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Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

STMicroelectronics STPSC406B-TR

Name: STPSC406B-TR
Brand: STMicroelectronics
SKU: STPSC406B-TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: STPSC406B-TR

Manufacturer:: STMicroelectronics

Category:: Single Diodes

Package:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Datasheet:: STPSC406B-TR.pdf

Description:: DIODE SIL CARBIDE 600V 4A DPAK

Quantity:: RFQ Add To RFQ list

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Product details

Overview

STPSC406B-TR from STMicroelectronics is a 600 V, 4 A average forward current silicon carbide Schottky diode in DPAK package, designed specifically as a high-efficiency PFC boost diode for hard-switching AC-DC power supplies. It exhibits negligible reverse recovery, temperature-independent switching behavior, and low capacitive charge (3 nC at 400 V, 150 °C), enabling reduced EMI and improved thermal stability in industrial and server power units.

For engineers reviewing the STPSC406B-TR datasheet, STPSC406B-TR pinout, STPSC406B-TR application, or STPSC406B-TR equivalent, key selection criteria include its 600 V V_RRM, 4 A I_F(AV) at T_c = 110 °C, 3 nC Q_C, 200 pF C_iss at 0 V, and 175 °C maximum junction temperature - all critical for high-frequency, high-reliability PFC stage design.

Technical Context

This SiC Schottky diode replaces conventional silicon fast recovery diodes in continuous conduction mode (CCM) PFC boost stages. Its wide-bandgap construction eliminates minority-carrier storage, resulting in zero reverse recovery charge and no associated voltage ringing or switching losses during turn-off.

The device operates with stable forward voltage (1.55–1.9 V at 4 A, 25 °C; 1.9–2.4 V at 150 °C) and ultra-low leakage (<60 µA at 150 °C, V_RRM), ensuring predictable conduction loss and minimal standby power degradation across full industrial temperature range.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	600 V - supports universal input (85–265 V_AC) PFC designs with margin against line surges and transient overvoltage.
I_F(AV)	4 A at T_c = 110 °C, δ = 0.5 - defines continuous output capability in thermally constrained DPAK footprint for compact 300–500 W PFC stages.
Q_C	3 nC at V_R = 400 V, dI_F/dt = −200 A/µs, T_j = 150 °C - directly reduces turn-off switching loss and EMI generation in 65–100 kHz boost converters.
R_th(j-c)	4.5 °C/W - enables thermal design with standard PCB copper area (≥200 mm² 2 oz Cu) without external heatsink in forced-air or convection-cooled systems.
T_j(max)	175 °C - allows sustained operation under high ambient conditions (e.g., 70 °C ambient + 105 °C rise) without derating in enclosed server PSUs.
C_iss	200 pF at V_R = 0 V, 1 MHz - sets gate-drive loading and snubber requirements for MOSFETs in synchronous rectification or hybrid topologies.

Pinout & Package

DPAK (TO-252) package: single-sided heat dissipation, surface-mountable, 3-pin configuration with exposed drain pad for thermal and electrical connection to PCB ground plane.

Pin/Terminal	Circuit Role	Design Meaning
Anode (Pin 1)	Forward current entry point	Connected to boost inductor node; must be routed with low-inductance path to minimize voltage overshoot during diode turn-on.
Cathode (Pin 2)	Forward current exit / high-side return	Connected to PFC output capacitor positive rail; serves as primary high-voltage reference for gate drivers and controllers.
Exposed Pad (Pin 3)	Thermal & electrical cathode extension	Electrically tied to cathode; requires ≥80% solder coverage on ≥200 mm² 2 oz Cu thermal pad for R_th(j-c) = 4.5 °C/W performance.

Key Features

Feature	Design Value
No reverse recovery charge (Q_rr ≈ 0)	Eliminates turn-off switching loss and associated EMI, enabling higher frequency operation without efficiency penalty.
Temperature-stable switching behavior	Q_C and V_F variation <±15% from 25 °C to 175 °C - simplifies thermal management and ensures consistent PFC loop stability across operating range.
Low forward voltage drift with temperature	V_F increases only ~0.35 V from 25 °C to 150 °C at 4 A - maintains high conduction efficiency even at full-load, high-temperature conditions.
High surge current capability	14 A I_FRM (δ = 0.1) at T_c = 115 °C - withstands inrush and overload transients in industrial SMPS without derating or parallel devices.

Applications

Industrial AC-DC Power Supplies

Server & Data Center PSU PFC Stages

Use Scenario: 300–500 W front-end PFC module in DIN-rail mounted programmable logic controller (PLC) power supply operating continuously at 60 °C ambient.

IC Role / Device Role / Timing Role: Primary boost rectifier in continuous conduction mode (CCM) topology, conducting during MOSFET off-time and blocking during on-time.

Use Value: Enables >96% PFC efficiency at 50 kHz with no snubber, reducing component count and improving MTBF versus silicon FRD alternatives.

Use Scenario: 80 PLUS Titanium-certified 1.5 kW server PSU requiring >99% efficiency at 50% load and strict EMI compliance.

IC Role / Device Role / Timing Role: High-frequency boost diode in interleaved two-phase CCM PFC, operating at 75 kHz with tight duty-cycle control.

Use Value: Delivers 30% lower switching loss than Si FRD, allowing reduction of heatsink volume by 40% while meeting CISPR-32 Class B conducted emissions limits.

Telecom Rectifier Modules

Renewable Energy Inverters (DC-Link)

Use Scenario: -48 V telecom rectifier with 3 kW per shelf, operating in hot-and-cold cycling environments (−5 °C to +65 °C).

