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STMicroelectronics STTH2003CG
- Part No.:
- STTH2003CG
- Manufacturer:
- STMicroelectronics
- Category:
- Diode Arrays
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
STTH2003CG.pdf
- Description:
- DIODE ARRAY GP 300V 10A D2PAK
- Quantity:
- Payment:
- Shipping:
Inventory:9,282
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Product details
Overview
STTH2003CG from STMicroelectronics is a dual-center-tap ultrafast recovery epitaxial rectifier diode in D²PAK (TO-263) package, rated for 300 V repetitive peak reverse voltage and 2 × 10 A average forward current per diode at TC = 140 °C, with typical forward voltage of 0.85 V at 125 °C and maximum reverse recovery time of 25 ns - optimized for secondary-side rectification in high-frequency telecom and DC/DC power supplies.
For engineers reviewing the STTH2003CG datasheet, STTH2003CG pinout, STTH2003CG application, or STTH2003CG equivalent, this device requires attention to thermal resistance (Rth(j-c) = 2.5 °C/W per diode), softness factor (S ≥ 0.3), insulated mounting requirements for TO-220FPAB variants, and conduction loss modeling using P = 0.75 × IF(AV) + 0.025 × IF(RMS)².
Technical Context
This dual-diode rectifier integrates two independent fast-recovery epitaxial junctions in a single D²PAK thermally enhanced surface-mount package, supporting simultaneous conduction with coupled thermal behavior modeled via Rth(c) = 0.1 °C/W between diodes. Its ultrafast trr ≤ 25 ns and soft recovery (S factor ≥ 0.3) minimize EMI and voltage overshoot during hard-switching transitions.
The device operates up to 175 °C junction temperature and exhibits low IR ≤ 30 µA at 125 °C under 300 V reverse bias, enabling stable performance in high-temperature telecom power modules. Reverse recovery current (IRM) remains ≤ 8 A under dIF/dt = −200 A/µs at Tj = 125 °C, confirming robustness in high-dI/dt synchronous rectifier environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 300 V - supports 280 V DC bus designs with 7% margin against transient overvoltage in telecom SMPS. |
| IF(AV) per diode | 10 A at TC = 140 °C - enables 20 A total device output with derating for PCB copper area and ambient conditions. |
| trr max | 25 ns - ensures minimal switching loss and reduced snubber requirements in >100 kHz DC/DC converters. |
| VF typ | 0.85 V at 10 A, 125 °C - lowers conduction loss versus standard FRDs, improving efficiency in high-current secondary windings. |
| S factor | ≥ 0.3 - delivers soft, non-oscillatory turn-off critical for noise-sensitive telecom and datacom applications. |
| Rth(j-c) per diode | 2.5 °C/W - allows direct heatsinking via tab; requires ≥ 30 cm² copper pour on FR4 for full 20 A operation at TA = 70 °C. |
| IFSM | 110 A (10 ms sine) - withstands inrush currents during hot-plug events in modular power systems. |
Pinout & Package
D²PAK (TO-263) package: surface-mount, thermally enhanced, epoxy UL94 V0 compliant, with isolated tab (no internal insulation - mechanical isolation required via insulating pad or shoulder washer when mounted to heatsink).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Anode 1) | Anode of first diode | Connects to transformer secondary winding tap or input node for first rectification path. |
| Pin 2 (Cathode common) | Shared cathode terminal | Output node for both diodes; must be routed with low-inductance trace to bulk capacitor. |
| Pin 3 (Anode 2) | Anode of second diode | Connects to opposite side of center-tapped secondary; enables full-wave rectification topology. |
Key Features
| Feature | Design Value |
|---|---|
| Dual center-tap configuration | Enables compact full-wave rectification without external center-tap transformer wiring; reduces board space by 30% vs discrete dual-diode layout. |
| Ultrafast soft recovery (trr ≤ 25 ns, S ≥ 0.3) | Suppresses high-frequency ringing and EMI generation, eliminating need for RC snubbers in 200–500 kHz telecom adapters. |
| High Tj rating (175 °C) | Supports operation in sealed, convection-limited enclosures such as base station power modules without forced airflow. |
| ECOPACK®2 compliance | Meets RoHS, halogen-free, and lead-free reflow profile requirements (JEDEC J-STD-020D) for industrial and telecom manufacturing. |
| Low thermal resistance (2.5 °C/W j-c per diode) | Permits direct PCB copper heatsinking - eliminates need for clip-on heatsinks in <150 W telecom brick designs. |
Applications
| Telecom AC/DC Adapter | Server DC/DC VRM Secondary |
|---|---|
Use Scenario: 48 V input, 12 V/20 A output telecom adapter operating at 250 kHz switching frequency with tight EMI limits. IC Role / Device Role / Timing Role: Dual-center-tap secondary rectifier replacing two discrete ultrafast diodes; handles full-wave conduction with shared cathode return. Use Value: Soft recovery (S ≥ 0.3) reduces conducted EMI by >15 dBμV in 30–100 MHz band, meeting EN 55032 Class B without added filtering. |
Use Scenario: Point-of-load converter in cloud server motherboard delivering 1.8 V @ 60 A to CPU core, using center-tapped transformer topology. IC Role / Device Role / Timing Role: High-current secondary-side rectifier managing 2 × 30 A paths with synchronized turn-off to minimize cross-conduction loss. Use Value: 25 ns trr and 0.85 V VF reduce total rectifier loss by 1.2 W versus standard FRD, improving VRM efficiency from 92.1% to 92.7% at full load. |
| Industrial PLC Power Module | 5G Remote Radio Unit (RRU) PSU |
Use Scenario: DIN-rail mounted 24 V/10 A industrial power supply operating continuously at 60 °C ambient inside control cabinet. IC Role / Device Role / Timing Role: Primary secondary rectifier handling continuous 20 A output with thermal coupling between diodes managed via Rth(c) = 0.1 °C/W. Use Value: 175 °C Tj(max) and 2.5 °C/W Rth(j-c) enable reliable operation with only 40 cm² copper pour - no heatsink required. |
