STMicroelectronics STPS50U100CR

Overview

STPS50U100CR from STMicroelectronics is a dual ultralow forward voltage (ULVF™) Schottky rectifier in I2PAK package, rated for 100 V repetitive reverse voltage and 2 × 25 A average forward current per diode at TC = 120 °C. It delivers 0.64 V typical forward voltage at 25 A/125 °C, enabling high-efficiency operation in high-frequency SMPS for notebook adapters, game station power supplies, and server DC/DC stages.

For engineers reviewing the STPS50U100CR datasheet, STPS50U100CR pinout, STPS50U100CR application, or STPS50U100CR equivalent, key selection criteria include thermal resistance (Rth(j–c) = 0.9 °C/W per device), surge capability (250 A non-repetitive), reverse leakage (≤40 mA @ 125 °C/VRRM), junction temperature limit (150 °C), and ULVF™-enabled conduction loss reduction.

Technical Context

This dual Schottky rectifier integrates two independent anode-cathode junctions in a single I2PAK thermally optimized package, with shared case as common cathode terminal. Its ULVF™ design minimizes forward conduction losses-critical for meeting 80 PLUS Titanium and ENERGY STAR® v8 efficiency requirements in compact AC/DC adapters.

The device operates up to 150 °C junction temperature and features low Rth(j–c) (0.9 °C/W per device) and coupling resistance (0.45 °C/W), enabling predictable thermal management when both diodes conduct simultaneously. Reverse leakage remains ≤40 mA at 125 °C under full 100 V reverse bias.

Key Specifications

Pinout & Package

The STPS50U100CR uses an I2PAK (TO-263) package with three terminals: two anodes (A1, A2) and one common cathode (K) on the exposed metal slug. Mounting requires through-hole soldering of leads; direct soldering of the metal slug is prohibited.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schottky rectifier applications.

Compared with STPS30L100CG and VB25100S-E3/45, the STPS50U100CR delivers superior thermal efficiency (0.9 °C/W vs. ≥1.2 °C/W) and lower conduction loss (0.64 V vs. ≥0.72 V), making it the only option capable of sustaining 50 A combined DC output in thermally constrained 1U or portable form factors.

Availability

STPS50U100CR is available at Aetrix Electronics and suitable for notebook AC adapters, server DC/DC converters, game console power supplies, and industrial PoE++ midspan PSEs requiring stable component supply and long-term manufacturability.

Supply support for STPS50U100CR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and power management applications.

The STPS series targets high-efficiency AC/DC and DC/DC power conversion, with ULVF™ Schottky rectifiers specifically engineered to meet tightening global energy efficiency standards in compact, thermally constrained power supplies.

FAQ

What is the recommended mounting method for the STPS50U100CR I2PAK package?

The STPS50U100CR must be mounted using standard through-hole soldering of its three leads. Direct soldering of the metal slug (heatsink) is strictly prohibited per ST's package specification-doing so risks internal delamination and thermal failure. Mechanical torque on the mounting screw must be held between 0.4–0.6 N·m to ensure reliable thermal contact without cracking the epoxy body.

Can STPS50U100CR replace TO-220AB variants like STPS50U100CT in existing designs?

Yes, STPS50U100CR is a direct functional replacement for STPS50U100CT, sharing identical electrical specifications and dual-diode topology. However, the I2PAK footprint differs: it requires rework of pad layout and stencil design. Thermal performance is improved (Rth(j–c) = 0.9 °C/W vs. 1.3 °C/W), but PCB copper area under the slug must be designed for through-hole via thermal relief-not surface-mount solder paste.

Does STPS50U100CR require an external snubber circuit?

Yes-ST explicitly recommends an RC clamping snubber in parallel with the device, especially in high-dI/dt flyback or LLC resonant converters. This suppresses voltage overshoot during reverse recovery (despite Schottky's lack of minority-carrier storage), preventing exceedance of the 100 V V_RRM rating and ensuring long-term reliability under transient conditions.

What is the maximum allowable ambient temperature when operating at full rated current?

At full 2 × 25 A DC load, the maximum ambient temperature depends on heatsink design. With Rth(j–a) ≈ 15 °C/W (typical for minimal copper area), T_A must not exceed 75 °C to keep T_j ≤ 150 °C. For unheatsinked operation, derating begins above 45 °C ambient-consult Figure 4 in Doc ID 16603 Rev 2 for precise IF(AV) vs. T_amb curves at δ = 0.5.