performance of STPS1H100AFN?

Per Figure 20 in DS1228 Rev 8, the recommended SMA Flat Notch footprint uses two 1.20 mm × 5.52 mm copper pads (total 13.2 mm² per lead). Increasing each pad to ≥20 mm² reduces R_th(j-a) from ~50 °C/W to ≤35 °C/W, enabling 1 A operation at 70 °C ambient without airflow.

Does STPS1H100AFN support reflow soldering per JEDEC J-STD-020?

Yes. STPS1H100AFN is qualified for lead-free reflow per JEDEC J-STD-020D, with peak temperature of 260 °C for ≤30 seconds. Its ECOPACK2 epoxy meets UL94 V0 flammability rating and withstands three reflow cycles without delamination or parameter shift.

How does the SMA Flat Notch package improve thermal performance over standard SMA?

The SMA Flat Notch package reduces R_th(j-l) to 20 °C/W (vs. 30 °C/W for standard SMA) by increasing lead cross-section and adding notch geometry that enhances copper adhesion and lateral heat spreading. This allows 17% higher power dissipation before reaching T_j(max) = 175 °C.

Is STPS1H100AFN suitable for reverse polarity protection in 12 V automotive body electronics?

No. While rated for 100 V reverse voltage, STPS1H100AFN is not AEC-Q101 qualified and lacks automotive-grade screening (e.g., HTOL, temperature cycling). Its 175 °C T_j(max) exceeds automotive under-hood requirements, but qualification data is absent - use ST's AEC-Q101-certified STPS1L60S instead.