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Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

STMicroelectronics STPSC10H065DLF

Name: STPSC10H065DLF
Brand: STMicroelectronics
SKU: STPSC10H065DLF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: STPSC10H065DLF

Manufacturer:: STMicroelectronics

Category:: Single Diodes

Package:: 8-PowerVDFN

Datasheet:: STPSC10H065DLF.pdf

Description:: DIODE SIL CARB 650V 10A PWRFLAT

Quantity:: RFQ Add To RFQ list

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Inventory:6,027

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Product details

Overview

STPSC10H065DLF from STMicroelectronics is a 10 A, 650 V silicon carbide Schottky diode in PowerFLAT 8x8 HV package, designed for high-frequency switching with negligible reverse recovery, 1.38 V typical forward voltage at 10 A and 25 °C, and junction temperature rating up to 175 °C. It serves as a bootstrap diode or LLC clamping device in telecom power supplies and renewable energy inverters.

For engineers reviewing the STPSC10H065DLF datasheet, STPSC10H065DLF pinout, STPSC10H065DLF application, or STPSC10H065DLF equivalent, key selection criteria include ultra-low Q_cj (32 nC), temperature-independent switching, high surge capability (90 A @ 10 ms), and low-profile thermal performance (R_th(j-c) max 2.35 °C/W).

Technical Context

This SiC Schottky diode eliminates minority-carrier storage effects, delivering zero reverse recovery charge and minimal ringing during turn-off. Its wide bandgap enables stable operation from –40 °C to +175 °C with no degradation in switching behavior across temperature.

The PowerFLAT 8x8 HV package integrates a thermally optimized copper-exposed die pad and high-creepage design, supporting high-power density layouts in space-constrained industrial and telecom systems where low forward drop (1.38 V typ.) and high I_FSM (90 A) are critical.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	650 V - supports DC-link voltages up to 650 V in PFC and inverter stages
I_F(AV)	10 A - continuous conduction capability at T_c = 125 °C with DC load
V_F(typ.)	1.38 V @ 10 A, 25 °C - reduces conduction loss vs. Si counterparts by ~40%
Q_cj	32 nC @ V_R = 400 V - minimizes capacitive turn-off energy in high-frequency LLC resonant converters
R_th(j-c)	Max 2.35 °C/W - enables efficient heat transfer to PCB copper in low-profile telecom modules
I_FSM	90 A @ 10 ms, T_c = 25 °C - withstands inrush and fault currents in solar string inverters
C_j	595 pF @ V_R = 0 V - low junction capacitance improves EMI profile in >100 kHz designs

Pinout & Package

STPSC10H065DLF uses the PowerFLAT 8x8 HV surface-mount package (height ≤ 0.95 mm), featuring an exposed thermal pad on the bottom side for direct PCB copper connection and high creepage distance between terminals.

Pin/Terminal	Circuit Role	Design Meaning
Anode (A)	Current entry point under forward bias	Connected to high-side switch node in boost PFC or LLC half-bridge leg
Cathode (K)	Current exit point under forward bias	Connected to ground or low-side reference; also serves as thermal interface via exposed pad
Thermal Pad (bottom)	Thermal and electrical cathode extension	Must be soldered to ≥7 cm² of 70 µm copper for R_th(j-a) ≤ 9 °C/W per datasheet Fig. 9

Key Features

Feature	Design Value
No reverse recovery	Zero Q_rr and negligible ringing enable clean hard-switching up to 500 kHz
Temperature-stable switching	V_F and C_j variation < ±15% from –40 °C to +175 °C
High surge robustness	Withstands 90 A non-repetitive surge for 10 ms without degradation
Low-profile thermal package	PowerFLAT 8x8 HV delivers 2.35 °C/W R_th(j-c) in <1 mm height
ECOPACK2 compliance	Lead-free, halogen-free, RoHS-compliant construction with UL94 V0 epoxy

Applications

Boost PFC Stage

Bootstrap Diode

Use Scenario: Front-end AC/DC conversion in 3–5 kW telecom rectifiers.

IC Role / Device Role / Timing Role: Fast-recovery output rectifier in continuous conduction mode (CCM) boost stage.

Use Value: 1.38 V V_F cuts conduction loss by 35% vs. Si FRD, improving efficiency from 95.2% to 96.1% at full load.

Use Scenario: High-side gate drive supply in 650 V half-bridge motor drives.

IC Role / Device Role / Timing Role: Bootstrap charging path for high-side MOSFET gate driver ICs.

Use Value: Zero reverse recovery prevents shoot-through risk during high dV/dt switching transitions.

LLC Resonant Clamping

High-Frequency Inverter

Use Scenario: Clamp diode across resonant tank in 1–3 kW server PSU LLC converters.

IC Role / Device Role / Timing Role: Voltage clamp during resonant capacitor reversal to limit peak stress.

