STMicroelectronics STTH3002G

Overview

STTH3002G from STMicroelectronics is an ultrafast recovery silicon diode optimized for high-frequency switching applications including low-voltage inverters, freewheeling paths, and polarity protection circuits. It features a 200 V repetitive peak reverse voltage (V_RRM), 30 A average forward current (I_F(AV)), 22 ns typical reverse recovery time (t_rr), 0.77 V typical forward voltage at 125 °C/25 A, and a D²PAK (TO-263) surface-mount package rated to 175 °C junction temperature.

For engineers reviewing the STTH3002G datasheet, STTH3002G pinout, STTH3002G application, or STTH3002G equivalent, key selection criteria include conduction loss modeling (P = 0.67 × I_F(AV) + 0.007 × I_F(RMS)²), thermal resistance (R_th(j–c) = 1.2 °C/W), and dynamic performance under dI_F/dt stress up to 200 A/µs.

Technical Context

The STTH3002G employs platinum-doped planar junction technology to achieve negligible switching losses and low forward/reverse recovery times. Its 22 ns t_rr (at I_F = 1 A, dI_F/dt = −200 A/µs, V_R = 30 V, T_j = 25 °C) and 7.6–9.5 A peak reverse recovery current (I_RM) at 125 °C enable efficient operation in hard-switched SMPS and motor drive snubbers.

Thermal design is supported by a low junction-to-case thermal resistance of 1.2 °C/W and a maximum operating junction temperature of 175 °C. The device's 0.85 V max forward voltage at 125 °C/25 A and 20 µA max reverse leakage at 150 °C ensure stable conduction across industrial temperature ranges.

Key Specifications

Pinout & Package

STTH3002G is housed in a D²PAK (TO-263) thermally enhanced surface-mount package with three terminals: anode, cathode, and exposed metal tab (cathode-connected). The package features a lead-free ECOPACK® finish and is designed for solder reflow on FR4 PCBs with ≥10 cm² copper area under the tab to achieve rated thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast recovery diode applications.

Compared with MUR3020CT and VS-30CPH02-M3, STTH3002G delivers the lowest combined conduction–switching loss in compact D²PAK form factor, making it optimal for space-constrained, high-efficiency 100–200 kHz industrial power stages.

Availability

STTH3002G is available at Aetrix Electronics and suitable for DC-DC converters, motor drives, solar microinverters, and industrial UPS systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for STTH3002G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, MCU, and sensor solutions for industrial, automotive, and consumer markets.

The STTH series targets high-efficiency power conversion with ultrafast recovery diodes engineered specifically for low-loss switching in SMPS, motor control, and renewable energy systems.

FAQ

What is the maximum recommended PCB copper area for STTH3002G thermal performance?

The datasheet specifies that a minimum 10 cm² copper area under the D²PAK tab achieves the rated R_th(j–c) = 1.2 °C/W. For sustained 30 A operation, ST recommends ≥16.9 mm × 10.3 mm (174 mm²) copper pour with 35 µm thickness, verified in Figure 10. Smaller areas increase thermal resistance linearly-e.g., 5 cm² raises R_th(j–c) to ~1.8 °C/W.

Does STTH3002G support reflow soldering per JEDEC J-STD-020?

Yes-STTH3002G is qualified for lead-free reflow per JEDEC J-STD-020D. Peak temperature is 260 °C (10 s max), with ramp rates ≤3 °C/s pre-peak and ≤6 °C/s post-peak. The ECOPACK® marking on the package and inner box label confirms compliance, and moisture sensitivity level is MSL 1 (unlimited floor life).

How does reverse recovery behavior change at elevated junction temperature?

At 125 °C, t_rr increases to 27 ns (max) and I_RM rises to 9.5 A (max) under IF = 30 A, dI_F/dt = 200 A/µs, VR = 160 V conditions (Table 4). Q_RR also increases ~2.5× versus 25 °C, as shown in Figure 6-designers must verify snubber sizing at worst-case T_j.

Can STTH3002G replace older STTH3002W in DO-247 package?

No-while electrically identical, STTH3002G (D²PAK) and STTH3002W (DO-247) have incompatible footprints and thermal interfaces. DO-247 requires bolt-down heatsinking; D²PAK relies on PCB copper. Board redesign is mandatory. Electrical specs match, but thermal validation must be repeated for each package.