STMicroelectronics STPST2H100ZF

Overview

STPST2H100ZF from STMicroelectronics is a 2 A, 100 V Schottky trench rectifier in SOD123Flat package, optimized for high-frequency SMPS with low conduction and switching losses. It features 0.620 V typical forward voltage at 2 A/125 °C, 175 °C max junction temperature, and avalanche-tested ruggedness for auxiliary power supplies in telecom and smart metering.

For engineers reviewing the STPST2H100ZF datasheet, STPST2H100ZF pinout, STPST2H100ZF application, or STPST2H100ZF equivalent, this device is selected for space-constrained DC/DC converters requiring low VF, high thermal robustness, and flat-package PCB footprint efficiency in flyback and OR-ing topologies.

Technical Context

This Schottky rectifier uses ST's proprietary trench technology to achieve superior VF/IR trade-off on minimal silicon area. Its low recovery charge and flat package geometry support high-frequency operation up to several hundred kHz in compact power stages.

The device operates reliably at Tj = 175 °C with Rth(j-l) = 15 °C/W (SOD123Flat), enabling direct lead-mount thermal dissipation without heatsinks in low-power auxiliary rails. Avalanche rating of 3 A (IAS) ensures robustness under unclamped inductive switching conditions.

Key Specifications

Pinout & Package

SOD123Flat surface-mount package: ultra-thin (0.86–1.10 mm height), 2.50–2.70 mm length, 1.50–1.80 mm width, cathode-marked anode-cathode dual-terminal configuration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with STPS2H100UF and SS210H, STPST2H100ZF delivers optimal balance of ultra-low VF, avalanche ruggedness, and minimal footprint-making it preferred for thermally constrained, high-reliability auxiliary supplies where space and transient immunity are co-critical.

Availability

STPST2H100ZF is available at Aetrix Electronics and suitable for DC/DC converters, LED lighting drivers, and auxiliary power supplies requiring stable component supply across industrial, telecom, and smart infrastructure programs.

Supply support for STPST2H100ZF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

STPST2H100ZF belongs to ST's trench Schottky rectifier product line, engineered specifically for high-efficiency, high-density switched-mode power supplies where low VF, fast recovery, and thermal resilience are mandatory.

FAQ

What is the maximum allowable PCB trace temperature for reliable operation?

The SOD123Flat package supports TL = 140 °C per datasheet absolute rating. At this lead temperature, IF(AV) remains 2 A with sufficient margin. For long-term reliability, maintain copper pour thermal vias under both leads and limit local board temperature to ≤130 °C to ensure 10-year MTBF in industrial environments.

Can STPST2H100ZF replace standard Schottky diodes in existing flyback designs?

Yes-STPST2H100ZF is a direct SOD123-compatible drop-in replacement for legacy 2 A/100 V Schottkys. Its lower VF (0.62 V vs. typical 0.75–0.85 V) reduces output loss, while its avalanche rating adds transient robustness absent in most planar equivalents. No layout change is needed.

Is thermal derating required above 100 °C ambient?

Derating is defined by lead temperature, not ambient. With 1 cm² copper per lead on FR4, Rth(j-a) ≈ 45 °C/W. At 100 °C ambient and 1.24 W dissipation, junction temperature reaches ~155 °C-within 175 °C limit. Full 2 A rating holds if TL ≤ 140 °C is maintained via copper area or airflow.

Does STPST2H100ZF require a heatsink in 2 A operation?

No heatsink is required. The SOD123Flat package achieves 15 °C/W junction-to-lead thermal resistance. With adequate PCB copper (≥1 cm² per lead), 2 A operation yields <20 °C temperature rise above lead temperature-well within safe operating area without additional thermal hardware.