STMicroelectronics STTH30L06CT

Overview

STTH30L06CT from STMicroelectronics is a dual common-cathode ultrafast high-voltage silicon rectifier diode in D²PAK package, rated for 600 V repetitive peak reverse voltage and 30 A total average forward current (2 × 15 A per diode at TC = 140 °C), with typical forward voltage of 0.95 V at 15 A and 150 °C, and maximum reverse recovery time of 55 ns - optimized for boost diodes in discontinuous/critical-mode PFC circuits.

For engineers reviewing the STTH30L06CT datasheet, STTH30L06CT pinout, STTH30L06CT application, or STTH30L06CT equivalent, key selection criteria include conduction loss modeling (P = 0.94 × IF(AV) + 0.017 × IF²(RMS)), thermal resistance (Rth(j–c) = 1.7 °C/W per diode), soft recovery behavior, and dual-diode layout suitability for interleaved or phase-shifted topologies.

Technical Context

This dual-diode rectifier employs ST's Turbo 2 600 V technology to achieve low Qrr and soft reverse recovery (S factor > 1.0 at 500 A/µs), minimizing EMI and snubber stress in high-frequency switching converters. Its low VF and tight trr distribution support efficiency targets in 65–100 kHz PFC stages.

The device features isolated thermal paths: junction-to-case resistance is specified per diode (1.7 °C/W), while coupling resistance (0.6 °C/W) enables accurate ΔTj estimation when both diodes conduct simultaneously - critical for thermal derating in compact power supplies.

Key Specifications

Pinout & Package

STTH30L06CT is housed in a surface-mount D²PAK (TO-263) package with three terminals: two anodes (A1, A2) and one common cathode (K). The package uses copper-tab thermal conduction and meets UL 94 V0 epoxy rating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast dual-diode rectifier applications.

Compared with STTH30L06CW and IXYS MUR3060CT, STTH30L06CT delivers superior thermal management per diode, tighter trr consistency, and lower VF at elevated temperature - making it optimal for high-density, high-efficiency PFC modules where thermal derating and EMI control are design priorities.

Availability

STTH30L06CT is available at Aetrix Electronics and suitable for server power supply PFC stages, industrial AC-DC front-ends, and EV onboard chargers requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for STTH30L06CT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

STTH30L06CT belongs to ST's Turbo 2 ultrafast diode product line, engineered specifically for high-efficiency, high-frequency power factor correction and switching power supply applications demanding low Qrr, soft recovery, and thermal predictability.

FAQ

What is the maximum junction temperature and how does it affect derating?

The absolute maximum junction temperature is +175 °C. Derating must follow the IF(AV) curves in the datasheet: at TC = 125 °C, the device supports 30 A total (2 × 15 A); above that, current must be linearly reduced - e.g., at TC = 140 °C, per-diode rating drops to 15 A. Exceeding Tj limits accelerates parameter drift and reduces lifetime.

Can STTH30L06CT be used in parallel with another identical device?

No - STTH30L06CT is a dual-diode device with internal thermal coupling; paralleling two units introduces unpredictable current sharing due to VF mismatch and unequal thermal paths. For higher current, use a single larger-rated device (e.g., STTH60L06CW) or redesign the topology to distribute load across phases.

Is the D²PAK footprint compatible with standard reflow soldering processes?

Yes - the D²PAK package complies with IPC-7351B and JEDEC J-STD-020 moisture sensitivity level 1. Recommended reflow profile uses peak temperature ≤ 260 °C for ≤ 30 seconds, with preheat ramp rate ≤ 3 °C/s. The exposed copper tab requires full thermal pad coverage and ≥ 70% solder paste coverage for optimal heat transfer.

How is reverse recovery softness quantified and why does it matter?

Softness is defined as S = trr / taa (time to peak reverse current), with STTH30L06CT achieving S > 1.0 across 100–500 A/µs dlF/dt. High S factor suppresses voltage spikes and oscillations during turn-off, reducing electromagnetic interference and eliminating need for RC snubbers - critical for meeting CISPR-22 Class B emissions in compact power systems.