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STMicroelectronics STPS5L25B-TR

Part No.:
STPS5L25B-TR
Manufacturer:
STMicroelectronics
Category:
Single Diodes
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixSTPS5L25B-TR.pdf
Description:
DIODE SCHOTTKY 25V 5A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,857

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Product details

Overview

STPS5L25B-TR from STMicroelectronics is a single low-drop power Schottky rectifier in DPAK package, designed for secondary-side rectification in 3.3 V switch-mode power supplies and high-frequency DC-DC converters. It delivers 5 A average forward current (IF(AV)), 25 V repetitive peak reverse voltage (VRRM), and typ. 0.31 V forward voltage at 125 °C, enabling high-efficiency operation with minimal conduction loss.

For engineers reviewing the STPS5L25B-TR datasheet, STPS5L25B-TR pinout, STPS5L25B-TR application, or STPS5L25B-TR equivalent, key selection criteria include thermal resistance (Rth(j-c) = 2.5 °C/W), avalanche rating (215 W, tp = 10 µs), and ECOPACK®2-compliant DPAK packaging for industrial-grade reliability and RoHS compliance.

Technical Context

This Schottky rectifier uses a planar silicon junction optimized for low VF and controlled reverse leakage trade-off, supporting high-frequency switching up to several MHz without significant switching loss penalties. Its 150 °C maximum junction temperature and 2.5 °C/W junction-to-case thermal resistance enable direct heatsink mounting in compact SMPS designs.

The device meets avalanche energy specification (PARM = 215 W, tp = 10 µs at Tj = 125 °C), ensuring robustness against transient overvoltage events in unregulated or lightly loaded converter outputs. Reverse leakage remains ≤115 mA at 125 °C and full VRRM, critical for maintaining efficiency in high-temperature environments.

Key Specifications

ParameterValue and Actual Design Meaning
IF(AV)5 A average forward current at Tc = 140 °C - supports continuous 3.3 V/5 A output stage in SMPS
VRRM25 V repetitive peak reverse voltage - rated for secondary-side rectification in 3.3 V systems with margin
VF (typ)0.31 V at IF = 5 A, Tj = 125 °C - reduces conduction loss to ~1.55 W, minimizing heatsink requirement
Rth(j-c)2.5 °C/W - enables direct thermal coupling to PCB copper or external heatsink for stable 150 °C operation
PARM215 W avalanche power (tp = 10 µs, Tj = 125 °C) - withstands short-duration voltage transients without failure
IR (max)115 mA reverse leakage at VR = 25 V, Tj = 125 °C - limits standby power loss in high-temp ambient
PackageDPAK (TO-252) - surface-mount, thermally enhanced, with exposed cathode tab for low-inductance layout

Pinout & Package

DPAK (TO-252) package with three terminals: anode (pin 1), cathode (exposed metal tab/pin 2–3 shorted), and no gate or control terminal. Thermal pad is electrically connected to cathode and must be soldered to large copper area for optimal heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
Anode (lead 1)Input current entry pointConnected to transformer secondary or switching node; carries full forward current into load
Cathode (tab + leads 2–3)Output current exit pointElectrically common terminal tied to output rail and PCB thermal plane; defines reference for VF measurement
Thermal pad (underside)Thermal interface onlyNot electrically isolated; must be soldered to ≥2 cm² copper pour for Rth(j-a) < 40 °C/W

Key Features

FeatureDesign Value
Low VF at high temperature0.31 V typ. at 125 °C/5 A - maintains efficiency where silicon diodes degrade significantly
Avalanche-rated capability215 W pulse energy handling - eliminates need for external clamping in cost-sensitive 3.3 V SMPS
ECOPACK®2 complianceHalogen-free, RoHS-compliant epoxy - satisfies industrial and telecom environmental requirements without derating
Optimized conduction/reverse loss balanceIR ≤ 115 mA @ 125 °C/VRRM - avoids excessive leakage-induced thermal runaway in sealed enclosures
High-power DPAK footprint0.32 g mass, 6.22 mm × 6.73 mm outline - fits automated SMT assembly while delivering >5× thermal performance vs. SO-8

Applications

Server VRM Output RectificationIndustrial 3.3 V DC-DC Module

Use Scenario: Secondary-side synchronous or Schottky rectification in 3.3 V, 5 A server voltage regulator modules operating at 300–500 kHz.

IC Role / Device Role / Timing Role: Power rectifier converting high-frequency transformer output to regulated 3.3 V DC bus.

Use Value: 0.31 V VF at 125 °C reduces conduction loss by ~40% vs. standard 45 V Schottky, lowering board temperature rise by 8–10 °C.

Use Scenario: Isolated 3.3 V supply for PLC I/O modules requiring long-term reliability under 70 °C ambient.

IC Role / Device Role / Timing Role: Primary output rectifier in flyback or forward converter powering field-side logic and sensors.

Use Value: 150 °C Tj(max) and 215 W avalanche rating ensure uninterrupted operation during line surges or load dump events.

