STMicroelectronics STPSC4H065B-TR
- Part No.:
- STPSC4H065B-TR
- Manufacturer:
- STMicroelectronics
- Category:
- Single Diodes
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
STPSC4H065B-TR.pdf
- Description:
- DIODE SIL CARBIDE 650V 4A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,101
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Product details
Overview
STPSC4H065B-TR from STMicroelectronics is a 4 A, 650 V silicon carbide (SiC) Schottky power diode in DPAK package, designed for high-frequency hard-switching PFC and DC-DC converters. It delivers zero reverse recovery charge, temperature-independent switching, 175 °C max junction temperature, and 200 pF junction capacitance at 0 V - enabling efficient operation in LLC and boost topologies.
For engineers reviewing the STPSC4H065B-TR datasheet, STPSC4H065B-TR pinout, STPSC4H065B-TR application, or STPSC4H065B-TR equivalent, key selection criteria include surge robustness (200 A IFSM), low forward voltage (1.56 V typ. @ 25 °C), insulated thermal performance, SiC-specific conduction loss modeling, and ECOPACK®2 compliance for industrial-grade reliability.
Technical Context
This SiC Schottky diode replaces conventional silicon fast recovery diodes in high-efficiency AC-DC front-ends. Its wide bandgap enables 650 V blocking with Schottky architecture - eliminating minority-carrier storage and associated reverse recovery losses. The device operates up to 175 °C junction temperature with stable VF and IR across temperature.
Dynamic behavior is defined by low capacitive charge (12.5 nC @ 400 V) and minimal voltage-dependent Cj variation (200 pF @ 0 V → 21 pF @ 400 V). Thermal resistance Rth(j-c) is 2.7 °C/W max in DPAK, supporting compact heatsink integration without derating penalties typical of silicon diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 650 V - Enables direct use in universal-input PFC stages without series stacking. |
| IF(AV) | 4 A @ Tc = 145 °C - Sustains continuous conduction in compact, thermally constrained layouts. |
| VF | 1.56 V typ. @ 4 A, 25 °C - Reduces conduction loss vs. Si FRD (≈0.5–0.8 V lower), improving system efficiency. |
| IFSM | 200 A @ 10 µs square pulse - Withstands high-energy transients during startup or overload without failure. |
| Cj | 200 pF @ 0 V, 1 MHz - Low capacitance minimizes turn-off dv/dt-induced displacement current and EMI. |
| Rth(j-c) | 2.7 °C/W max - Enables predictable thermal design with standard PCB copper area or small clip-on heatsinks. |
| Tj(max) | 175 °C - Allows operation in sealed enclosures or high-ambient environments without forced cooling. |
Pinout & Package
DPAK (TO-252) surface-mount package with three terminals: anode (pin 1), cathode (pin 2), and exposed thermal pad (pin 3, internally connected to cathode). The package provides 0.32 g mass, UL 94 V0 epoxy, and optimized thermal path via soldered pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Anode) | Current entry point under forward bias | Connected to input rail in boost/PFC; requires low-inductance trace routing to minimize ringing. |
| Pin 2 (Cathode) | Current exit point under forward bias; tied to thermal pad | Primary return path and thermal interface; must be fully soldered to ≥200 mm² copper pour for Rth(j-c) spec compliance. |
| Pin 3 (Thermal Pad) | Electrically common with cathode; mechanical thermal interface | Not isolated - must be routed as cathode net; solder mask opening required per ST layout guidelines (Fig. 14). |
Key Features
| Feature | Design Value |
|---|---|
| No reverse recovery charge (Qrr = 0) | Eliminates switching loss and EMI spikes in hard-switched PFC, enabling >98% efficiency at 100 kHz. |
| Temperature-stable switching | VF and Cj drift <±10% from 25 °C to 150 °C - avoids control loop instability in thermally varying systems. |
| High surge capability (200 A, 10 µs) | Survives line surges and inrush events without degradation - reduces need for parallel diode redundancy. |
| ECOPACK®2 compliance | Meets RoHS, halogen-free, and material declaration requirements for industrial and energy infrastructure deployments. |
| Low junction-to-case thermal resistance | 2.7 °C/W max enables 4 A operation with ≤35 °C temperature rise on 4-layer PCB - no external heatsink needed. |
Applications
| Server PSU PFC Stage | Industrial DC-DC Converter |
|---|---|
|
Use Scenario: Active clamp forward or interleaved boost PFC in 1–3 kW telecom/server PSUs operating at 65–100 kHz. IC Role / Device Role / Timing Role: Boost rectifier handling 4 A average output current with 200 A transient surges during brownout recovery. Use Value: Zero Qrr eliminates snubber losses and allows smaller EMI filters; 175 °C rating supports fanless operation. |
Use Scenario: Secondary-side synchronous rectification in isolated 48 V–12 V/54 A DC-DC modules for factory automation PLCs. IC Role / Device Role / Timing Role: Freewheeling diode in active clamp flyback, conducting during MOSFET off-time with 100 ns–1 µs transitions. Use Value: Stable Cj prevents timing jitter in gate drive feedback loops; low VF cuts conduction loss by 35% vs. Si FRD. |
| Solar Microinverter Boost | EV Onboard Charger (OBC) |
|
Use Scenario: MPPT boost stage in 300–600 W microinverters exposed to outdoor ambient up to 85 °C. IC Role / Device Role / Timing Role: High-side boost diode switching at 120–200 kHz with bidirectional thermal cycling. Use Value: Tj-independent VF ensures consistent efficiency across day/night cycles; 2500 VRMS insulation not required (non-isolated topology). |
