STMicroelectronics STTH25M06FP

Overview

STTH25M06FP from STMicroelectronics is a 600 V, 25 A ultrafast recovery power rectifier in TO-220FPAC package, designed for high-frequency boost and LLC clamping circuits in telecom power supplies and air conditioning systems. It delivers 25 ns typical reverse recovery time, 1.6 V typical forward voltage at 25 °C, and supports 175 °C maximum junction temperature with robust overcurrent capability.

For engineers reviewing the STTH25M06FP datasheet, STTH25M06FP pinout, STTH25M06FP application, or STTH25M06FP equivalent, key selection criteria include reverse recovery softness (SFACTOR >0.5), low conduction loss (VF ≤2.0 V @150 °C/25 A), thermal resistance (Rth(j-c) = 2.45 °C/W), and ECOPACK2 compliance for industrial-grade reliability.

Technical Context

This diode employs ST's proprietary ultrafast technology to minimize switching losses in hard-switched PFC and resonant LLC topologies. Its soft recovery behavior suppresses voltage overshoot and EMI during turn-off, while the 170 A non-repetitive surge rating enables handling of transient overloads in AC-DC front-ends.

The TO-220FPAC package provides direct metal tab mounting for efficient conduction cooling, with validated thermal impedance curves supporting pulse-width-dependent derating. Dynamic parameters-including Qrr = 250 nC and IRM = 7 A at 125 °C-are characterized across dIF/dt up to 200 A/µs and VR up to 400 V.

Key Specifications

Pinout & Package

STTH25M06FP uses the TO-220FPAC package: insulated plastic case with metal tab (cathode-connected), three-terminal configuration, and screw-mounting capability (recommended torque: 0.55 N·m). The package meets UL 94 V0 flammability rating and supports conduction-based cooling only.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage diode applications.

Compared with STTH25M06FP, STTH25L06FP trades recovery softness for lower forward drop, while IXYS MUR2560CT offers lower cost but lacks documented soft recovery and thermal pulse performance-making STTH25M06FP optimal for high-frequency, EMI-sensitive, and thermally constrained applications.

Availability

STTH25M06FP is available at Aetrix Electronics and suitable for telecom AC-DC power supplies, air conditioning inverter PFC stages, and industrial UPS boost converters requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for STTH25M06FP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, microcontrollers, and automotive ICs with vertical manufacturing capabilities.

STTH25M06FP belongs to ST's ultrafast power diode product line, engineered specifically for high-efficiency, high-frequency AC-DC conversion in industrial and telecom infrastructure where soft recovery and thermal robustness are critical.

FAQ

What is the maximum allowable case temperature for STTH25M06FP during continuous operation?

The TO-220FPAC package has a maximum junction temperature of 175 °C. With Rth(j-c) = 2.45 °C/W, the maximum case temperature depends on power dissipation: for 25 A average current and VF ≈1.6 V, conduction loss is ~40 W, limiting case temperature to ≤76 °C without additional heatsinking. Derating curves in Figure 13 confirm safe operation up to 100 °C case with appropriate thermal interface materials.

Can STTH25M06FP replace STTH25M06 in existing DPAK-based designs?

No-STTH25M06FP uses TO-220FPAC (insulated tab, screw-mount), while STTH25M06 uses DPAK (surface-mount, non-insulated). Mechanical footprint, thermal interface, and mounting method differ fundamentally. Electrical specs are identical, but board layout, heatsinking, and mechanical retention require redesign. No pin-to-pin compatibility exists between these packages.

How does the soft recovery characteristic impact EMI in LLC resonant converters?

Soft recovery (SFACTOR >0.5) limits di/dt during turn-off, suppressing high-frequency current spikes that excite parasitic LC networks. Measured data (Figure 9) shows SFACTOR remains >0.6 up to dIF/dt = 200 A/µs, directly reducing 30–100 MHz radiated emissions. This eliminates need for large RC snubbers in compact server PSU designs, saving board space and improving efficiency.

Is STTH25M06FP qualified for use in outdoor telecom equipment exposed to 85 °C ambient?

Yes-its 175 °C Tj(max) and validated thermal curves (Figures 4–5) support operation at 85 °C ambient when mounted on ≥25 cm² copper area with 35 µm thickness (Rth(j-a) ≈35 °C/W per Figure 12). At 25 A/1.6 V, junction temperature reaches ~142 °C, leaving 33 °C margin below limit. Derating to 22 A is recommended for 10-year reliability under continuous 85 °C ambient.