STMicroelectronics STPS2545CG

Overview

STPS2545CG from STMicroelectronics is a dual-center-tab Schottky rectifier optimized for high-frequency DC-DC converters and switch-mode power supplies. It delivers 2 × 12.5 A average forward current per diode, 45 V repetitive peak reverse voltage, 0.50 V typical forward voltage at 12.5 A/125 °C, and operates up to 175 °C junction temperature - enabling efficient low-voltage freewheeling in server VRMs and telecom POL modules.

For engineers reviewing the STPS2545CG datasheet, STPS2545CG pinout, STPS2545CG application, or STPS2545CG equivalent, key selection criteria include thermal resistance (1.6 °C/W per diode, junction-to-case), avalanche capability (345 W, 10 µs pulse), dual-diode isolation, D²PAK package mounting requirements, and conduction loss modeling using P = 0.42 × IF(AV) + 0.012 × IF²(RMS).

Technical Context

This dual Schottky rectifier integrates two independent anode-cathode junctions sharing a common cathode tab in a single D²PAK (TO-263) surface-mount package. Each diode supports 12.5 A average forward current at TC = 160 °C with negligible reverse recovery charge and < 0.57 V max VF at 12.5 A/125 °C.

Thermal design relies on validated junction-to-case resistance (1.6 °C/W per diode) and coupling resistance (0.6 °C/W between diodes), enabling accurate ΔTj calculation when both diodes conduct simultaneously - critical for synchronous buck output stage layout and heatsink sizing in high-density power modules.

Key Specifications

Pinout & Package

D²PAK (TO-263) package with exposed cathode tab (pin 1–2: anodes; pin 3: common cathode). Mounting requires solder reflow profile compatible with JEDEC J-STD-020, and mechanical torque not exceeding 0.7 N·m if used with heatsink screws.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schottky rectifier applications.

Compared with STPS2545CT and VS-25CPH04-M3, STPS2545CG uniquely provides dual-diode integration in D²PAK with per-diode thermal metrics and avalanche-rated operation - simplifying layout, reducing component count, and enabling precise thermal co-design in space-constrained, high-reliability power stages.

Availability

STPS2545CG is available at Aetrix Electronics and suitable for server VRMs, telecom POL modules, industrial motor drive PSUs, and automotive ADAS power supplies requiring stable component supply across multi-year production cycles.

Supply support for STPS2545CG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

The STPS series targets high-efficiency, high-frequency power conversion - specifically engineered for Schottky rectification in SMPS, DC-DC converters, and freewheeling applications where low VF, fast switching, and thermal robustness are critical.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The absolute maximum operating junction temperature is 175 °C, verified per Table 2 of the official datasheet. Operation at this limit requires strict thermal management - including minimum 100 cm² copper area under the cathode tab and ambient temperature ≤ 85 °C - to prevent thermal runaway under full 25 A device current.

Can STPS2545CG be used in synchronous rectification topologies?

No - STPS2545CG is a passive Schottky rectifier and cannot replace actively controlled MOSFETs in synchronous rectification. Its zero reverse recovery enables high-frequency operation, but gate drive control and body diode conduction timing are absent. Use only in non-synchronous or quasi-resonant flyback configurations.

Is the D²PAK footprint compatible with standard IPC-7351B land patterns?

Yes - the D²PAK outline in Figure 11 (DocID8736 Rev 5, page 9) matches IPC-7351B "SOT223-3" generic footprint with 8.6–9.35 mm D dimension and 10.0–10.55 mm E width. Recommended copper pad size is 8.0 × 10.0 mm with 0.5 mm solder mask expansion for optimal thermal transfer and reflow wetting.

How does the dual-diode configuration affect thermal performance compared to two discrete diodes?

Thermal coupling between diodes adds 0.6 °C/W (Rth(c)) to the junction-to-case path of the hotter diode when both conduct simultaneously. This is explicitly modeled in Table 3: ΔTj(diode 1) = P(diode1) × 1.6 + P(diode 2) × 0.6 - enabling accurate worst-case junction temperature prediction without oversizing heatsinks.