My Inquiry
My Account
STMicroelectronics STTH30AC06CP
- Part No.:
- STTH30AC06CP
- Manufacturer:
- STMicroelectronics
- Category:
- Diode Arrays
- Package:
- TO-3PF
- Datasheet:
-
STTH30AC06CP.pdf
- Description:
- DIODE ARRAY GP 600V 15A TO-3PF
- Quantity:
- Payment:
- Shipping:
Inventory:3,752
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STTH30AC06CP from STMicroelectronics is a 600 V, 2 × 15 A ultrafast dual common-cathode high-voltage rectifier diode in insulated TO-3PF package, designed for continuous-mode interleaved PFC boost stages in air conditioning inverters. It delivers typ. 40 ns reverse recovery time, 1.15 V forward voltage at 15 A/150 °C, and 2.7 °C/W total junction-to-case thermal resistance.
For engineers reviewing the STTH30AC06CP datasheet, STTH30AC06CP pinout, STTH30AC06CP application, or STTH30AC06CP equivalent, this device is selected for high-efficiency, thermally constrained PFC designs requiring low conduction loss, fast soft recovery, and reinforced isolation in industrial HVAC systems.
Technical Context
This dual-diode rectifier employs ST's Turbo 2 600 V technology to achieve ultrafast soft recovery (typ. 40 ns trr, SFACTOR > 1.0) with low IR (≤400 µA @ 150 °C) and low VF (1.15 V @ 15 A/150 °C). Its common-cathode configuration supports interleaved PFC topologies where two boost phases share a single output node.
The TO-3PF package provides 2500 VDC insulation between mounting base and internal die, enabling direct heatsink mounting without additional isolation hardware. Thermal coupling (Rth(c) = 1.9 °C/W) and low Rth(j-c) = 2.7 °C/W per device support high-power density operation up to 175 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - Withstands repetitive reverse voltage in PFC bus applications up to 400 V DC-link with margin. |
| IF(AV) per device | 30 A - Total average forward current capacity across both diodes, supporting 2.5–3 kW interleaved PFC stages. |
| trr (typ) | 40 ns - Enables high-frequency switching (>100 kHz) with minimal turn-off loss and EMI generation. |
| VF (typ @ 15 A, 150 °C) | 1.15 V - Reduces conduction loss to ~17 W per diode at full load, critical for thermal management in sealed AC units. |
| Rth(j-c) total | 2.7 °C/W - Allows direct mounting on aluminum heatsinks with ≤80 °C rise at 30 A avg., avoiding forced-air cooling. |
| IR @ 150 °C | 400 µA - Limits leakage-induced power loss and thermal runaway risk in high-temperature compressor environments. |
| Isolation voltage | 2500 VDC - Eliminates need for insulating pads or bushings when mounted to grounded chassis in Class I appliances. |
Pinout & Package
STTH30AC06CP uses the insulated TO-3PF package: metal base serves as common cathode (K), with two anode terminals (A1, A2) electrically isolated from base and each other. Mounting hole center aligns with cathode plane; insulation rating applies between base and all leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Anode 1 | Connects to Phase 1 boost switch output; enables independent current path for interleaved PFC leg 1. |
| A2 | Anode 2 | Connects to Phase 2 boost switch output; enables independent current path for interleaved PFC leg 2. |
| K (base) | Common cathode | Electrically isolated metal case; serves as shared output node tied to PFC capacitor positive rail and heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| Ultrafast soft recovery | trr = 40 ns typ. with SFACTOR > 1.0 ensures low EMI and reduced snubber losses in 100–200 kHz PFC converters. |
| Low VF at high Tj | 1.15 V @ 15 A/150 °C maintains efficiency in thermally stressed AC compressor enclosures without derating. |
| Insulated TO-3PF package | 2500 VDC isolation allows direct bolt-down to grounded heatsink-no insulator required, simplifying mechanical design. |
| Low thermal resistance | Rth(j-c) = 2.7 °C/W total enables 30 A operation with <80 °C junction rise using passive heatsinking only. |
| Dual common-cathode topology | Single-package integration of two matched diodes reduces PCB area and parasitic inductance vs. discrete solutions. |
Applications
| Interleaved PFC Boost Stage | Air Conditioner Inverter Module |
|---|---|
Use Scenario: Two-phase interleaved boost converter operating at 100–150 kHz in split-system HVAC outdoor units. IC Role / Device Role / Timing Role: Dual ultrafast rectifier providing synchronous freewheeling and output rectification per phase. Use Value: 40 ns trr and soft recovery reduce switching loss by ≥35% vs. standard fast diodes, lowering heatsink mass by 40%. |
Use Scenario: High-reliability DC-link rectification in variable-speed compressor drives exposed to ambient >65 °C. IC Role / Device Role / Timing Role: Common-cathode output diode handling bidirectional energy flow during regenerative braking events. Use Value: 175 °C max Tj and 400 µA IR at 150 °C prevent thermal runaway under sustained overload and high-humidity conditions. |
| Industrial Power Supply | UPS Input Rectification |
Use Scenario: 3 kW telecom rectifier with active PFC front-end requiring low-conduction-loss diodes. IC Role / Device Role / Timing Role: Interleaved boost diode delivering 30 A avg. output with <1.2 V VF across full temperature range. Use Value: 2.7 °C/W Rth(j-c) enables 92% system efficiency at full load without fan cooling, meeting NEBS Level 3. |
Use Scenario: Online UPS input stage rectifying 3-phase utility power with hold-up time >15 ms. IC Role / Device Role / Timing Role: Freewheeling diode in boost-derived input stage managing reactive energy during line sags. Use Value: 140 A IFSM and soft recovery suppress voltage spikes during 10 ms surge events, protecting downstream IGBTs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast dual-diode PFC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS MUR3060CT | 600 V, 30 A dual, trr = 60 ns (typ), VF = 1.75 V @ 15 A/125 °C, non-insulated TO-247 package. | Requires external insulator for heatsink mounting; higher VF increases conduction loss by ~2.1 W per diode at 15 A. | Select when cost sensitivity outweighs thermal/isolation advantages and board layout accommodates isolation hardware. |
| Vishay VS-30CPH06 | 600 V, 30 A dual, trr = 45 ns (typ), VF = 1.25 V @ 15 A/125 °C, insulated TO-247AC package rated 2000 VDC. | Lower isolation voltage (2000 VDC) limits use in Class II or high-altitude installations; slightly slower recovery. | Select when existing TO-247AC footprint reuse is mandatory and 2000 VDC isolation suffices for safety certification. |
Compared with MUR3060CT and VS-30CPH06, STTH30AC06CP uniquely combines 2500 VDC isolation, 40 ns trr, and 1.15 V VF at 150 °C-enabling smaller heatsinks, lower EMI filtering cost, and simplified safety compliance in premium HVAC and industrial PFC designs.
