STMicroelectronics STTH1R02A

Overview

STTH1R02A from STMicroelectronics is a 200 V, 1.5 A ultrafast recovery rectifier diode in SMA package, featuring 15 ns typical reverse recovery time, 0.7 V typical forward voltage at 25 °C, and 175 °C maximum junction temperature - optimized for high-frequency flyback and base-drive circuits in LED lighting and auxiliary power supplies.

For engineers reviewing the STTH1R02A datasheet, STTH1R02A pinout, STTH1R02A application, or STTH1R02A equivalent, key selection criteria include trr < 30 ns at 125 °C, VF ≤ 0.85 V at 100 °C/1.5 A, Rth(j-l) = 30 °C/W (SMA), ECOPACK®2 compliance, and DO-41/DO-15/SMB/SMA package interchangeability.

Technical Context

This planar Pt-doped silicon diode uses ST's 200 V ultrafast technology to minimize switching losses in hard-switched topologies. Its low QRR (typ. 15 nC at 125 °C) and controlled IRM (≤4 A) enable stable operation under high dIF/dt conditions up to –200 A/µs.

The device supports dual thermal paths: conduction-cooled via lead (Rth(j-l) = 30 °C/W for SMA) and ambient dissipation (Rth(j-a) varies with PCB copper area). Junction-to-lead resistance is validated per JEDEC JESD51-14 for transient thermal modeling.

Key Specifications

Pinout & Package

STTH1R02A is supplied in SMA (DO-214AC) surface-mount package with cathode-banded anode-cathode polarity. The package features UL94 V0 epoxy, lead-free terminations, and conduction-based cooling via leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast rectifier applications.

Compared with STTH1L06 and SS12, STTH1R02A uniquely balances 200 V blocking, 15 ns trr, and 0.7 V VF for cost-sensitive, thermally constrained 24–48 V LED and auxiliary supplies - offering optimal trade-off between efficiency, reliability, and voltage margin.

Availability

STTH1R02A is available at Aetrix Electronics and suitable for LED lighting drivers, flyback power supplies, and transistor base-clamp circuits requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for STTH1R02A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, power, MCU, and sensor solutions for automotive, industrial, and consumer markets.

STTH1R02A belongs to ST's ultrafast rectifier product line, engineered specifically for high-frequency switching power conversion where low trr, low VF, and high Tj are critical - targeting LED drivers, SMPS, and industrial auxiliary supplies.

FAQ

What is the maximum allowable surge current for STTH1R02A?

The STTH1R02A supports a non-repetitive surge forward current (IFSM) of 60 A for 10 ms sinusoidal waveform at 25 °C. This rating applies to short-duration events such as inrush or fault transients and must be derated linearly above 25 °C using the published thermal resistance curve.

Can STTH1R02A replace a standard fast recovery diode in a 100 kHz flyback design?

Yes - with trr = 15 ns (vs. 50–100 ns for standard fast diodes), STTH1R02A reduces switching loss and voltage overshoot significantly. At 100 kHz, its low QRR and IRM also lower EMI, allowing smaller snubbers and improved efficiency without redesigning layout or control loop.

Is STTH1R02A suitable for reflow soldering?

Yes - the SMA package is rated for standard Pb-free reflow profiles (J-STD-020, peak 260 °C). ST specifies lead-free terminations and UL94 V0 epoxy compatible with IPC-A-610 Class 2/3 assembly. Thermal pad clearance and footprint match JEDEC MS-013AA recommendations.

How does junction-to-lead thermal resistance affect PCB layout?

With Rth(j-l) = 30 °C/W, the SMA package relies on copper traces connected to both leads for heat extraction. Layout must use ≥1.5 mm² copper per lead (≥2 oz thickness) and avoid thermal isolation - insufficient copper raises junction temperature beyond 175 °C even at 1.5 A DC.