STMicroelectronics STTH3010PI

Overview

STTH3010PI from STMicroelectronics is an ultrafast recovery, high-voltage silicon rectifier diode in insulated DOP3I package, rated for 1000 V repetitive peak reverse voltage, 30 A average forward current (at Tc = 65 °C), and 42 ns typical reverse recovery time at 125 °C. It delivers soft recovery behavior (S factor = 1), low conduction losses (VF = 1.30 V typ. at 30 A, 150 °C), and 2500 VRMS electrical insulation - ideal for industrial snubber circuits and high-reliability freewheeling in motor drives.

For engineers reviewing the STTH3010PI datasheet, STTH3010PI pinout, STTH3010PI application, or STTH3010PI equivalent, key selection criteria include its insulated package thermal performance (Rth(j-c) = 1.8 °C/W), soft-switching capability under high dIF/dt (−200 A/µs), junction temperature rating up to 175 °C, and validated use in 600 V-class flyback and boost converters requiring low IRM and controlled trr.

Technical Context

This diode employs a platinum-doped silicon process to achieve ultrafast, soft reverse recovery with minimal tail current - critical for reducing EMI and switching losses in hard-switched PFC and DC-DC stages. Its dynamic parameters are characterized at high stress conditions: trr = 42 ns (IF = 1 A, dIF/dt = −200 A/µs, VR = 30 V, Tj = 25 °C) and IRM = 24–32 A (IF = 30 A, dIF/dt = −200 A/µs, VR = 600 V, Tj = 125 °C).

The DOP3I package integrates reinforced electrical insulation (2500 VRMS, 12 pF capacitance) and a thermally optimized copper baseplate, enabling direct heatsink mounting without additional isolation hardware. Junction-to-case thermal resistance is 1.8 °C/W, supporting sustained 30 A operation at Tc ≤ 65 °C while maintaining Tj ≤ 175 °C.

Key Specifications

Pinout & Package

DOP3I is an insulated TO-247 variant with electrically isolated metal tab, designed for direct heatsink mounting without thermal pad or insulator. Package dimensions: 20.4–21.1 mm length, 15.1–15.5 mm width, 14.35–15.6 mm height; weight: 4.46 g; UL94 V0 epoxy encapsulation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage diode applications.

Compared with STTH3010W and MUR3010CT, STTH3010PI uniquely combines certified 2500 VRMS insulation, soft recovery (S = 1), and 42 ns trr - making it optimal for space-constrained, safety-critical auxiliary supplies and isolated snubbers where layout simplification and EMI reduction are mandatory.

Availability

STTH3010PI is available at Aetrix Electronics and suitable for industrial motor drives, high-voltage auxiliary power supplies, and IGBT snubber networks requiring stable component supply, long-lifecycle assurance, and traceable sourcing.

Supply support for STTH3010PI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

The STTH series targets high-reliability industrial rectification, emphasizing ultrafast soft recovery, high-temperature operation, and rugged packaging - specifically engineered for mission-critical power conversion in motor control, renewable energy, and factory automation.

FAQ

What is the maximum allowable case temperature for continuous 30 A operation?

The STTH3010PI is rated for 30 A average forward current only when case temperature (Tc) is maintained at ≤ 65 °C, per Table 1. Exceeding this requires derating - e.g., at Tc = 80 °C, IF(AV) drops to ~22 A. Thermal design must ensure Rth(j-c) × Ploss + Tc ≤ 175 °C.

Does the DOP3I package require thermal compound between tab and heatsink?

Yes - although the DOP3I tab is electrically isolated, thermal interface material (TIM) is required for efficient heat transfer. ST recommends standard silicone-based thermal paste or phase-change pads; torque must not exceed 1.0 Nm to avoid package cracking.

Can STTH3010PI replace STTH3010D in existing TO-220AC layouts?

No - STTH3010PI uses DOP3I (insulated TO-247) footprint and mounting holes, incompatible with TO-220AC PCB land patterns or screw-hole spacing. Mechanical redesign and thermal validation are required; electrical specs alone do not guarantee drop-in replacement.

How does softness factor S = 1 impact EMI in high-frequency converters?

An S factor of 1 indicates purely soft, zero-tail-current recovery - eliminating high-frequency ringing caused by abrupt current collapse. This reduces common-mode noise by up to 15 dB in 100–500 kHz range, easing compliance with EN 55011 Class A conducted emissions limits without added filtering.