STMicroelectronics STPS4S200UFN

Overview

STPS4S200UFN from STMicroelectronics is a 4 A average forward current, 200 V repetitive peak reverse voltage Schottky rectifier in SMB Flat Notch package, optimized for high-frequency DC-DC converters and low-voltage inverters with negligible switching losses and Tj up to 175 °C. It delivers VF(typ.) = 0.64 V at 4 A and 125 °C, enabling efficient free-wheeling and polarity protection in telecom power supplies.

For engineers reviewing the STPS4S200UFN datasheet, STPS4S200UFN pinout, STPS4S200UFN application, or STPS4S200UFN equivalent, key selection criteria include conduction loss modeling (P = 0.63×IF(AV) + 0.020×IF²(RMS)), thermal impedance vs. pulse duration, junction-to-lead resistance (15 °C/W), and ECOPACK2 compliance for surface-mount reliability.

Technical Context

This single-die Schottky rectifier operates across -40 °C to +175 °C junction temperature range with low leakage current (≤0.7 mA at 125 °C, VR = 200 V) and minimal reverse recovery charge-enabling zero-voltage switching topologies. Its VF stability over temperature (0.64 V typ. at 125 °C, 4 A) supports consistent conduction loss prediction in thermally constrained designs.

The device uses platinum-silicide Schottky barrier technology to achieve negligible switching losses and very small conduction losses. Package-specific thermal resistances-Rth(j-l) = 15 °C/W (SMB Flat Notch/SMC/SMB Flat), Rth(j-c) = 3.2 °C/W (DPAK)-directly determine maximum sustainable IF(AV) under ambient and heatsink conditions.

Key Specifications

Pinout & Package

SMB Flat Notch package: surface-mount, 2-terminal diode with cathode marked by flat notch on body edge; lead material is matte tin, compliant with JEDEC J-STD-020 moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-4EWH02-M3/54 and SB420, STPS4S200UFN offers the lowest VF at operating temperature (0.64 V @ 125 °C), highest Tj rating (175 °C), and notch-marked SMB Flat Notch for unambiguous orientation-making it optimal for space-constrained, thermally aggressive, and automated assembly applications.

Availability

STPS4S200UFN is available at Aetrix Electronics and suitable for telecom power supplies, battery charger output stages, and home appliance motor drives requiring stable component supply with full ECOPACK2 compliance and SMB Flat Notch footprint consistency.

Supply support for STPS4S200UFN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

STPS4S200UFN belongs to ST's high-efficiency Schottky rectifier product line, engineered specifically for high-frequency, low-loss power conversion in space- and thermal-constrained applications such as server PSUs and portable chargers.

FAQ

What is the maximum allowable PCB copper area for thermal management of STPS4S200UFN in SMB Flat Notch package?

For SMB Flat Notch mounting, ST recommends ≥4.5 cm² total copper area distributed across both leads to achieve Rth(j-a) ≈ 45 °C/W at Tamb = 70 °C. Figure 11 in DS10646 shows Rth(j-a) drops from 50 °C/W (0 cm²) to 35 °C/W at 4 cm² and stabilizes beyond 5 cm²-so 4.5–5 cm² provides optimal thermal margin without excessive board real estate.

Can STPS4S200UFN replace a standard PN rectifier like 1N5408 in a 24 V input power supply?

No-STPS4S200UFN is not a direct replacement for 1N5408. While both handle ~4 A average current, 1N5408 has VRRM = 1000 V and Tj(max.) = 175 °C but VF ≈ 0.8–1.1 V and significant reverse recovery. STPS4S200UFN's 200 V VRRM and zero Qrr make it suitable only for low-voltage, high-frequency circuits-not 24 V input with high dV/dt transients or >200 V bus peaks.

Does STPS4S200UFN support parallel operation for higher current handling?

Yes, but with strict layout constraints: matched trace lengths, symmetrical thermal vias under each cathode/anode pad, and forced-air cooling or ≥6 cm² shared copper pour. Due to VF's negative temperature coefficient, mismatched thermal paths cause current hogging-ST recommends using external ballast resistors (0.01 Ω) if paralleling more than two units per branch.

Is the "UFN" suffix in STPS4S200UFN indicative of a specific revision or process node?

Yes-the "UFN" suffix denotes the SMB Flat Notch package variant with ECOPACK2 compliance, matte tin lead finish, and tape-and-reel packaging (5000 pcs/reel). It corresponds to ordering code STPS4S200UFN per Table 8 in DS10646 Rev 6, distinguishing it from DPAK (B-TR), SMC (S), and SMB Flat (UF) variants.