Telecom PoE+ Midspan SupplyMedical Imaging Power Subsystem

Use Scenario: 3.3 V auxiliary rail generation in IEEE 802.3at PoE+ midspan injectors with tight thermal constraints.

IC Role / Device Role / Timing Role: High-efficiency rectifier in secondary-side synchronous buck-derived topology.

Use Value: DPAK thermal pad enables direct attachment to aluminum chassis, achieving Rth(j-amb) < 25 °C/W without added heatsink.

Use Scenario: Low-noise 3.3 V supply for FPGA configuration and ADC reference circuits in portable ultrasound units.

IC Role / Device Role / Timing Role: Final-stage rectifier feeding LDO input, where low IR prevents standby current drift.

Use Value: ≤115 mA IR at 125 °C ensures <0.5% output voltage drift over full medical temperature range (0–50 °C ambient).

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor MBR520LT4GVRRM = 20 V, VF = 0.45 V @ 5 A/25 °C, Rth(j-c) = 3.0 °C/WLimited to 20 V systems; higher VF increases conduction loss by ~0.75 W at 5 ASelect only if VRRM margin < 5 V is acceptable and thermal budget allows +1.25 °C/W penalty
Vishay VS-50SQ030H-M3/86AVRRM = 30 V, VF = 0.39 V @ 5 A/25 °C, D2PAK package (larger footprint)Higher VRRM margin but larger size; VF 26% higher than STPS5L25B-TR at 125 °CPrefer when 30 V rating is mandatory and PCB space permits D2PAK; avoid in space-constrained 3.3 V designs

Compared with MBR520LT4G and VS-50SQ030H-M3/86A, STPS5L25B-TR uniquely balances 25 V rating, ultra-low 0.31 V VF at elevated temperature, and DPAK thermal performance-making it optimal for thermally dense 3.3 V SMPS where efficiency and footprint are co-constrained.

Availability

STPS5L25B-TR is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC modules, PoE+ midspans, and medical imaging subsystems requiring stable component supply and long-lifecycle support.

Supply support for STPS5L25B-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

The STPS series targets high-efficiency power conversion in compact AC-DC and DC-DC applications, with emphasis on low VF Schottky rectifiers optimized for 3.3 V and 5 V output stages in space- and thermal-constrained designs.

FAQ

Is STPS5L25B-TR suitable for synchronous rectification topologies?

No - STPS5L25B-TR is a passive Schottky rectifier and lacks gate control. It is intended for use in non-synchronous (diode-based) or quasi-resonant flyback converters where MOSFET synchronous rectification is not implemented. Its low VF makes it competitive with discrete MOSFETs in low-duty-cycle, low-voltage secondaries.

What is the minimum recommended copper area for the DPAK thermal pad?

ST recommends ≥2 cm² of 2-oz copper connected directly to the cathode tab. With this layout, junction-to-ambient thermal resistance drops to ~35–40 °C/W. Smaller areas increase Rth(j-a) nonlinearly; below 1 cm², derating of IF(AV) by ≥20% is required per ST's AN4447 guidelines.

Does STPS5L25B-TR require derating above 70 °C ambient temperature?

Yes - IF(AV) must be linearly derated above 70 °C ambient. At 100 °C ambient with standard 2-layer PCB, max IF(AV) is ~3.8 A. Full 5 A rating assumes Tc = 140 °C, achievable only with active heatsinking or ≥4-layer board with internal ground planes.

Can STPS5L25B-TR replace a 45 V Schottky in a 3.3 V SMPS?

Only if VRRM margin is verified. While 25 V exceeds typical 3.3 V output ripple + overshoot (<10 V), transient spikes from transformer leakage or layout parasitics may exceed VRRM. Use oscilloscope validation at the cathode-anode node before replacement; 45 V parts offer greater safety margin in poorly damped designs.

STPS5L25B-TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
25 V
Current - Average Rectified (Io):
5A
Voltage - Forward (Vf) (Max) @ If:
470 mV @ 5 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
350 µA @ 25 V
Capacitance @ Vr, F:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK
Operating Temperature - Junction:
150°C (Max)

STPS5L25B-TR FAQ

1.How can I place an order for STPS5L25B-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STPS5L25B-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STPS5L25B-TR reliable?

The price and inventory of STPS5L25B-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STPS5L25B-TR is usually 5 days.

3.What payment methods are accepted for STPS5L25B-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STPS5L25B-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STPS5L25B-TR?

STPS5L25B-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STPS5L25B-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STPS5L25B-TR?

For technical support, including STPS5L25B-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STPS5L25B-TR requirements.

6.How does Aetrix verify that STPS5L25B-TR is sourced from the original manufacturer or authorized distributors?

All STPS5L25B-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STPS5L25B-TR meets industry standards.

7.What is the process for return or replacement of STPS5L25B-TR?

All STPS5L25B-TR units undergo pre-shipment inspection (PSI). If there is an issue with STPS5L25B-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STPS5L25B-TR part is unused and in its original packaging.

Return procedure for STPS5L25B-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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