STMicroelectronics STTH16L06CG

Overview

STTH16L06CG from STMicroelectronics is a 600 V, 16 A ultrafast high-voltage rectifier diode in D2PAK package, optimized for discontinuous-mode PFC boost stages and secondary-side rectification in industrial switching power supplies. It delivers 1.05 V typical forward voltage at 150 °C, 35 ns max reverse recovery time, and 175 °C maximum junction temperature.

For engineers reviewing the STTH16L06CG datasheet, STTH16L06CG pinout, STTH16L06CG application, or STTH16L06CG equivalent, key selection criteria include ultrafast trr performance under high dIF/dt, low conduction loss at elevated Tj, thermal resistance (Rth(j-c) = 1.6 °C/W total), and D2PAK mounting compatibility with PCB copper area optimization.

Technical Context

This dual-die rectifier operates as a single anode–dual cathode configuration (A1/A2–K), enabling parallel conduction paths while maintaining shared thermal coupling. Its Turbo 2 process achieves low Qrr (typ. 70 nC at IF = 8 A, dIF/dt = 100 A/µs) and soft recovery (S factor > 0.8), reducing EMI in high-frequency SMPS.

The device is rated for 20 A average forward current per device at Tc = 120 °C in D2PAK, with Rth(j-c) = 1.6 °C/W total and Rth(c) = 0.7 °C/W coupling resistance - critical for thermal design in compact, convection-cooled industrial converters.

Key Specifications

Pinout & Package

D2PAK (TO-263AB) surface-mount package with isolated tab (pin 1 = Cathode K, pins 2 & 3 = Anodes A1 & A2). Thermal pad on underside requires soldered copper pour for optimal Rth(j-a) performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with STTH16L06CT and MUR1660CT, STTH16L06CG provides superior thermal performance in surface-mount designs, integrated dual-anode flexibility for interleaved topologies, and tighter trr control essential for EMI-sensitive industrial converters.

Availability

STTH16L06CG is available at Aetrix Electronics and suitable for industrial switching power supplies, active PFC modules, motor drive DC links, and welding equipment requiring stable component supply and long-term production continuity.

Supply support for STTH16L06CG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and power management applications.

The STTH series targets high-efficiency, high-reliability rectification in industrial-grade power conversion, emphasizing ultrafast recovery, thermal robustness, and package versatility across TO-220, TO-220FP, and D2PAK formats.

FAQ

What is the maximum continuous forward current rating for STTH16L06CG at 100 °C case temperature?

At Tc = 100 °C, STTH16L06CG supports 16 A average forward current per device (Table 2), verified by derating curves in Figure 1. This assumes proper PCB copper area (≥ 25 cm²) under the thermal pad and natural convection cooling. Exceeding this requires thermal simulation or forced-air validation.

Does STTH16L06CG have a common cathode or common anode configuration?

STTH16L06CG uses a common-cathode (K) configuration with two isolated anodes (A1 and A2), as shown in the pin diagram on page 6 of Doc ID 10760 Rev 2. This allows independent current paths into the same cathode node, supporting interleaved or redundant rectifier designs without external diode pairing.

Can STTH16L06CG replace STTH16L06CFP in a TO-220FPAB footprint?

No - STTH16L06CG uses D2PAK (TO-263AB) with 3 leads and exposed thermal pad, while STTH16L06CFP uses TO-220FPAB with 3 leads and insulated tab. Footprints, soldering profiles, and thermal interface requirements differ fundamentally; direct replacement would require PCB redesign and requalification.

What is the reverse recovery softness factor (S) of STTH16L06CG at 125 °C and 400 V reverse bias?

Per Figure 8, STTH16L06CG maintains S ≥ 0.85 at Tj = 125 °C and VR = 400 V across dIF/dt = 50–400 A/µs. This soft recovery characteristic limits di/dt-induced voltage ringing and reduces stress on adjacent switching devices in high-frequency PFC stages.