STMicroelectronics STPS8H100G

Overview

STPS8H100G from STMicroelectronics is a high-voltage Schottky barrier rectifier in D²PAK package, rated for 100 V repetitive peak reverse voltage and 8 A average forward current at TC = 165 °C. It delivers low forward voltage drop (0.56 V typ. at 125 °C, 8 A), negligible switching losses, and avalanche-rated capability (750 W, 10 µs pulse), optimized for compact high-frequency SMPS in AC-DC adapters and on-board DC-DC converters.

For engineers reviewing the STPS8H100G datasheet, STPS8H100G pinout, STPS8H100G application, or STPS8H100G equivalent, key selection criteria include thermal resistance (Rth(j-c) = 1.6 °C/W), insulation rating (not applicable - non-insulated D²PAK), junction temperature limit (175 °C), and conduction loss equation (P = 0.48 × IF(AV) + 0.0125 × IF²(RMS)).

Technical Context

This Schottky rectifier uses a planar silicon structure with metal–semiconductor junction to achieve fast recovery (no minority-carrier storage) and low VF/IR trade-off. Its 100 V VRRM rating targets secondary-side rectification in 48 V and 54 V output systems, while the 175 °C maximum junction temperature supports operation in thermally constrained PCB layouts without forced airflow.

The device is characterized for square-wave duty cycle δ = 0.5 and specified with surge current IFSM = 250 A (10 ms sine), enabling robust handling of transient overloads in power supply startup and fault conditions. Thermal performance is defined for D²PAK mounting on FR4 with epoxy, where Rth(j-a) varies from ~50 °C/W (no copper) to ~15 °C/W (large Cu area).

Key Specifications

Pinout & Package

D²PAK (TO-263) package: surface-mount, single-row 3-pin outline with exposed metal tab (cathode-connected) for thermal and electrical grounding. Requires solder pad with ≥6.85 mm × 8.10 mm copper area per Figure 12 for optimal Rth(j-a) performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage Schottky rectifier applications.

Compared with VS-8EWH10FN-M3 and MBR8H100CT, STPS8H100G offers the lowest VF (0.56 V), best thermal resistance (1.6 °C/W), and surface-mount D²PAK form factor-making it optimal for high-density, high-efficiency, automated production of modern SMPS.

Availability

STPS8H100G is available at Aetrix Electronics and suitable for AC-DC adapters, on-board DC-DC converters, and industrial power supplies requiring stable component supply, lead-free compliance, and high-reliability rectification under thermal stress.

Supply support for STPS8H100G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

The STPS series targets high-efficiency power conversion, with STPS8H100G specifically engineered for high-frequency, thermally demanding secondary-side rectification in compact SMPS topologies.

FAQ

What is the maximum allowable case temperature for continuous operation?

The STPS8H100G is rated for IF(AV) = 8 A at TC = 165 °C. Exceeding this temperature requires linear derating per Figure 3; operation above 165 °C risks exceeding the 175 °C absolute maximum junction temperature, especially under high IR or poor heatsinking.

Is the D²PAK tab electrically isolated?

No-the D²PAK tab is internally connected to the cathode and is not insulated. Unlike the TO-220FPAC variant (2000 VRMS isolation), the STPS8H100G requires proper PCB isolation design if cathode potential differs from chassis ground or heatsink potential.

Can STPS8H100G replace a standard silicon rectifier in an existing 100 V design?

Yes, provided layout accommodates D²PAK footprint and thermal copper; forward voltage reduction lowers conduction loss, but reverse leakage is higher-verify standby current impact and ensure no voltage overshoot exceeds 100 V during transients due to lack of recovery tail.

What is the recommended PCB footprint for optimal thermal performance?

Per Figure 12, use a minimum 8.10 mm × 6.85 mm (L × W) copper pad connected to ≥2 internal layers via ≥6 thermal vias (0.3 mm diameter, 0.8 mm pitch). This achieves Rth(j-a) ≈ 20–25 °C/W, keeping Tj ≤ 125 °C at 8 A with 50 °C ambient.