My Inquiry
My Account
STMicroelectronics STTH12R06FP
- Part No.:
- STTH12R06FP
- Manufacturer:
- STMicroelectronics
- Category:
- Single Diodes
- Package:
- TO-220-2 Full Pack, Isolated Tab
- Datasheet:
-
STTH12R06FP.pdf
- Description:
- DIODE GP 600V 12A TO220FPAC
- Quantity:
- Payment:
- Shipping:
Inventory:442
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STTH12R06FP from STMicroelectronics is a 600 V, 12 A ultrafast high-voltage rectifier diode in TO-220FPAC package, optimized for continuous-conduction-mode PFC boost stages and hard-switching freewheeling applications. It delivers 25 ns max reverse recovery time, 1.4 V typical forward voltage at 125 °C, and 7.0 A peak reverse recovery current under 200 A/µs dIF/dt.
For engineers reviewing the STTH12R06FP datasheet, STTH12R06FP pinout, STTH12R06FP application, or STTH12R06FP equivalent, this device is selected for high-efficiency AC-DC front-ends where low trr, soft recovery (S factor = 0.2), and thermal robustness (Tj = 175 °C) directly impact switching loss and EMI performance.
Technical Context
This Turbo 2 silicon rectifier employs optimized carrier lifetime control to achieve ultrafast recovery with soft turn-off behavior-critical for reducing voltage overshoot and snubber stress in high-frequency PFC and SMPS topologies. Its 4.4 °C/W junction-to-case thermal resistance enables reliable operation at 50 °C case temperature under full 12 A average forward current.
Dynamic parameters are characterized across temperature and dIF/dt: trr increases only modestly with dIF/dt (e.g., 45 ns at 50 A/µs), while Qrr remains stable at ~180 nC and IRM peaks at 8.4 A-enabling predictable loss modeling using the provided conduction loss equation (P = 1.16 × IF(AV) + 0.053 × IF²(RMS)).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - Withstands repetitive reverse voltage up to 600 V, suitable for universal-input (85–265 VAC) PFC stages with 400 V DC bus margin. |
| IF(AV) | 12 A at Tc = 50 °C - Sustains 12 A average forward current with heatsink mounting at 50 °C case temperature. |
| trr (max) | 25 ns - Enables operation in >100 kHz PFC controllers without excessive switching loss or ringing. |
| VF (typ) | 1.4 V at Tj = 125 °C, IF = 12 A - Low conduction loss improves efficiency in high-current freewheeling paths. |
| Rth(j-c) | 4.4 °C/W - Junction-to-case thermal resistance confirms effective heat transfer to heatsink in TO-220FPAC package. |
| S factor | 0.2 - Soft recovery minimizes di/dt-induced voltage spikes and EMI generation during turn-off. |
| Qrr | 180 nC - Quantified reverse recovery charge used directly in loss calculations and snubber design. |
Pinout & Package
TO-220FPAC package: insulated plastic housing with integral heatsink tab (no separate insulator required), 3-pin through-hole mount, 0.4–0.6 N·m recommended torque, UL94 V0 epoxy.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (A) | Forward current entry terminal | Connected to switch node (e.g., MOSFET drain) in boost PFC; must handle surge current up to 100 A (IFSM). |
| Cathode (K) | Forward current exit terminal | Connected to output capacitor or inductor return; carries full load current and reverse recovery current. |
| Tab / Case | Thermal path & mechanical ground | Electrically isolated from both terminals; serves as primary heatsink interface with 2000 VDC insulation rating. |
Key Features
| Feature | Design Value |
|---|---|
| Ultrafast switching | 25 ns max trr ensures minimal overlap loss in hard-switched converters operating above 65 kHz. |
| Low thermal resistance | 4.4 °C/W Rth(j-c) allows 12 A continuous conduction with compact heatsinking at 50 °C ambient. |
| Soft reverse recovery | S factor = 0.2 reduces voltage overshoot and EMI, lowering snubber component stress and size. |
| High junction temperature rating | 175 °C Tj(max) supports operation in thermally constrained industrial power supplies without derating. |
| Insulated package | 2000 VDC isolation between tab and terminals eliminates need for mica washers or silicone pads. |
Applications
| Industrial AC-DC Power Supplies | Server & Telecom Rectification |
|---|---|
|
Use Scenario: Front-end boost PFC stage in 1–3 kW industrial SMPS with universal AC input. IC Role / Device Role / Timing Role: Ultrafast rectifier conducting during MOSFET off-time; recovers before next switching cycle begins. Use Value: 25 ns trr and soft recovery reduce switching losses by ≥15% vs. standard fast recovery diodes, improving system efficiency from 92% to 93.5%. |
Use Scenario: Output rectification in high-density telecom brick converters (e.g., 48 V output, 50–100 A). IC Role / Device Role / Timing Role: Freewheeling diode clamping inductive energy during synchronous rectifier dead time. Use Value: 7.0 A IRM and 180 nC Qrr enable precise snubber sizing, limiting voltage spike to <10% over 48 V rail under 200 A/µs dIF/dt. |
| EV Charger Onboard PFC | Renewable Energy Inverters |
|
Use Scenario: Boost PFC in 6.6 kW single-phase EV on-board charger operating at 100 kHz. IC Role / Device Role / Timing Role: High-reliability rectifier handling 12 A average current with 100 A surge capability during grid transients. Use Value: 175 °C Tj rating and 4.4 °C/W Rth(j-c) ensure stable operation without thermal throttling during sustained 6.6 kW charging cycles. |
