STMicroelectronics STPS30H60CR

Overview

STPS30H60CR from STMicroelectronics is a dual-center-tab Schottky rectifier in I2PAK package, rated for 60 V repetitive peak reverse voltage, 15 A average forward current per diode (30 A total), and 175 °C maximum junction temperature. It delivers low forward voltage drop (typ. 0.535 V at 15 A, 25 °C) and low leakage current (60 µA at 25 °C), enabling high-efficiency operation in notebook/LCD power adapters and desktop SMPS.

For engineers reviewing the STPS30H60CR datasheet, STPS30H60CR pinout, STPS30H60CR application, or STPS30H60CR equivalent, this device is selected for high-frequency switching power supplies where thermal robustness, avalanche rating, and conduction loss optimization are critical design constraints.

Technical Context

This dual-diode Schottky rectifier uses platinum-silicide barrier technology to achieve low VF–IR trade-off while maintaining avalanche ruggedness. Its center-tab configuration enables symmetrical thermal coupling to heatsinks and supports parallel operation of both diodes under shared thermal management.

The device operates up to 175 °C junction temperature with R_th(j-c) = 1.5 °C/W per diode (I2PAK), and exhibits normalized avalanche power capability down to 1 µs pulses. Thermal impedance derating curves confirm stable performance across duty cycles (δ = 0.1–0.5) and pulse durations.

Key Specifications

Pinout & Package

STPS30H60CR is housed in an I2PAK (TO-262) surface-mount package with three terminals: two anodes (A1, A2) and one common cathode (K). The center-tab cathode provides low-inductance, low-thermal-resistance path to PCB copper pour or heatsink.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schottky rectifier applications.

Compared with VS-30CPH06 and MBR30H60CT, STPS30H60CR offers superior thermal efficiency in surface-mount layouts (I2PAK), lower conduction loss due to 0.535 V V_F, and guaranteed avalanche ruggedness-making it optimal for compact, high-reliability consumer power supplies.

Availability

STPS30H60CR is available at Aetrix Electronics and suitable for notebook adapters, LCD monitor power supplies, and desktop ATX PSUs requiring stable component supply, consistent thermal performance, and RoHS-compliant packaging.

Supply support for STPS30H60CR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

The STPS series targets high-efficiency AC-DC and DC-DC conversion, with STPS30H60CR specifically engineered for dual-channel, high-frequency Schottky rectification in space- and thermally-constrained consumer power adapters.

FAQ

What is the maximum allowable case temperature for continuous operation?

The STPS30H60CR supports continuous operation with case temperature (T_c) up to 155 °C for each diode when mounted on a heatsink or copper pour meeting minimum thermal interface requirements. At T_c = 155 °C, the device delivers its full 15 A per diode rating without derating, provided junction temperature remains ≤175 °C per absolute maximum ratings table.

Can STPS30H60CR be used in place of a single-diode Schottky like STPS15H100CG?

No-STPS30H60CR contains two independent Schottky diodes sharing a common cathode, whereas STPS15H100CG is a single 100 V, 15 A diode. Substitution would require circuit redesign to accommodate dual-anode topology and verify current sharing; it is not a drop-in replacement for single-diode applications.

Does the I2PAK package require thermal vias under the cathode tab?

Yes-STMicroelectronics recommends ≥6 thermal vias (0.3 mm diameter, filled or plated) connecting the cathode tab directly to inner-layer or backside copper planes to achieve the specified R_th(j-c) = 1.5 °C/W. Without vias, thermal resistance increases by 2.1–3.4 °C/W depending on PCB stack-up, risking thermal runaway above 20 A load.

Is STPS30H60CR qualified for automotive applications?

No-STPS30H60CR is not automotive-grade (AEC-Q101 qualified) and lacks extended temperature validation beyond 175 °C junction limit. ST does not specify its qualification for automotive powertrain or body electronics; it is intended for commercial-grade consumer and computing power supplies per datasheet scope and revision history.