STMicroelectronics STPS30SM100SR

Overview

STPS30SM100SR from STMicroelectronics is a 30 A average forward current, 100 V repetitive peak reverse voltage Schottky rectifier in I²PAK package, optimized for high-frequency switch-mode power supplies. It delivers low forward voltage drop (typ. 0.63 V at 30 A, 125 °C), avalanche-rated operation, and thermal robustness up to 150 °C junction temperature-enabling high-efficiency DC/DC conversion in notebook adapters and game station power supplies.

For engineers reviewing the STPS30SM100SR datasheet, STPS30SM100SR pinout, STPS30SM100SR application, or STPS30SM100SR equivalent, key selection criteria include its 1 °C/W junction-to-case thermal resistance, 400 A non-repetitive surge capability, ECOPACK®2 compliance, and validated performance across 25–125 °C operating range in high-current, high-frequency rectification roles.

Technical Context

This single-diode Schottky rectifier uses a planar silicon structure with metal-semiconductor junction to minimize forward conduction loss and eliminate minority-carrier storage delay. Its 100 V V_RRM rating supports primary-side rectification in 12–48 V output SMPS topologies, while the 150 °C T_j(max) enables compact heatsink designs under sustained 30 A load.

The device's low R_th(j-c) of 1 °C/W and 45 µA reverse leakage at 25 °C (rising to 45 mA at 125 °C) reflect trade-offs between conduction efficiency and thermal stability. Avalanche energy handling (1545 W peak, 10 µs pulse) provides transient overvoltage resilience without external snubbers in flyback or LLC resonant converters.

Key Specifications

Pinout & Package

STPS30SM100SR is housed in an I²PAK (TO-263AB) surface-mount package with three terminals: Cathode (pin 1), Anode (pin 2), and exposed thermal pad (pin 3, electrically connected to cathode). The package features UL 94 V-0 epoxy, 10.0–10.4 mm body width, and 13.0–14.0 mm length for PCB-level thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-30CPH01-M3 and MBR30100CT, STPS30SM100SR offers superior thermal efficiency (1 °C/W vs. ≥1.2 °C/W), lower conduction loss (0.63 V vs. ≥0.72 V), and guaranteed avalanche ruggedness-making it optimal for high-density, high-reliability 100 W-class adapters where thermal margin and transient resilience are critical.

Availability

STPS30SM100SR is available at Aetrix Electronics and suitable for desktop power supplies, LED lighting drivers, notebook adapters, and game station power supplies requiring stable component supply and consistent thermal performance across production volumes.

Supply support for STPS30SM100SR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

The STPSx0SM100S series targets high-efficiency AC-DC and DC-DC power conversion, emphasizing low-loss Schottky rectification for compact, thermally demanding adapter and PSU applications.

FAQ

What is the maximum allowable case temperature for continuous 30 A operation?

The datasheet specifies I_F(AV) = 30 A at T_c = 125 °C, meaning the case must be maintained at or below 125 °C for rated current. Exceeding this requires linear derating: at T_c = 100 °C, maximum I_F(AV) rises to ~38 A; at T_c = 80 °C, it reaches ~45 A. Thermal design must ensure case temperature measurement point remains within this limit under worst-case airflow and ambient conditions.

Can STPS30SM100SR replace a TO-220AB version in the same PCB layout?

No-STPS30SM100SR uses I²PAK (TO-263AB) packaging, which has different pad dimensions, thermal pad geometry, and lead pitch than TO-220AB. The I²PAK footprint requires a 9.75 mm × 12.20 mm land pattern with 2.54 mm pin spacing, whereas TO-220AB needs 15.5 mm × 10.4 mm with 2.54 mm × 4.95 mm mounting hole spacing. Mechanical redesign and requalification are mandatory for substitution.

How does the avalanche rating impact circuit protection design?

The 1545 W peak avalanche power rating (at 10 µs, T_j = 125 °C) means the device can safely absorb single-event inductive energy spikes-such as transformer leakage inductance kickback-without breakdown. This eliminates the need for external TVS diodes or RC snubbers in flyback converters operating below 100 kHz, simplifying BOM and improving reliability when surge currents remain within the 400 A I_FSM limit.

Is the thermal pad electrically isolated or connected to a specific terminal?

The exposed thermal pad (terminal 3) is electrically connected to the cathode (terminal 1), as confirmed in ST's package drawings and thermal test conditions (terminals 1 and 3 short-circuited). PCB layout must treat the pad as part of the cathode net-no isolation or floating connection is permitted. Soldering the pad to a cathode-coupled copper pour ensures both thermal and electrical integrity.