STMicroelectronics STPS3150UF
- Part No.:
- STPS3150UF
- Manufacturer:
- STMicroelectronics
- Category:
- Single Diodes
- Package:
- DO-221AA, SMB Flat Leads
- Datasheet:
-
STPS3150UF.pdf
- Description:
- DIODE SCHOTTKY 150V 3A SMBFLAT
- Quantity:
- Payment:

- Shipping:

Inventory:40,089
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STPS3150UF from STMicroelectronics is a 150 V, 3 A surface-mount Schottky power rectifier in SMB Flat package, optimized for high-frequency DC/DC converters and notebook adapters. It delivers a typical forward voltage of 0.63 V at 125 °C and 3 A, enabling low conduction loss and extended battery life in portable systems. Its 10 °C/W junction-to-lead thermal resistance supports compact thermal design in space-constrained consumer electronics.
For engineers reviewing the STPS3150UF datasheet, STPS3150UF pinout, STPS3150UF application, or STPS3150UF equivalent, key selection criteria include forward voltage at elevated temperature, surge current capability (80 A), thermal resistance under real PCB layout conditions, and ECOPACK2 compliance for RoHS- and REACH-compliant manufacturing.
Technical Context
This Schottky rectifier operates without minority-carrier storage delay, eliminating reverse recovery charge and associated switching losses-critical for >100 kHz SMPS topologies. Its low VF and negligible QRR enable high-efficiency operation in synchronous buck secondary-side rectification and AC-DC adapter PFC stages.
The device uses a planar silicon Schottky barrier structure with metal-silicon interface engineered for stable leakage performance up to 125 °C (max 0.6 mA IR). Thermal management relies on direct lead conduction: Rth(j-l) = 10 °C/W for SMB Flat mounting on 10 mm lead length, validated per AN5088 mounting guidelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 150 V - Maximum repetitive reverse voltage; sets safe operating margin for 24 V rail-derived 100–120 V DC bus applications. |
| IF(AV) | 3 A - Average forward current at TL = 150 °C; defines continuous output capability in thermally constrained SMB Flat layouts. |
| VF(typ.) | 0.63 V @ 3 A, 125 °C - Confirmed low conduction loss; reduces power dissipation by ~25% vs. comparable 0.85 V diodes at same load. |
| IFSM | 80 A - Non-repetitive surge current (10 ms sinusoidal); supports inrush tolerance in battery charger input stages. |
| Rth(j-l) | 10 °C/W - Junction-to-lead thermal resistance; enables accurate junction temperature prediction using measured lead temperature. |
| Tj(max) | 175 °C - Maximum junction temperature; allows operation in high-ambient environments like enclosed notebook adapters. |
| ECOPACK2 | Lead-free, halogen-free, RoHS/REACH compliant - Meets global environmental regulations without derating or process change. |
Pinout & Package
SMB Flat package: Surface-mount, cathode-banded, lead-free epoxy body (UL94 V0), dimensions 3.30–3.95 mm × 5.10–5.60 mm × 0.75–1.50 mm (L×W×H), weight 0.050 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to switch node or transformer secondary; low-inductance path minimizes ringing in high-dv/dt applications. |
| Cathode | Forward current exit / output reference | Banded end; ties to output capacitor ground or common return; critical for minimizing loop inductance in buck converter outputs. |
Key Features
| Feature | Design Value |
|---|---|
| Negligible switching losses | No reverse recovery charge (QRR ≈ 0); eliminates turn-off loss and EMI in >200 kHz converters. |
| Low forward voltage drop | VF = 0.63 V typ. @ 125 °C/3 A - directly reduces conduction loss by 0.66 W vs. 0.85 V alternative at same condition. |
| Low thermal resistance | Rth(j-l) = 10 °C/W - enables 3 A operation with <30 °C rise above lead temperature on standard FR4 PCB. |
| Surface-mount miniature package | SMB Flat footprint (5.84 mm × 3.44 mm) - saves >30% board area vs. DO-201AD while maintaining 80 A surge rating. |
| ECOPACK2 compliance | Halogen-free, Pb-free, RoHS-compliant - no requalification needed for automotive or industrial programs requiring strict material declarations. |
Applications
| LED Lighting Driver | Battery Charger Output Stage |
|---|---|
|
Use Scenario: Secondary-side rectification in isolated flyback LED drivers for commercial downlights. IC Role / Device Role / Timing Role: Schottky rectifier replacing synchronous MOSFET in cost-sensitive designs where gate drive complexity must be avoided. Use Value: 0.63 V VF reduces output rectification loss by 0.4 W at 2 A, improving driver efficiency from 89% to 91.5% and lowering heatsink requirements. |
Use Scenario: Output rectification in 19 V/3 A USB-C PD notebook chargers with 200 kHz LLC resonant topology. IC Role / Device Role / Timing Role: High-frequency freewheeling diode in synchronous rectifier auxiliary path during light-load burst mode. Use Value: Zero QRR prevents cross-conduction loss during dead-time transitions, sustaining >94% efficiency at 10% load. |
| DC/DC Converter Secondary | Notebook Adapter Input Bridge |
|
Use Scenario: Output rectifier in 12 V → 5 V/6 A buck converter for laptop motherboard VRMs. IC Role / Device Role / Timing Role: Low-VF discrete rectifier used in place of integrated FET+diode for thermal isolation and failure-mode control. Use Value: 10 °C/W Rth(j-l) allows direct thermal coupling to copper pour, limiting Tj to 115 °C at full load without forced air. |
