STMicroelectronics STPS8L30B-TR

Overview

STPS8L30B-TR from STMicroelectronics is a single low-drop Schottky rectifier in DPAK package, rated for 8 A average forward current and 30 V repetitive peak reverse voltage, with typical forward voltage of 0.35 V at 125 °C and 8 A. It is designed for secondary-side rectification in 3.3 V switched-mode power supplies and high-frequency DC/DC converters, delivering reduced conduction loss and minimal heatsink requirement.

For engineers reviewing the STPS8L30B-TR datasheet, STPS8L30B-TR pinout, STPS8L30B-TR application, or STPS8L30B-TR equivalent, key selection criteria include forward voltage drop at operating temperature, avalanche energy rating (215 W at 10 µs), thermal resistance (2.5 °C/W junction-to-case), and DPAK thermal pad layout compatibility with FR4 PCB copper area.

Technical Context

This Schottky rectifier uses a planar silicon structure optimized for low VF and controlled reverse leakage trade-off, enabling high efficiency in compact 3.3 V output stages. Its avalanche capability is fully specified (215 W, tp = 10 µs, Tj = 125 °C), supporting robust operation during transient overvoltage events without external clamping.

The device operates up to 150 °C junction temperature and exhibits 1 mA max reverse leakage at 25 °C and VR = 30 V. Thermal performance relies on conduction cooling via the DPAK tab, with Rth(j-c) = 2.5 °C/W and recommended copper surface area ≥25 cm² for ambient-limited derating.

Key Specifications

Pinout & Package

DPAK (TO-252) package with exposed thermal pad on the backside; mechanical dimensions conform to ST's standardized DPAK outline (A2 = 0.03–0.23 mm, D = 5.97–6.22 mm, E = 6.35–6.73 mm); mounting requires soldering the tab to a minimum 25 cm² copper pour for thermal compliance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SS8P3L-TP and MBR830CT, STPS8L30B-TR delivers lowest thermal resistance (2.5 °C/W), highest avalanche robustness (215 W), and smallest footprint - making it optimal for thermally constrained, high-reliability 3.3 V SMPS secondary stages.

Availability

STPS8L30B-TR is available at Aetrix Electronics and suitable for 3.3 V switched-mode power supplies, high-frequency DC/DC converters, and industrial polarity protection circuits requiring stable component supply and long-term manufacturability.

Supply support for STPS8L30B-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.

The STPS series targets high-efficiency, surface-mount power rectification with emphasis on low VF, thermal robustness, and environmental compliance - specifically engineered for next-generation compact 3.3 V and 5 V power conversion systems.

FAQ

What is the maximum allowable PCB copper area for thermal management of STPS8L30B-TR?

The datasheet specifies Rth(j-a) = 70 °C/W with 0 cm² copper and drops to ~35 °C/W with 25 cm² FR4 copper (35 µm thick). For 8 A continuous operation at 50 °C ambient, ≥25 cm² is required to maintain Tj ≤ 125 °C. Larger copper areas yield diminishing returns beyond 40 cm².

Does STPS8L30B-TR require a heatsink in DPAK mounting?

No external heatsink is required when the DPAK tab is soldered directly to ≥25 cm² of 35 µm copper on FR4. The 2.5 °C/W Rth(j-c) enables full 8 A current handling via PCB conduction alone - provided the copper pour is uninterrupted and thermally anchored with multiple vias to inner layers.

Is STPS8L30B-TR suitable for synchronous rectification replacement?

No - it is a passive Schottky rectifier, not a synchronous MOSFET driver or integrated controller. While it can replace synchronous FETs in cost-driven non-synchronous designs, it cannot be driven by gate signals and lacks control logic. Its role is strictly unidirectional conduction with fixed VF.

How does the ECOPACK®2 compliance affect assembly process?

ECOPACK®2 compliance means halogen-free, RoHS-compliant materials with MSL1 rating - allowing unlimited floor life and reflow without pre-baking. The epoxy meets UL 94 V0 flammability standard, and the DPAK package withstands standard lead-free reflow profiles (peak 260 °C, 30 sec) without delamination or voiding.