STMicroelectronics STPS30L60CG-TR
- Part No.:
- STPS30L60CG-TR
- Manufacturer:
- STMicroelectronics
- Category:
- Diode Arrays
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
STPS30L60CG-TR.pdf
- Description:
- DIODE ARRAY SCHOTT 60V 15A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:845
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STPS30L60CG-TR from STMicroelectronics is a dual-center-tap Schottky rectifier in D2PAK package, rated for 60 V repetitive peak reverse voltage and 30 A total average forward current (15 A per diode), with maximum forward voltage of 0.56 V at 15 A and 125 °C junction temperature. It delivers low conduction loss and negligible switching losses for high-frequency DC–DC converters and switched-mode power supplies.
For engineers reviewing the STPS30L60CG-TR datasheet, STPS30L60CG-TR pinout, STPS30L60CG-TR application, or STPS30L60CG-TR equivalent, key selection criteria include its 1.5 °C/W junction-to-case thermal resistance (per diode), avalanche-rated 80 V peak voltage, 230 A non-repetitive surge capability, and suitability for thermally constrained high-efficiency power stages.
Technical Context
This dual-diode Schottky rectifier integrates two independent anode-cathode paths sharing a common cathode terminal (center-tap configuration), enabling synchronous rectification in half-bridge or full-wave topologies. Its low dV/dt rating of 10,000 V/µs supports fast-switching operation without spurious turn-on.
The device features specified avalanche capability (7800 W peak, 80 V, 1 µs pulse) and is characterized across −65 to +175 °C storage range and up to 150 °C maximum operating junction temperature, with thermal derating defined for δ = 0.5 duty cycle at Tc = 130 °C (TO-220AB/D2PAK/I2PAK/TO-247 variants).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 60 V - Maximum repetitive reverse blocking voltage per diode; defines safe operating limit in flyback or LLC resonant converter secondary side. |
| IF(AV) per diode | 15 A - Average forward current rating per diode at Tc = 130 °C, δ = 0.5; determines continuous output current capability in center-tap transformer designs. |
| VF (max) | 0.56 V at 15 A, 125 °C - Peak forward voltage drop; directly sets conduction loss (P ≈ 0.42×IF(AV) + 0.009×IF(RMS)²) in high-efficiency SMPS. |
| Rth(j-c) per diode | 1.5 °C/W - Junction-to-case thermal resistance (D2PAK); enables precise heatsink sizing for thermal management under 30 A total load. |
| IFSM | 230 A - Non-repetitive surge current (10 ms, sinusoidal); supports inrush and transient overload tolerance in industrial power supplies. |
| VARM | 80 V - Maximum repetitive avalanche voltage (tp < 1 µs); allows controlled energy absorption during inductive switching events without failure. |
| Tj(max) | 150 °C - Maximum junction temperature; sets upper thermal boundary for reliability modeling and derating curves in continuous operation. |
Pinout & Package
STPS30L60CG-TR is housed in a surface-mount D2PAK (TO-263AB) package with three terminals: two anodes (A1, A2) and one shared cathode (K). The package features a copper-exposed thermal pad on the underside for direct PCB thermal coupling and meets UL94 V0 flammability rating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Anode 1 | First Schottky diode anode; connects to primary-side switch node in center-tap forward converter or leg 1 of half-bridge secondary. |
| A2 | Anode 2 | Second Schottky diode anode; connects to complementary switch node, enabling dual-path rectification with shared cathode return. |
| K | Common Cathode | Single low-impedance output node; serves as DC output rail connection point, minimizing layout parasitics in high-current paths. |
Key Features
| Feature | Design Value |
|---|---|
| Low forward voltage drop | 0.56 V max at 15 A/125 °C reduces conduction loss by >30% vs. standard silicon rectifiers in 12–48 V output rails. |
| Negligible switching losses | Zero minority-carrier storage enables hard-switching at >500 kHz without reverse recovery tail, eliminating snubber requirements. |
| Avalanche capability | Rated for 7800 W peak avalanche power (80 V, 1 µs) - permits robust operation during voltage transients in unregulated or loosely coupled transformers. |
| Low thermal resistance | 1.5 °C/W j-c (per diode) in D2PAK allows ≥25 W dissipation with ≤40 °C temperature rise above case, supporting compact heatsinking. |
| Center-tap dual-diode topology | Integrated A1–K and A2–K paths simplify PCB layout for push-pull, forward, and full-wave center-tap converters versus discrete dual-diode solutions. |
Applications
| Server VRM Secondary Rectification | Industrial DC–DC Converter Output Stage |
|---|---|
|
Use Scenario: High-current, low-voltage output stage (e.g., 12 V → 1.2 V @ 100+ A) in server voltage regulator modules using center-tap transformer topology. IC Role / Device Role / Timing Role: Dual Schottky rectifier providing synchronous rectification path with shared cathode return to minimize conduction loss and layout inductance. Use Value: 0.56 V VF at 125 °C enables >92% efficiency at full load while maintaining junction temperature below 130 °C with standard 2-oz copper thermal pads. |
Use Scenario: 48 V input to 12/24 V isolated DC–DC converter in programmable logic controller (PLC) power supply with tight thermal envelope. IC Role / Device Role / Timing Role: Center-tap secondary-side rectifier handling bidirectional current flow during PWM dead-time intervals in phase-shifted full-bridge design. Use Value: Avalanche-rated 80 V VARM clamps leakage inductance spikes without external TVS, reducing BOM count and improving reliability under load-step transients. |
| Telecom Rectifier Module | Renewable Energy Inverter Auxiliary Supply |
|
Use Scenario: -48 V telecom rectifier module requiring high reliability and low maintenance over 15-year field life, operating continuously at 60 °C ambient. IC Role / Device Role / Timing Role: Primary output rectifier in forward-converter-derived auxiliary supply powering control circuitry and gate drivers. Use Value: 150 °C Tj(max) and 1.5 °C/W Rth(j-c) support derated operation at 85% load with 20 °C safety margin, extending MTBF beyond 1 million hours. |