Use Scenario: Input bridge rectification in universal-input (90–264 VAC) 65 W notebook adapters. IC Role / Device Role / Timing Role: Fast-recovery replacement for standard PN diodes in bridge legs to reduce switching loss during zero-crossing commutation. Use Value: 80 A IFSM withstands 100 A inrush peaks during cold-start, eliminating need for NTC thermistors in cost-optimized BOMs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-3EY15-M3 | VF = 0.72 V @ 3 A, 125 °C; Rth(j-l) = 15 °C/W; SMB package (not flat) | Higher conduction loss (+0.09 V) and thermal resistance limit use in thermally dense 65 W adapters | Select when legacy SMB footprint compatibility is required and 0.5 W extra loss is acceptable. |
| ON Semiconductor SB3150-TB | VF = 0.75 V @ 3 A, 25 °C; no 125 °C VF spec; Rth(j-l) not published; SMB package | Lacks high-temperature VF validation and thermal data, increasing design risk for sustained 125 °C ambient operation | Prefer only for non-thermal-critical 24 V industrial supplies where peak Tj stays below 100 °C. |
Compared with VS-3EY15-M3 and SB3150-TB, STPS3150UF provides the lowest verified VF at operating temperature and the only published 10 °C/W Rth(j-l), making it uniquely suitable for thermally aggressive, high-efficiency portable power designs where junction temperature margin is constrained.
Availability
STPS3150UF is available at Aetrix Electronics and suitable for LED lighting drivers, battery charger output stages, and DC/DC converter secondaries requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for STPS3150UF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
STPS3150UF belongs to ST's high-efficiency Schottky rectifier product line, engineered specifically for high-frequency, low-loss power conversion in portable and energy-sensitive applications where thermal density and efficiency are primary constraints.
FAQ
What is the maximum allowable junction temperature for STPS3150UF during continuous operation?
The absolute maximum junction temperature is 175 °C, as specified in Table 1 of DS3283 Rev 7. Continuous operation must ensure Tj remains ≤175 °C under worst-case ambient, power dissipation, and PCB thermal conditions. Derating curves in Figure 2 confirm 3 A average current is sustainable up to 150 °C ambient when mounted on SMB Flat with recommended copper area.
Does STPS3150UF have a specified reverse recovery time (trr)?
No-STPS3150UF is a Schottky rectifier and exhibits no minority-carrier storage, so trr is not defined. Its switching behavior is governed solely by junction capacitance (Cj ≈ 120 pF at 30 V, Figure 8) and parasitic inductance. This eliminates reverse recovery loss and associated EMI, distinguishing it from fast-recovery PN diodes.
Can STPS3150UF replace a standard PN rectifier in an existing 150 V, 3 A design?
Yes, provided the PCB footprint matches SMB Flat (5.84 mm × 3.44 mm) and cathode polarity is observed. The lower VF reduces conduction loss by ~0.6 W at 3 A, but thermal design must account for different Rth(j-l) (10 °C/W vs. ~20 °C/W for typical PN diodes), potentially allowing smaller heatsinks or higher ambient operation.
Is STPS3150UF suitable for automotive under-hood applications?
No-while rated to 175 °C junction temperature, STPS3150UF is not qualified to AEC-Q101 and lacks automotive-specific reliability testing (e.g., HTOL, temperature cycling). Its qualification targets consumer and computing applications; for automotive, ST recommends AEC-Q101-certified alternatives like STPS3150A-TR.
STPS3150UF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- DO-221AA, SMB Flat Leads
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 150 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- 820 mV @ 3 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 2 µA @ 150 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SMBflat
- Operating Temperature - Junction:
- 175°C (Max)
STPS3150UF FAQ
1.How can I place an order for STPS3150UF through Aetrix?
Please submit a Request for Quotation (RFQ) for STPS3150UF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STPS3150UF reliable?
The price and inventory of STPS3150UF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STPS3150UF is usually 5 days.
3.What payment methods are accepted for STPS3150UF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STPS3150UF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STPS3150UF?
STPS3150UF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STPS3150UF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STPS3150UF?
For technical support, including STPS3150UF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STPS3150UF requirements.
6.How does Aetrix verify that STPS3150UF is sourced from the original manufacturer or authorized distributors?
All STPS3150UF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STPS3150UF meets industry standards.
7.What is the process for return or replacement of STPS3150UF?
All STPS3150UF units undergo pre-shipment inspection (PSI). If there is an issue with STPS3150UF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STPS3150UF part is unused and in its original packaging.
Return procedure for STPS3150UF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STPS3150UF Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
