STMicroelectronics STPS30H60CG

Overview

STPS30H60CG from STMicroelectronics is a dual-center-tab Schottky rectifier in D2PAK package, rated for 60 V repetitive peak reverse voltage and 2 × 15 A average forward current per diode at Tc = 155 °C, with typical forward voltage drop of 0.535 V at 7.5 A and 25 °C. It is avalanche-rated, operates up to 175 °C junction temperature, and targets high-frequency switch-mode power supplies in notebook/LCD adapters and desktop SMPS.

For engineers reviewing the STPS30H60CG datasheet, STPS30H60CG pinout, STPS30H60CG application, or STPS30H60CG equivalent, key selection criteria include its low VF/IR trade-off, thermal resistance (Rth(j-c) = 0.8 °C/W total), avalanche energy capability (10.2 kW·µs), and D2PAK mounting compatibility with FR4 PCB copper area optimization.

Technical Context

This dual-diode Schottky rectifier integrates two independent anode-cathode junctions sharing a common cathode tab in a single D2PAK surface-mount package. Its design emphasizes conduction loss minimization via low forward voltage (VF ≤ 0.69 V @ 15 A, 125 °C) and controlled leakage (IR ≤ 25 mA @ 125 °C, 60 V).

Thermal performance is defined by junction-to-case resistance of 0.8 °C/W (total package), enabling high-power density operation when mounted on ≥35 cm² copper area. Avalanche rating supports transient overvoltage resilience without external clamping in SMPS secondary-side rectification.

Key Specifications

Pinout & Package

STPS30H60CG uses a 3-terminal D2PAK (TO-263) surface-mount package with center-tab cathode configuration. The package features a single exposed metal tab (cathode) and two isolated anode leads (A1, A2), optimized for thermal conduction through the PCB copper pour.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schottky rectifier applications.

Compared with VS-30CPH06-M3 and MBR30H60CT, STPS30H60CG delivers superior thermal performance (0.8 °C/W vs. ≥1.5 °C/W), lower conduction loss (0.535 V vs. ≥0.72 V), and extended temperature capability (175 °C vs. ≤150 °C), making it optimal for high-density, high-efficiency adapter designs.

Availability

STPS30H60CG is available at Aetrix Electronics and suitable for notebook AC-DC adapters, LCD monitor power supplies, and industrial 24 V DC-DC converters requiring stable component supply across multi-year production cycles.

Supply support for STPS30H60CG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.

The STPS30H60CG belongs to ST's high-efficiency power rectifier product line, engineered specifically for high-frequency SMPS secondary-side rectification where low VF, low IR, and robust avalanche capability are critical.

FAQ

What is the maximum continuous current per diode for STPS30H60CG at 100 °C case temperature?

At Tc = 100 °C, the maximum average forward current per diode is 13.2 A, derived from linear derating of the 15 A rating at 155 °C using the curve in Figure 2 of the datasheet. This assumes δ = 0.5 duty cycle and proper PCB copper thermal management.

Can STPS30H60CG replace a single-diode Schottky in existing designs?

Yes, but only if the circuit uses only one anode-A1 or A2-while leaving the other unconnected and insulated. The common cathode (K) must remain the sole output node; unused anode must be electrically isolated to prevent parasitic conduction paths.

Is STPS30H60CG RoHS-compliant and halogen-free?

Yes, STPS30H60CG is manufactured in ST's ECOPACK®2-compliant D2PAK package, meeting RoHS Directive 2011/65/EU and IEC 61249-2-21:2011 for brominated flame retardants and chlorine content, with full compliance documentation available on st.com.

What is the recommended minimum copper area for thermal relief on FR4 PCB?

ST recommends ≥35 cm² of 2 oz copper (70 µm) connected directly to the cathode tab for Rth(j-a) ≤ 15 °C/W. For ambient temperatures up to 70 °C and 30 W dissipation, a 50 cm² copper pour with thermal vias to inner layers achieves <40 °C junction rise.