STMicroelectronics STPS4S200S

Overview

STPS4S200S from STMicroelectronics is a 4 A average forward current, 200 V repetitive peak reverse voltage Schottky rectifier in SMC package, featuring 0.64 V typical forward voltage at 4 A and 125 °C, negligible switching losses, and operation down to -40 °C - deployed in telecom power supplies and high-frequency DC-DC converters.

For engineers reviewing the STPS4S200S datasheet, STPS4S200S pinout, STPS4S200S application, or STPS4S200S equivalent, key selection criteria include conduction loss modeling (P = 0.63×IF(AV) + 0.020×IF²(RMS)), thermal impedance curves for SMB/SMC/DPAK variants, junction-to-lead resistance (15 °C/W), and ECOPACK2 compliance for surface-mount inverter and battery charger designs.

Technical Context

This single-die Schottky rectifier uses platinum-silicide barrier technology to achieve low VF and near-zero reverse recovery charge, enabling high-efficiency operation in 100 kHz–1 MHz switch-mode topologies. Its Tj(max) of 175 °C and -40 °C minimum operating temperature support wide ambient deployment without derating penalties.

Thermal performance is package-dependent: SMC variant delivers Rth(j-a) < 50 °C/W with ≥10 cm² copper area, while conduction losses are dominated by linear VF term and quadratic RMS current term per AN604. Reverse leakage remains below 2.5 mA at 125 °C and full VRRM.

Key Specifications

Pinout & Package

STPS4S200S is packaged in SMC (TO-263 variant), a surface-mount power package with three terminals: anode, cathode, and exposed thermal pad (cathode-connected). The package supports high-current routing and efficient heat transfer via soldered thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-4EWH02-M3/45 and MBR4200CT, STPS4S200S offers the lowest VF (0.64 V), tightest thermal resistance (15 °C/W), and smallest SMC footprint - making it optimal for high-density, high-efficiency telecom and inverter auxiliary supplies where thermal headroom and layout area are constrained.

Availability

STPS4S200S is available at Aetrix Electronics and suitable for telecom power supplies, battery chargers, and home appliance motor drives requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for STPS4S200S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

STPS4S200S belongs to ST's high-voltage Schottky rectifier product line, engineered specifically for high-frequency, high-efficiency power conversion in space- and thermally-constrained applications such as telecom bricks and compact battery chargers.

FAQ

What is the maximum surge current rating for STPS4S200S?

The STPS4S200S is rated for 130 A non-repetitive forward surge current with a 10 ms sinusoidal waveform per Table 1. This rating applies to single-event transient overload conditions such as inrush or short-circuit events, and assumes proper PCB thermal design to avoid junction temperature exceeding 175 °C during the pulse.

Can STPS4S200S be used in place of a standard PN junction rectifier?

Yes - STPS4S200S replaces PN rectifiers in high-frequency applications due to its zero reverse recovery charge, which eliminates switching loss and associated EMI. However, its higher reverse leakage (up to 2.5 mA at 125 °C) makes it unsuitable for high-impedance hold-up or precision reference circuits where leakage must remain below 100 nA.

What PCB layout recommendations apply to the SMC package thermal pad?

The SMC thermal pad must be soldered to a minimum 10 cm² copper area on the PCB's inner or outer layer, using ≥4 thermal vias (0.3 mm diameter, spaced ≤2 mm apart) connecting to internal ground planes. Per Figure 12, Rth(j-a) drops from ~85 °C/W (no copper) to ~45 °C/W with 10 cm², critical for sustaining 4 A at 70 °C ambient.

Is STPS4S200S compliant with lead-free assembly standards?

Yes - STPS4S200S carries ECOPACK2 certification, confirming lead-free terminations, halogen-free molding compound, and compliance with JEDEC J-STD-020D moisture sensitivity level 3 (MSL3). It supports peak reflow temperatures up to 260 °C for 10 seconds, matching standard lead-free solder profiles.