Use Scenario: DC-link freewheeling path in string inverters for solar PV systems (600–1000 V DC bus). IC Role / Device Role / Timing Role: Clamp diode absorbing inductive kickback from transformer-coupled gate drivers and filter chokes. Use Value: 600 V VRRM and 2000 VDC tab isolation support safe operation in ungrounded DC strings with floating reference potentials. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH12R06D | Same die, TO-220AC package with non-insulated tab (2500 VRMS isolation requires external insulator). | Requires mica/silicone pad and washer; higher assembly cost but lower Rth(j-c) = 1.7 °C/W. | Select when thermal performance is critical and board-level insulation can be implemented reliably. |
| IXYS MUR1260CT | 600 V, 12 A dual common-cathode ultrafast diode; trr = 35 ns (max), VF = 1.7 V (typ) at 125 °C. | Higher conduction and switching losses; not soft-recovery (S factor not specified). | Acceptable for cost-sensitive designs where EMI and efficiency margins allow 10 ns slower recovery and 0.3 V higher VF. |
Compared with STTH12R06D, STTH12R06FP trades 2.7 °C/W higher thermal resistance for simplified assembly and guaranteed 2000 VDC isolation; versus MUR1260CT, it delivers superior softness and 10 ns faster recovery at lower VF-directly reducing both conduction and switching losses in high-frequency PFC.
Availability
STTH12R06FP is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, server/telecom rectification, and EV onboard chargers requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for STTH12R06FP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
This device belongs to ST's Turbo 2 ultrafast diode product line, engineered specifically for high-efficiency, high-frequency power conversion in PFC and SMPS applications demanding low trr, soft recovery, and rugged thermal performance.
FAQ
What is the maximum allowable case temperature for continuous 12 A operation?
The STTH12R06FP is rated for 12 A average forward current at Tc = 50 °C in TO-220FPAC package. Exceeding this temperature requires linear derating per Figure 2 in the datasheet; at Tc = 70 °C, maximum IF(AV) drops to approximately 8.5 A due to thermal limits and Rth(j-c) = 4.4 °C/W.
Does the TO-220FPAC package require an insulating pad when mounted to a heatsink?
No. The TO-220FPAC package provides 2000 VDC electrical isolation between the tab/case and both terminals, eliminating the need for mica or silicone insulating pads. This simplifies mechanical assembly and improves thermal interface consistency compared to standard TO-220AC variants.
How does the softness factor of 0.2 affect circuit design?
A softness factor of 0.2 indicates highly controlled, gradual carrier recombination during turn-off-reducing di/dt-induced voltage overshoot and high-frequency ringing. This lowers EMI filter requirements and allows smaller, lower-cost snubber networks compared to standard fast recovery diodes with S > 0.5.
Can STTH12R06FP replace STTH12R06G in D2PAK-based designs?
No. STTH12R06G uses D2PAK (TO-263) surface-mount packaging with different footprint, thermal path, and soldering requirements. While electrically identical, mechanical incompatibility prevents direct replacement; board redesign or adapter solution is required to migrate from D2PAK to TO-220FPAC.
STTH12R06FP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-220-2 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io):
- 12A
- Voltage - Forward (Vf) (Max) @ If:
- 2.9 V @ 12 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 45 ns
- Current - Reverse Leakage @ Vr:
- 45 µA @ 600 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220FPAC
- Operating Temperature - Junction:
- 175°C (Max)
STTH12R06FP FAQ
1.How can I place an order for STTH12R06FP through Aetrix?
Please submit a Request for Quotation (RFQ) for STTH12R06FP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STTH12R06FP reliable?
The price and inventory of STTH12R06FP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTH12R06FP is usually 5 days.
3.What payment methods are accepted for STTH12R06FP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTH12R06FP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STTH12R06FP?
STTH12R06FP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STTH12R06FP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STTH12R06FP?
For technical support, including STTH12R06FP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTH12R06FP requirements.
6.How does Aetrix verify that STTH12R06FP is sourced from the original manufacturer or authorized distributors?
All STTH12R06FP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTH12R06FP meets industry standards.
7.What is the process for return or replacement of STTH12R06FP?
All STTH12R06FP units undergo pre-shipment inspection (PSI). If there is an issue with STTH12R06FP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STTH12R06FP part is unused and in its original packaging.
Return procedure for STTH12R06FP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STTH12R06FP Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
