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STMicroelectronics STPSC20H12G-TR

Part No.:
STPSC20H12G-TR
Manufacturer:
STMicroelectronics
Category:
Single Diodes
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTPSC20H12G-TR.pdf
Description:
DIODE SIL CARB 1.2KV 20A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,630

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Product details

Overview

STPSC20H12G-TR from STMicroelectronics is a 1200 V, 20 A silicon carbide Schottky power rectifier in D²PAK package, designed for high-efficiency PFC and secondary-side rectification in hard-switching topologies. It delivers zero reverse recovery, 1.35 V typical forward voltage at 20 A and 25 °C, operates up to 175 °C junction temperature, and exhibits temperature-independent switching behavior - enabling use in solar inverters and EV on-board chargers.

For engineers reviewing the STPSC20H12G-TR datasheet, STPSC20H12G-TR pinout, STPSC20H12G-TR application, or STPSC20H12G-TR equivalent, key selection criteria include its 1200 V blocking capability, low QCJ (129 nC), negligible reverse recovery, thermal robustness (Rth(j-c) = 0.40 °C/W max), and ECOPACK2 compliance for industrial-grade reliability.

Technical Context

This SiC Schottky diode replaces conventional silicon fast recovery and ultrafast diodes in high-voltage, high-frequency PFC stages and DC-DC output rectification. Its wide band-gap silicon carbide substrate enables stable VF and near-zero reverse recovery charge across -40 °C to +175 °C operating range.

The device's capacitive turn-off behavior - characterized by Cj = 1650 pF at 0 V and 110 pF at 800 V - eliminates tail current and associated switching losses, making it ideal for continuous conduction mode (CCM) boost PFC and LLC resonant converters where EMI and efficiency are critical.

Key Specifications

Parameter Value and Actual Design Meaning
VRRM 1200 V - Enables direct integration into 1000 V DC-link systems (e.g., solar string inverters, EV OBCs) without derating.
IF(AV) 20 A at TC = 155 °C - Supports sustained conduction in thermally constrained PFC modules with minimal heatsink area.
VF (typ.) 1.35 V @ 20 A, 25 °C - Reduces conduction loss to ~27 W (vs. ~40 W for Si FRD), improving system efficiency by 0.5–1.2% in 3.3 kW PFC.
QCJ 129 nC @ VR = 800 V - Minimizes turn-off energy loss and dv/dt-induced ringing in 100+ kHz switching applications.
Tj(max) 175 °C - Allows operation in sealed enclosures (e.g., telecom PSUs, server VRMs) without active cooling derating.
Rth(j-c) 0.45 °C/W (max) - Enables thermal design with ≤10 K rise at 20 A DC, supporting compact PCB-mount layouts in D²PAK footprint.
IFSM 120 A @ TC = 150 °C, 10 ms - Withstands inrush and overload transients in UPS and EV charging station front-end stages.

Pinout & Package

D²PAK (TO-263AB) surface-mount package with isolated copper tab for direct thermal coupling to PCB copper pour or heatsink. Single-anode, single-cathode configuration; cathode marked by beveled edge and "K" silkscreen.

Pin/Terminal Circuit Role Design Meaning
Anode (Tab) Power input terminal Electrically connected to metal tab - must be electrically isolated from heatsink unless referenced to system ground; primary thermal path to PCB.
Cathode (Lead 2) Power output terminal Carries full load current to output bus; requires low-inductance routing to minimize switching voltage overshoot.
NC (Lead 1) No connection Unused lead - left unconnected per datasheet; not internally bonded; must not be soldered or tied to any net.

Key Features

Feature Design Value
Zero reverse recovery charge Eliminates reverse recovery loss and associated EMI, enabling >100 kHz PFC operation without snubbers.
Temperature-stable switching QCJ and VF variation <±15% from -40 °C to 175 °C - simplifies thermal compensation in automotive and industrial designs.
High surge robustness 120 A non-repetitive surge at 150 °C case temperature - sustains repeated line surges in grid-tied solar inverters.
ECOPACK2 compliance Meets RoHS, halogen-free, and REACH requirements - qualified for use in EU/US green energy infrastructure programs.
Low junction-to-case thermal resistance 0.45 °C/W max - allows 20 A continuous operation with ≤10 K temperature rise using 40 cm² 2-oz copper pad.

Applications

Solar Inverter Boost Stage EV On-Board Charger (OBC) PFC

Use Scenario: Front-end boost PFC stage in 5–10 kW string inverters converting 600–1000 V DC to regulated 800 V DC bus.

IC Role / Device Role / Timing Role: High-voltage output rectifier in continuous conduction mode (CCM) boost converter.

Use Value: Eliminates 30–50 W of reverse recovery loss per diode vs. Si FRD, increasing system efficiency from 97.2% to ≥98.1% at full load.

Use Scenario: Active PFC front-end in 6.6 kW bi-directional OBC for Level 2 AC charging.

IC Role / Device Role / Timing Role: Output rectifier in interleaved totem-pole PFC operating at 65–100 kHz.

Use Value: Enables zero-current switching (ZCS) transition without body diode conduction, reducing MOSFET stress and thermal derating.

Telecom Server PSU Industrial UPS Power Stage

Use Scenario: Secondary-side synchronous rectification replacement in 48 V output, 3 kW telecom rectifiers.