Use Scenario: Auxiliary 24 V supply in solar string inverter, powered from high-voltage DC bus via isolated flyback, subject to outdoor thermal cycling. IC Role / Device Role / Timing Role: Dual-path Schottky rectifier in center-tap secondary winding, delivering stable bias power to isolation amplifiers and microcontroller peripherals. Use Value: −65 to +175 °C Tstg and 230 A IFSM ensure survivability during cold-start surges and desert-temperature excursions without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-center-tap Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH06-M3 | D2PAK package, same 60 V VRRM, but 0.62 V VF max at 15 A/125 °C and 2.0 °C/W Rth(j-c). | Higher conduction loss and thermal resistance reduce efficiency by ~1.2% and require larger heatsink area in space-constrained designs. | Select when legacy qualification or Vishay supply chain alignment is required; verify thermal margin with revised Rth and VF. |
| ON Semiconductor MBR3060CT | TO-220AB package (not surface-mount), identical 60 V/30 A rating, but 0.72 V VF max and no specified avalanche rating. | Through-hole mounting increases assembly cost and limits high-density PCB layouts; absence of avalanche spec restricts use in unclamped inductive circuits. | Prefer only for through-hole legacy systems where D2PAK rework is prohibited; avoid in new designs requiring surge robustness or SMT scalability. |
Compared with VS-30CPH06-M3 and MBR3060CT, STPS30L60CG-TR offers the lowest VF and best thermal performance in D2PAK, making it optimal for high-efficiency, surface-mount power supplies where board space and thermal headroom are critical constraints.
Availability
STPS30L60CG-TR is available at Aetrix Electronics and suitable for server VRMs, industrial DC–DC converters, telecom rectifier modules, and renewable energy inverter auxiliary supplies requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production lots.
Supply support for STPS30L60CG-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
STPS30L60CG-TR belongs to ST's Power Schottky Rectifier product line, engineered specifically for high-frequency, high-efficiency power conversion in SMPS, DC–DC converters, and industrial power supplies where low VF, thermal robustness, and avalanche ruggedness are essential.
FAQ
What is the thermal pad soldering requirement for STPS30L60CG-TR in D2PAK?
The D2PAK package features an exposed thermal pad on the underside that must be soldered to a minimum 2 cm² copper area on the PCB using a grid pattern of ≥9 thermal vias (0.3 mm diameter, filled or capped) to achieve the specified 1.5 °C/W junction-to-case resistance. Insufficient thermal pad connection raises junction temperature by up to 25 °C at full load.
Does STPS30L60CG-TR support parallel operation of both diodes in a single-output configuration?
Yes - the dual-center-tap structure allows simultaneous conduction of both diodes into the common cathode (K) terminal, enabling 30 A total average current delivery in full-wave center-tap topologies. Thermal derating must account for combined power dissipation (Ptot = Pdiode1 + Pdiode2) and shared case temperature rise.
How does the avalanche rating of STPS30L60CG-TR impact system-level protection design?
The 80 V VARM and 7800 W PARM ratings allow the device to safely absorb inductive energy during MOSFET turn-off without external clamping, provided the avalanche energy E = ∫V×I dt remains within the curve in Figure 12. This eliminates need for TVS diodes in well-designed transformer-coupled topologies, reducing component count and cost.
Can STPS30L60CG-TR replace TO-220AB variants like STPS30L60CT in existing designs?
No - STPS30L60CG-TR uses D2PAK (surface-mount) packaging versus TO-220AB (through-hole), requiring PCB footprint, stencil, and reflow profile changes. While electrically identical, mechanical incompatibility prevents drop-in replacement; thermal performance differs due to distinct Rth(j-c) paths and mounting methods.
STPS30L60CG-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io) (per Diode):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 600 mV @ 15 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 480 µA @ 60 V
- Operating Temperature - Junction:
- 150°C (Max)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
STPS30L60CG-TR FAQ
1.How can I place an order for STPS30L60CG-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STPS30L60CG-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STPS30L60CG-TR reliable?
The price and inventory of STPS30L60CG-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STPS30L60CG-TR is usually 5 days.
3.What payment methods are accepted for STPS30L60CG-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STPS30L60CG-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STPS30L60CG-TR?
STPS30L60CG-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STPS30L60CG-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STPS30L60CG-TR?
For technical support, including STPS30L60CG-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STPS30L60CG-TR requirements.
6.How does Aetrix verify that STPS30L60CG-TR is sourced from the original manufacturer or authorized distributors?
All STPS30L60CG-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STPS30L60CG-TR meets industry standards.
7.What is the process for return or replacement of STPS30L60CG-TR?
All STPS30L60CG-TR units undergo pre-shipment inspection (PSI). If there is an issue with STPS30L60CG-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STPS30L60CG-TR part is unused and in its original packaging.
Return procedure for STPS30L60CG-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STPS30L60CG-TR Tags

-
BAV99-7-F
Diodes Incorporated

-
BAT54C-7-F
Diodes Incorporated

-
BAV99,215
Nexperia USA Inc.

-
BAT54SLT1G
onsemi

-
BAV70LT1G
onsemi

-
BAT54CLT1G
onsemi

-
BAT54S-7-F
Diodes Incorporated

-
BAV99LT1G
onsemi

-
BAT54S,215
Nexperia USA Inc.

-
BAS40-04LT1G
onsemi

-
MMBD1503-TP
Micro Commercial Co

-
BAV99WT1G
onsemi
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

