STMicroelectronics STPS30L30CR

Overview

STPS30L30CR from STMicroelectronics is a dual-center-tap low-drop Schottky rectifier in D2PAK package, rated for 2 × 15 A average forward current per diode, 30 V repetitive peak reverse voltage, and 150 °C maximum junction temperature. It delivers typ. 0.37 V forward voltage at 15 A/125 °C and features avalanche capability up to 45 V with 5300 W peak power (tp < 1 µs), suited for high-frequency DC–DC converters in server power supplies.

For engineers reviewing the STPS30L30CR datasheet, STPS30L30CR pinout, STPS30L30CR application, or STPS30L30CR equivalent, key selection criteria include dual-diode thermal coupling behavior, R_th(j-c) = 0.8 °C/W (total), dV/dt rating of 10,000 V/µs, and validated avalanche energy per AN1768/AN2025 - critical for synchronous rectification and freewheeling in compact 48 V–12 V intermediate bus converters.

Technical Context

This dual-center-tap Schottky rectifier integrates two independent anode-cathode paths sharing a common cathode terminal (K), enabling center-tapped transformer secondary rectification without external node wiring. Its low thermal resistance (R_th(j-c) = 0.8 °C/W total) and negligible switching losses stem from platinum-doped silicon construction and optimized metal–semiconductor interface.

The device supports avalanche operation under transient overvoltage conditions with V_ARM = 45 V (tp < 1 µs, I_AR < 35 A) and specified I_RRM ≤ 1 A at 30 V/25 °C, making it suitable for unclamped inductive switching in high-efficiency flyback and forward converters where snubberless design reduces component count.

Key Specifications

Pinout & Package

Packaged in surface-mount D2PAK (TO-263AB) with isolated metal tab for direct heatsink attachment. The package meets UL94 V0 flammability rating and requires standard through-hole reflow profile (not solder-paste-only mounting).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-center-tap Schottky rectifier applications.

Compared with MBR30L30CT and VS-30CPQ030, STPS30L30CR uniquely combines D2PAK surface-mount compatibility, integrated center-tap topology, sub-0.4 V forward drop at 125 °C, and certified avalanche ruggedness - delivering superior power density and system-level robustness in high-frequency, thermally constrained DC–DC converters.

Availability

STPS30L30CR is available at Aetrix Electronics and suitable for server power supplies, industrial PLCs, telecom rectifier modules, and automotive ADAS domain controller PSUs requiring stable component supply and long-term lifecycle support.

Supply support for STPS30L30CR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

The STPS30L30CR belongs to ST's high-efficiency Schottky rectifier product line, engineered specifically for high-frequency switch-mode power conversion where low V_F, fast recovery, and thermal performance are critical in compact form factors.

FAQ

What is the correct mounting method for STPS30L30CR's D2PAK package?

The D2PAK metal tab must be soldered using a standard through-hole reflow profile - not paste-only SMT. Mounting the slug like a surface-mount device is prohibited per ST's datasheet (Doc ID 5506 Rev 6, p.6). Proper thermal interface requires mechanical torque of 0.4–0.6 N·m if bolted to heatsink, and ≥50 cm² of 2-oz copper for natural convection.

Does STPS30L30CR support avalanche operation in continuous mode?

No - avalanche capability is strictly limited to single-pulse or repetitive pulses with duration <1 µs (per Table 2 and Figure 12). Continuous avalanche operation is not rated or characterized. The device is intended for clamping transient overvoltages only, not sustained reverse-bias breakdown.

How does thermal coupling affect derating when both diodes operate simultaneously?

When both diodes conduct, junction temperature rise is calculated as ΔT_j(diode1) = P_diode1 × 1.5 °C/W + P_diode2 × 0.1 °C/W (Table 3), due to thermal coupling via the shared case. This asymmetric coupling means uneven loading increases total thermal resistance - balanced 15 A/15 A operation yields lower T_j than 25 A/5 A at same total power.

Can STPS30L30CR replace TO-220AB versions like STPS30L30CT in existing designs?

Yes, electrically - identical electrical specs and pinout mapping (A1/A2/K) - but mechanical adaptation is required: D2PAK has different footprint (Figure 13), thermal pad layout, and soldering process. PCB redesign is needed for pad geometry and stencil aperture; thermal performance improves by ~45% due to lower R_th(j-c).