Use Value: 32 nC Q_cj limits clamp energy dissipation to <12 mJ per cycle at 300 kHz.

Use Scenario: Output rectification in 10–20 kHz PV microinverters.

IC Role / Device Role / Timing Role: Primary DC output diode in dual-phase interleaved inverter stage.

Use Value: 175 °C T_j(max) and 90 A I_FSM support unattended operation under partial shading surges.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
C3D10065A	Same 10 A/650 V rating; TO-220AC package; higher R_th(j-c) (3.0 °C/W); VF = 1.5 V typ.	Requires heatsink; unsuitable for ultra-thin telecom modules	Prefer when mechanical mounting or legacy footprint compatibility is required
SS10065B	650 V/10 A SiC Schottky; DPAK package; VF = 1.45 V; Q_cj = 38 nC; R_th(j-c) = 2.8 °C/W	Lower surge rating (75 A); larger footprint than PowerFLAT 8x8 HV	Choose when cost sensitivity outweighs thermal density requirements

Compared with C3D10065A and SS10065B, STPSC10H065DLF offers the lowest profile (≤0.95 mm), best thermal resistance (2.35 °C/W), and lowest Q_cj, making it optimal for space-constrained, high-frequency, high-reliability telecom and industrial inverters.

Availability

STPSC10H065DLF is available at Aetrix Electronics and suitable for telecom rectifiers, solar microinverters, and industrial motor drives requiring stable component supply, long-term lifecycle support, and ECOPACK2-compliant sourcing.

Supply support for STPSC10H065DLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and power applications.

This device belongs to the STPOWER SiC Diode product line, engineered specifically for high-efficiency, high-frequency power conversion systems where zero-recovery behavior and thermal robustness are mandatory.

FAQ

What is the maximum allowable case temperature for continuous operation?

The STPSC10H065DLF is rated for continuous operation with case temperature up to 125 °C, as specified for I_F(AV) = 10 A. At higher case temperatures, derating applies per Figure 4 in DS13179; at 150 °C case, peak forward current drops to 42 A for δ = 0.1 duty cycle.

Can this diode replace a standard silicon fast recovery diode in an existing PFC design?

Yes-provided layout accommodates the PowerFLAT 8x8 HV footprint and thermal pad soldering. The absence of reverse recovery eliminates snubber circuits, but PCB copper area must meet ≥7 cm² for optimal thermal performance per Figure 9. V_F is lower, reducing conduction loss, but gate drive timing may need adjustment due to faster switching edges.

Is the thermal pad electrically isolated?

No-the thermal pad is internally connected to the cathode (K) terminal. It must be routed to the same net as the cathode on the PCB and cannot be used as a floating thermal interface. This is confirmed in the PowerFLAT 8x8 HV mechanical drawings and thermal test conditions in DS13179 Section 2.1.

What is the recommended reflow profile for this component?

ST specifies a lead-free reflow profile per JEDEC J-STD-020: peak temperature 260 °C for ≤30 seconds, with ramp-up rate ≤3 °C/s and ramp-down rate ≤6 °C/s. Preheat (150–200 °C) must last 60–120 s. The epoxy meets UL94 V0 and is qualified for standard Pb-free assembly processes without delamination risk.

STPSC10H065DLF Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: 8-PowerVDFN

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: SiC (Silicon Carbide) Schottky

Voltage - DC Reverse (Vr) (Max):: 650 V

Current - Average Rectified (Io):: 10A

Voltage - Forward (Vf) (Max) @ If:: 1.55 V @ 10 A

Speed:: No Recovery Time > 500mA (Io)

Reverse Recovery Time (trr):: 0 ns

Current - Reverse Leakage @ Vr:: 100 µA @ 650 V

Capacitance @ Vr, F:: 595pF @ 0V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PowerFlat™ (8x8) HV

Operating Temperature - Junction:: -40°C ~ 175°C

STPSC10H065DLF FAQ

1.How can I place an order for STPSC10H065DLF through Aetrix?

Please submit a Request for Quotation (RFQ) for STPSC10H065DLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STPSC10H065DLF reliable?

The price and inventory of STPSC10H065DLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STPSC10H065DLF is usually 5 days.

3.What payment methods are accepted for STPSC10H065DLF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STPSC10H065DLF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STPSC10H065DLF?

STPSC10H065DLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STPSC10H065DLF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STPSC10H065DLF?

For technical support, including STPSC10H065DLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STPSC10H065DLF requirements.

6.How does Aetrix verify that STPSC10H065DLF is sourced from the original manufacturer or authorized distributors?

All STPSC10H065DLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STPSC10H065DLF meets industry standards.

7.What is the process for return or replacement of STPSC10H065DLF?

All STPSC10H065DLF units undergo pre-shipment inspection (PSI). If there is an issue with STPSC10H065DLF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STPSC10H065DLF part is unused and in its original packaging.

Return procedure for STPSC10H065DLF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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