Availability
STTH30AC06CP is available at Aetrix Electronics and suitable for air conditioning equipment, industrial power supplies, and UPS input rectification requiring stable component supply, long-lifecycle assurance, and traceable sourcing for high-reliability deployments.
Supply support for STTH30AC06CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
STTH30AC06CP belongs to ST's Turbo 2 ultrafast diode product line, engineered specifically for high-efficiency, high-power-density PFC and output rectification in HVAC, server PSUs, and renewable energy inverters.
FAQ
What is the maximum recommended mounting torque for STTH30AC06CP?
The TO-3PF package specifies a recommended torque range of 0.8 to 1.0 N·m for the mounting screw. Exceeding 1.0 N·m risks cracking the epoxy body or deforming the base, compromising thermal contact and 2500 VDC isolation integrity. Use a calibrated torque screwdriver and verify flatness of heatsink surface before assembly.
Can STTH30AC06CP replace single-diode TO-247 parts in existing PFC designs?
No-STTH30AC06CP is a dual-anode/common-cathode device; replacing a single-diode part requires circuit redesign to accommodate the shared cathode and separate anodes. It is intended for interleaved topologies, not drop-in substitution in single-phase boost stages.
How does the 2500 VDC insulation rating impact PCB layout?
The 2500 VDC isolation eliminates creepage/clearance requirements between the TO-3PF base and PCB ground plane. Layout can place the device directly over grounded copper pour, reducing thermal resistance by up to 0.5 °C/W versus insulated-mount alternatives-no slotting or isolation gaps needed.
Is STTH30AC06CP compliant with RoHS and REACH regulations?
Yes-STTH30AC06CP carries ECOPACK2 environmental compliance, meeting RoHS Directive 2011/65/EU (Pb-free, Cd-free, Hg-free, Cr⁶⁺-free, PBB/PBDE-free) and REACH SVHC thresholds. Full material declarations and test reports are available via ST's Quality Portal upon customer registration.
STTH30AC06CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-3PF
- Packaging:
- Tube
- Product Status:
- Obsolete
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io) (per Diode):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 1.95 V @ 15 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 55 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 600 V
- Operating Temperature - Junction:
- -65°C ~ 175°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-3PF
STTH30AC06CP FAQ
1.How can I place an order for STTH30AC06CP through Aetrix?
Please submit a Request for Quotation (RFQ) for STTH30AC06CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STTH30AC06CP reliable?
The price and inventory of STTH30AC06CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTH30AC06CP is usually 5 days.
3.What payment methods are accepted for STTH30AC06CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTH30AC06CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STTH30AC06CP?
STTH30AC06CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STTH30AC06CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STTH30AC06CP?
For technical support, including STTH30AC06CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTH30AC06CP requirements.
6.How does Aetrix verify that STTH30AC06CP is sourced from the original manufacturer or authorized distributors?
All STTH30AC06CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTH30AC06CP meets industry standards.
7.What is the process for return or replacement of STTH30AC06CP?
All STTH30AC06CP units undergo pre-shipment inspection (PSI). If there is an issue with STTH30AC06CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STTH30AC06CP part is unused and in its original packaging.
Return procedure for STTH30AC06CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STTH30AC06CP Tags
-
BAV99-7-F
Diodes Incorporated
-
BAT54C-7-F
Diodes Incorporated
-
BAV99,215
Nexperia USA Inc.
-
BAT54SLT1G
onsemi
-
BAV70LT1G
onsemi
-
BAT54CLT1G
onsemi
-
BAT54S-7-F
Diodes Incorporated
-
BAV99LT1G
onsemi
-
BAT54S,215
Nexperia USA Inc.
-
BAS40-04LT1G
onsemi
-
MMBD1503-TP
Micro Commercial Co
-
BAV99WT1G
onsemi
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