IC Role / Device Role / Timing Role: Freewheeling diode in phase-shifted full-bridge (PSFB) or LLC resonant converter.

Use Value: Removes reverse recovery-induced voltage spikes (>150 V overshoot) that trigger MOSFET avalanche failure in high-density server PSUs.

Use Scenario: Input rectification in double-conversion online UPS handling 3-phase 400 V AC input.

IC Role / Device Role / Timing Role: Boost diode in three-phase Vienna rectifier topology.

Use Value: Sustains 175 °C junction temperature during 10-second overload events without derating, meeting UL 1778 hold-time requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC Schottky diode applications.

Alternative Part Technical Difference Application Difference Selection Advice
C3D20120D (Wolfspeed) Same 1200 V/20 A rating; VF = 1.5 V (typ.) at 20 A; Rth(j-c) = 0.55 °C/W; TO-247-2L package. Requires through-hole mounting and larger heatsink; higher VF increases conduction loss by ~3 W at full load. Preferred when legacy TO-247 layout reuse is required and board space permits larger footprint.
IXYS MDS20120SB (Littelfuse) 1200 V/20 A; VF = 1.45 V (typ.); QCJ = 145 nC; D²PAK package; Rth(j-c) = 0.50 °C/W. Higher capacitive charge increases turn-off loss by ~12% in 100 kHz PFC; slightly lower thermal performance. Valid drop-in alternative if ST supply chain constraints exist, but verify EMI filter margin due to higher QCJ.

Compared with C3D20120D and MDS20120SB, STPSC20H12G-TR offers the lowest VF (1.35 V) and best thermal resistance (0.45 °C/W max) in D²PAK, delivering highest efficiency in space-constrained, high-power-density PFC designs.

Availability

STPSC20H12G-TR is available at Aetrix Electronics and suitable for solar inverter boost stages, EV on-board charger PFC circuits, and telecom server power supplies requiring stable component supply, long-lifecycle support, and ECOPACK2-compliant sourcing.

Supply support for STPSC20H12G-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and power electronics markets.

This device belongs to ST's STPSC family of silicon carbide Schottky diodes, engineered specifically for high-efficiency, high-reliability power conversion in renewable energy and electrified transportation systems.

FAQ

Is STPSC20H12G-TR suitable for use in totem-pole PFC topologies?

Yes. Its zero reverse recovery and low QCJ (129 nC) enable clean ZVS/ZCS transitions in both continuous and discontinuous conduction modes. The D²PAK package supports high-current PCB routing, and its 175 °C rating accommodates elevated thermal stress during light-load operation common in totem-pole designs.

What is the maximum recommended soldering temperature profile for STPSC20H12G-TR?

The D²PAK package is rated for standard lead-free reflow per JEDEC J-STD-020. Peak temperature must not exceed 260 °C for ≤30 seconds, with ramp-up rate ≤3 °C/s and ramp-down rate ≤6 °C/s. Preheat (150–200 °C) duration should be 60–120 s to avoid thermal shock to the SiC die or mold compound.

Does STPSC20H12G-TR require a gate resistor or snubber network?

No. As a Schottky diode with no minority-carrier storage, it does not require snubbers or gate resistors. However, a small RC snubber (e.g., 10 Ω + 100 pF) across anode-cathode may be used to damp residual PCB trace resonance in ultra-high dv/dt environments (>50 V/ns), though not mandated by datasheet.

How does the forward voltage drift with temperature compared to silicon diodes?

VF increases only ~0.3 mV/°C from 25 °C to 150 °C (1.35 V → 1.75 V typ.), versus ~1.5–2.0 mV/°C for Si FRDs. This shallow positive TC improves current sharing in parallel configurations and reduces thermal runaway risk in multi-diode arrays.

STPSC20H12G-TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
ECOPACK®2
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max):
1200 V
Current - Average Rectified (Io):
20A
Voltage - Forward (Vf) (Max) @ If:
1.5 V @ 20 A
Speed:
No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr):
0 ns
Current - Reverse Leakage @ Vr:
120 µA @ 1200 V
Capacitance @ Vr, F:
1650pF @ 0V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK
Operating Temperature - Junction:
-40°C ~ 175°C

STPSC20H12G-TR FAQ

1.How can I place an order for STPSC20H12G-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STPSC20H12G-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STPSC20H12G-TR reliable?

The price and inventory of STPSC20H12G-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STPSC20H12G-TR is usually 5 days.

3.What payment methods are accepted for STPSC20H12G-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STPSC20H12G-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STPSC20H12G-TR?

STPSC20H12G-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STPSC20H12G-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STPSC20H12G-TR?

For technical support, including STPSC20H12G-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STPSC20H12G-TR requirements.

6.How does Aetrix verify that STPSC20H12G-TR is sourced from the original manufacturer or authorized distributors?

All STPSC20H12G-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STPSC20H12G-TR meets industry standards.

7.What is the process for return or replacement of STPSC20H12G-TR?

All STPSC20H12G-TR units undergo pre-shipment inspection (PSI). If there is an issue with STPSC20H12G-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STPSC20H12G-TR part is unused and in its original packaging.

Return procedure for STPSC20H12G-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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