STMicroelectronics STTH1R04UY

Overview

STTH1R04UY from STMicroelectronics is an AEC-Q101-qualified ultrafast recovery silicon diode optimized for automotive switching-mode base drive and transistor circuits. It delivers 1 A average forward current, 400 V repetitive peak reverse voltage, 14 ns typical reverse recovery time (trr), and operates up to 175 °C junction temperature in SMB package.

For engineers reviewing the STTH1R04UY datasheet, STTH1R04UY pinout, STTH1R04UY application, or STTH1R04UY equivalent, key selection criteria include low conduction loss (VF = 0.9 V typ. at 25 °C), negligible switching losses, high thermal robustness, and compliance with automotive-grade reliability and ECOPACK®2 environmental standards.

Technical Context

This diode employs ST's planar platinum-doped technology to achieve ultrafast soft recovery with trr = 14 ns (typ.) at IF = 1 A, dIF/dt = −100 A/µs, VR = 30 V, enabling efficient operation in high-frequency inverters and freewheeling paths. Its low VF (0.9 V typ. at 25 °C) and high Tj(max) = 175 °C support compact thermal design in space-constrained automotive modules.

The device exhibits minimal reverse recovery charge (QRR) variation over temperature and dIF/dt, with IRM = 2.5–3.5 A at Tj = 125 °C, VR = 320 V, dIF/dt = −200 A/µs - critical for reducing EMI and voltage overshoot in inductive switching circuits.

Key Specifications

Pinout & Package

STTH1R04UY is housed in an SMB (DO-214AA) surface-mount package with two terminals: cathode (K) and anode (A). The SMB outline conforms to JEDEC DO-214AA standard, with body dimensions 3.30–3.95 mm × 5.10–5.60 mm × 1.90–2.45 mm and lead pitch 2.18 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast recovery diode applications.

Compared with STTH1L04S and MUR1040, STTH1R04UY offers the lowest combined conduction + switching loss in automotive 12 V/24 V systems above 300 kHz, with verified AEC-Q101 qualification and superior thermal dissipation in SMB package.

Availability

STTH1R04UY is available at Aetrix Electronics and suitable for automotive engine control units, LED headlamp drivers, 12 V DC-DC converters, and electric power steering gate drive circuits requiring stable component supply and long-term automotive lifecycle support.

Supply support for STTH1R04UY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

STTH1R04UY belongs to ST's Automotive Ultrafast Diode product line, engineered specifically for high-reliability, high-frequency switching in harsh automotive environments - emphasizing low trr, high Tj, and AEC-Q101 compliance.

FAQ

Is STTH1R04UY pin-compatible with STTH1R04AY?

No - STTH1R04UY uses SMB (DO-214AA) package while STTH1R04AY uses SMA (DO-214AC). Though electrically identical, their footprints differ: SMB has wider body (3.3–3.95 mm vs. 2.25–2.90 mm) and larger pad spacing (2.18 mm vs. 1.64 mm), requiring separate PCB layout.

What is the maximum allowable dIF/dt for reliable operation?

The datasheet specifies trr and IRM up to dIF/dt = −200 A/µs at Tj = 125 °C. Operation beyond this rate risks exceeding IRM = 3.5 A and inducing voltage overshoot >400 V; design margin recommends limiting dIF/dt to ≤−150 A/µs in unclamped inductive loads.

Does STTH1R04UY require a heatsink in 1 A continuous operation?

No - with Rth(j-l) = 25 °C/W and typical power dissipation of ~0.95 W (VF × IF(AV)), junction-to-lead temperature rise is ~24 °C. Using ≥1 cm² 35 µm copper per lead keeps Tj < 125 °C even at 70 °C ambient, eliminating need for external heatsink.

How does ECOPACK®2 compliance affect soldering profile?

ECOPACK®2 confirms halogen-free, lead-free construction compliant with J-STD-020D. Reflow must follow Pb-free profile: peak temperature 260 °C max, time above 217 °C ≤60 s, ramp rate ≤3 °C/s - no special preheat or soak required beyond standard SnAgCu profiles.