STMicroelectronics STTH16R04CG

Overview

STTH16R04CG from STMicroelectronics is a 400 V, 16 A dual common-cathode ultrafast recovery diode in D²PAK surface-mount package, featuring 25 ns typical reverse recovery time (trr), 0.9 V typical forward voltage (VF) at 8 A and 25 °C, and 175 °C maximum junction temperature - optimized for high-frequency freewheeling and base-drive circuits in low-voltage inverters.

For engineers reviewing the STTH16R04CG datasheet, STTH16R04CG pinout, STTH16R04CG application, or STTH16R04CG equivalent, key selection criteria include verified trr ≤ 35 ns at 125 °C, dual-diode thermal coupling behavior (Rth(c) = 0.3 °C/W), and D²PAK mounting compatibility with FR4 PCBs using ≥8.1 mm × 6.85 mm copper area per IEC 61249-2-21.

Technical Context

This device implements ST's planar platinum-doped silicon technology to achieve soft reverse recovery (Sfactor ≥ 0.4) and low conduction losses (P = 0.83 × IF(AV) + 0.034 × IF²(RMS)). Its dual-diode configuration shares a common cathode terminal, enabling synchronous rectification or complementary switching in half-bridge topologies.

Thermal design requires accounting for inter-diode coupling: ΔTj(diode1) = P(diode1) × 2 °C/W + P(diode2) × 0.3 °C/W. The D²PAK package delivers 1.15 °C/W junction-to-case thermal resistance per device under rated conditions, validated for continuous operation up to TC = 145 °C.

Key Specifications

Pinout & Package

D²PAK (TO-263) surface-mount package with three terminals: two anodes (A1, A2) and one common cathode (K). Requires solder footprint per Figure 13 (DocID13391 Rev 2, p.9): 8.1–8.9 mm (E1) × 6.85–7.25 mm (E2) copper area, 2.54 mm pitch (e), and 4.88–5.28 mm center-to-center spacing (e1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast dual-diode rectification applications.

Compared with STTH16R04CG, STTH16R04DJ trades surface-mount scalability for easier thermal testing and manual assembly, while MUR1640CT offers lower unit cost at the expense of 100 % higher trr and reduced high-temperature capability - making STTH16R04CG optimal for high-efficiency, high-reliability 100+ kHz power stages.

Availability

STTH16R04CG is available at Aetrix Electronics and suitable for industrial motor drives, solar inverters, and uninterruptible power supplies requiring stable component supply with D²PAK packaging and 175 °C junction temperature capability.

Supply support for STTH16R04CG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

The STTH series targets high-efficiency power conversion systems, with STTH16R04CG specifically engineered for ultrafast, soft-recovery rectification in space-constrained, thermally demanding applications such as server PSUs and renewable energy inverters.

FAQ

What is the maximum allowable case temperature for continuous operation of STTH16R04CG?

The STTH16R04CG is rated for continuous operation at TC = 145 °C per device when both diodes conduct 8 A average current each. At this condition, junction temperature remains within the 175 °C absolute maximum limit, assuming 1.15 °C/W thermal resistance and proper PCB copper area per datasheet Figure 11.

Can STTH16R04CG be used in parallel with another identical device to increase current capacity?

No - STTH16R04CG is not characterized for parallel operation. Its VF vs. temperature curve exhibits negative thermal coefficient, risking current imbalance. For >16 A applications, use a single higher-rated device such as STTH20R04CG or redesign with interleaved topology.

Is the D²PAK footprint compatible with standard reflow profiles for lead-free soldering?

Yes - the D²PAK package supports JEDEC J-STD-020D-compliant lead-free reflow profiles. Peak temperature must not exceed 260 °C for ≤60 seconds, and thermal gradient between tab and leads must stay below 3 °C/s to prevent delamination per ST's packaging guidelines in DocID13391 Rev 2, Section 2.1.

Does STTH16R04CG meet automotive AEC-Q101 qualification requirements?

No - STTH16R04CG is not AEC-Q101 qualified. It is specified for industrial and commercial applications only. For automotive-grade equivalents, consider ST's AEC-Q101-qualified STTH12R06DJ or STTH16R06DJ in TO-220AB, which share similar electrical specs but include extended temperature screening and failure analysis reporting.