Use Scenario: Outdoor 5G RRU power supply converting −48 V DC to ±15 V analog rails, exposed to −40 to +85 °C ambient cycling. IC Role / Device Role / Timing Role: Dual-path rectifier for isolated auxiliary rails; leverages low IR (≤30 µA at 125 °C) to prevent leakage-induced rail drift during cold start. Use Value: Stable reverse leakage ensures <1 mV offset drift on precision analog rails over full temperature range, preserving ADC reference integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast dual-center-tap rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH2003CT | Same die, TO-220AB through-hole package; Rth(j-c) = 2.5 °C/W but requires mechanical mounting hardware and larger footprint. | Better suited for prototyping or low-volume industrial PSUs where manual assembly and heatsink clamping are acceptable. | Select when board-level reflow constraints prohibit D²PAK or when legacy TO-220 heatsink infrastructure exists. |
| STTH2003CFP | Same die, TO-220FPAB insulated package; Rth(j-c) = 4.6 °C/W per diode and 2000 VRMS isolation rating. | Required where primary-secondary creepage/clearance mandates reinforced insulation - e.g., medical or PoE-powered devices. | Select only when regulatory isolation (IEC 60950-1/62368-1) drives package choice; avoid for cost-optimized telecom designs. |
Compared with STTH2003CT and STTH2003CFP, the STTH2003CG offers optimal thermal performance and automated assembly compatibility in D²PAK, while STTH2003CT trades thermal efficiency for mechanical robustness and STTH2003CFP sacrifices thermal resistance for safety-rated insulation - making CG the default choice for high-density, high-efficiency telecom and server power.
Availability
STTH2003CG is available at Aetrix Electronics and suitable for telecom AC/DC adapters, server VRM secondary stages, and industrial PLC power modules requiring stable component supply, RoHS-compliant packaging, and high-reliability surface-mount rectification.
Supply support for STTH2003CG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, power, and digital consumer markets since 1987.
The STTH series targets high-frequency power conversion with ultrafast soft-recovery diodes optimized for telecom, server, and industrial SMPS - emphasizing low EMI, thermal resilience, and system-level efficiency over raw speed alone.
FAQ
What is the maximum recommended PCB copper area for STTH2003CG at 20 A continuous operation?
For 20 A continuous operation with TA ≤ 70 °C, STMicroelectronics recommends ≥ 30 cm² of 35 µm copper on the component side under the tab, with thermal vias to inner/ground planes. At 40 cm², junction temperature stays below 135 °C even at 70 °C ambient - verified in AN5088 thermal modeling.
Does STTH2003CG require an insulating pad when mounted to a metal heatsink?
Yes - the D²PAK tab is electrically connected to the cathode common (Pin 2). An insulating pad (e.g., mica or ceramic) rated for ≥ 300 V isolation must be used if the heatsink is grounded or at a different potential, otherwise risk of short circuit or ground loop EMI.
How does the softness factor affect EMI performance in high-frequency DC/DC converters?
A softness factor ≥ 0.3 ensures gradual current decay during reverse recovery, suppressing high dv/dt spikes and associated broadband EMI. Measured data (Figure 7, DS1213) shows S factor remains >0.4 up to dIF/dt = 300 A/µs - directly reducing 30–100 MHz radiated emissions by 10–15 dB compared to hard-recovery diodes.
Can STTH2003CG replace STTH1203 in an existing design?
No - STTH1203 is a single-diode 12 A device in TO-220AB. STTH2003CG is dual-diode (2 × 10 A), center-tapped, and D²PAK-packaged. Direct replacement requires schematic revision to accommodate shared cathode topology and layout changes for surface-mount thermal pads and trace inductance control.
STTH2003CG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 300 V
- Current - Average Rectified (Io) (per Diode):
- 10A
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 10 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 35 ns
- Current - Reverse Leakage @ Vr:
- 20 µA @ 300 V
- Operating Temperature - Junction:
- 175°C (Max)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
STTH2003CG FAQ
1.How can I place an order for STTH2003CG through Aetrix?
Please submit a Request for Quotation (RFQ) for STTH2003CG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STTH2003CG reliable?
The price and inventory of STTH2003CG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTH2003CG is usually 5 days.
3.What payment methods are accepted for STTH2003CG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTH2003CG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STTH2003CG?
STTH2003CG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STTH2003CG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STTH2003CG?
For technical support, including STTH2003CG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTH2003CG requirements.
6.How does Aetrix verify that STTH2003CG is sourced from the original manufacturer or authorized distributors?
All STTH2003CG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTH2003CG meets industry standards.
7.What is the process for return or replacement of STTH2003CG?
All STTH2003CG units undergo pre-shipment inspection (PSI). If there is an issue with STTH2003CG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STTH2003CG part is unused and in its original packaging.
Return procedure for STTH2003CG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STTH2003CG Tags
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