Use Scenario: Front-end PFC in 6.6 kW OBCs where space constraints demand DPAK instead of TO-220AC Ins. IC Role / Device Role / Timing Role: Input rectifier in two-phase interleaved boost, sharing 4 A avg load with matched thermal profile. Use Value: 0.32 g mass and DPAK footprint reduce board weight/volume; ECOPACK®2 meets automotive chemical compliance (IMDS). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3D04065E (Wolfspeed) | Same 4 A/650 V rating; 1.75 V VF max @ 4 A, 25 °C (vs. 1.75 V for ST); 2.5 °C/W Rth(j-c) max | Requires larger thermal pad area due to higher Rth(j-c); identical DPAK footprint and pinout | Select when prioritizing vendor diversification with verified layout compatibility and same test conditions. |
| SS14HE3/52T (Vishay) | Si-based Schottky; 40 V VRRM, 1.1 V VF - not a voltage or technology match; only comparable in package size | Restricted to low-voltage (<60 V) DC-DC; cannot replace in 650 V PFC or boost | Reject for 650 V applications; only consider for cost-sensitive, low-voltage auxiliary rails where SiC benefits are unnecessary. |
Compared with C3D04065E, STPSC4H065B-TR offers tighter VF distribution (1.56 V typ.) and lower Rth(j-c), improving thermal margin in dense layouts; versus SS14HE3, it is not substitutable due to fundamental voltage and material limitations - SiC enables 650 V operation with zero Qrr, which Si Schottky cannot achieve.
Availability
STPSC4H065B-TR is available at Aetrix Electronics and suitable for server power supplies, industrial DC-DC converters, and solar microinverters requiring stable component supply, long-lifecycle support, and RoHS-compliant sourcing.
Supply support for STPSC4H065B-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power, analog, MEMS, and microcontroller technologies for industrial, automotive, and consumer markets.
This device belongs to ST's STPSC SiC Schottky diode product line, engineered specifically for high-efficiency, high-reliability AC-DC conversion in energy infrastructure and EV charging systems.
FAQ
Is STPSC4H065B-TR pin-compatible with standard DPAK silicon diodes?
No - while the DPAK outline matches JEDEC TO-252, the STPSC4H065B-TR has cathode-connected thermal pad (pin 3), unlike many Si diodes with isolated pads. Layout must route pin 3 as cathode net, not ground or isolation. ST's recommended footprint (DS9222 Fig. 14) mandates full-pad soldering for thermal spec compliance.
What is the maximum allowable case temperature for continuous 4 A operation?
The datasheet specifies IF(AV) = 4 A at Tc = 145 °C for DPAK. Exceeding this requires derating: at Tc = 125 °C, max IF(AV) drops to ≈3.2 A per Figure 4 interpolation. Thermal design must ensure case temperature stays ≤145 °C under worst-case airflow and ambient conditions.
Does this diode require a gate resistor or snubber network?
No - as a Schottky diode with no minority carriers, it has no gate and exhibits no reverse recovery. Snubbers are unnecessary unless parasitic ringing occurs from layout inductance; in such cases, a small RC damper (e.g., 10 Ω + 100 pF) across anode–cathode may suppress high-frequency oscillation without affecting conduction.
How does ECOPACK®2 compliance impact manufacturing process flow?
ECOPACK®2 certifies halogen-free epoxy, lead-free terminations, and full material disclosure per EU REACH/SVHC. No process changes are needed for standard Pb-free reflow (J-STD-020 profile), but users must verify solder paste compatibility with ST's specified NiPdAu plating and avoid chlorine-based flux residues that could degrade long-term reliability in humid environments.
STPSC4H065B-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):
- 650 V
- Current - Average Rectified (Io):
- 4A
- Voltage - Forward (Vf) (Max) @ If:
- 1.75 V @ 4 A
- Speed:
- No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):
- 0 ns
- Current - Reverse Leakage @ Vr:
- 40 µA @ 650 V
- Capacitance @ Vr, F:
- 200pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
- Operating Temperature - Junction:
- -40°C ~ 175°C
STPSC4H065B-TR FAQ
1.How can I place an order for STPSC4H065B-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STPSC4H065B-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STPSC4H065B-TR reliable?
The price and inventory of STPSC4H065B-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STPSC4H065B-TR is usually 5 days.
3.What payment methods are accepted for STPSC4H065B-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STPSC4H065B-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STPSC4H065B-TR?
STPSC4H065B-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STPSC4H065B-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STPSC4H065B-TR?
For technical support, including STPSC4H065B-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STPSC4H065B-TR requirements.
6.How does Aetrix verify that STPSC4H065B-TR is sourced from the original manufacturer or authorized distributors?
All STPSC4H065B-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STPSC4H065B-TR meets industry standards.
7.What is the process for return or replacement of STPSC4H065B-TR?
All STPSC4H065B-TR units undergo pre-shipment inspection (PSI). If there is an issue with STPSC4H065B-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STPSC4H065B-TR part is unused and in its original packaging.
Return procedure for STPSC4H065B-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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