IC Role / Device Role / Timing Role: Input-stage PFC diode handling 200–240 V_AC input, subject to frequent thermal cycling and lightning-induced transients.

Use Value: Maintains stable V_F and leakage across temperature extremes, eliminating efficiency drift and preventing thermal runaway during cold-start conditions.

Use Scenario: DC-link boost stage in 5–10 kW solar string inverter interfacing PV arrays with 600–1000 V_DC bus.

IC Role / Device Role / Timing Role: High-voltage, high-reliability boost diode in unidirectional DC-DC stage feeding inverter H-bridge.

Use Value: Withstands 600 V blocking with 150% surge margin and delivers 175 °C junction rating for extended field life in desert-mounted installations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
C3D04060E-TR	Same 600 V / 4 A rating; 2.5 nC Q_C (lower), but 2.2 V V_F at 150 °C (higher than STPSC406B-TR's 2.4 V max)	Better suited for ultra-low-loss, low-dI/dt designs; less optimal in high-temperature, high-current conduction scenarios	Select when minimizing switching loss dominates over conduction loss; verify thermal interface compatibility with DPAK footprint.
SS14HE3_A/H	Silicon Schottky, 40 V / 4 A; not rated for 600 V operation - fundamentally incompatible for PFC boost use	Only applicable in low-voltage secondary-side rectification, not primary PFC	Not a functional alternative; included only to clarify voltage-class mismatch - avoid for any 600 V application.

Compared with C3D04060E-TR, STPSC406B-TR offers superior conduction efficiency at elevated temperature and tighter V_F distribution, while SS14HE3_A/H is electrically unsuitable for PFC due to 40 V rating - making STPSC406B-TR the only viable 600 V SiC solution among the three for hard-switched boost stages.

Availability

STPSC406B-TR is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, server PSU PFC stages, and telecom rectifier modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant DPAK packaging.

Supply support for STPSC406B-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs, discrete devices, and MEMS sensors for automotive, industrial, and consumer markets.

The STPSC series belongs to ST's silicon carbide power diode product line, engineered specifically to replace silicon fast recovery diodes in high-efficiency, high-frequency PFC and SMPS applications where zero reverse recovery and thermal stability are mandatory.

FAQ

What is the maximum recommended case temperature for continuous operation?

The STPSC406B-TR is rated for I_F(AV) = 4 A at T_c = 110 °C with 50% duty cycle. Exceeding this case temperature requires linear derating per Figure 4 in the datasheet; operation above 125 °C case temperature is not supported for full-rated current and risks exceeding the 175 °C junction limit under typical PCB thermal resistance.

Can STPSC406B-TR be used in place of a TO-220AC variant like STPSC406D?

No - STPSC406B-TR uses DPAK (TO-252) packaging with different thermal resistance (4.5 °C/W vs. 5.5 °C/W), pinout, and mounting method. While both share identical electrical specs, the DPAK version requires surface-mount layout and PCB thermal pad design, whereas TO-220AC needs through-hole mounting and mechanical heatsinking. Interchange requires board redesign.

Does this diode require a gate resistor or snubber network?

No snubber or gate resistor is required. As a Schottky diode with no reverse recovery, STPSC406B-TR does not generate voltage spikes or ringing during turn-off. However, a small RC snubber (e.g., 100 Ω + 100 pF) across anode–cathode may still be used empirically to damp high-frequency parasitic oscillations in layouts with long traces or poor grounding.

How does the 3 nC capacitive charge affect MOSFET driver selection in a PFC controller?

The 3 nC Q_C contributes to the total capacitive load seen by the high-side MOSFET gate driver during turn-on. For a 100 kHz PFC operating at 50% duty cycle, this adds ~0.3 mA average gate drive current. Standard PFC controllers (e.g., L6562A, UCC28070) with ≥1 A peak gate drive capability handle this without issue, but low-current drivers (<500 mA peak) may require verification of rise/fall time margins.

STPSC406B-TR Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: SiC (Silicon Carbide) Schottky

Voltage - DC Reverse (Vr) (Max):: 600 V

Current - Average Rectified (Io):: 4A

Voltage - Forward (Vf) (Max) @ If:: 1.9 V @ 4 A

Speed:: No Recovery Time > 500mA (Io)

Reverse Recovery Time (trr):: 0 ns

Current - Reverse Leakage @ Vr:: 50 µA @ 600 V

Capacitance @ Vr, F:: 200pF @ 0V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DPAK

Operating Temperature - Junction:: -40°C ~ 175°C

STPSC406B-TR FAQ

1.How can I place an order for STPSC406B-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STPSC406B-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STPSC406B-TR reliable?

The price and inventory of STPSC406B-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STPSC406B-TR is usually 5 days.

3.What payment methods are accepted for STPSC406B-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STPSC406B-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STPSC406B-TR?

STPSC406B-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STPSC406B-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STPSC406B-TR?

For technical support, including STPSC406B-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STPSC406B-TR requirements.

6.How does Aetrix verify that STPSC406B-TR is sourced from the original manufacturer or authorized distributors?

All STPSC406B-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STPSC406B-TR meets industry standards.

7.What is the process for return or replacement of STPSC406B-TR?

All STPSC406B-TR units undergo pre-shipment inspection (PSI). If there is an issue with STPSC406B-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STPSC406B-TR part is unused and in its original packaging.

Return procedure for STPSC406B-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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