STMicroelectronics STTH30L06G

Overview

STTH30L06G from STMicroelectronics is a 600 V, 30 A ultrafast high-voltage rectifier diode in D2PAK (TO-263) package, optimized for discontinuous-mode PFC boost stages and secondary-side rectification in industrial switching power supplies. It delivers 1.0 V typical forward voltage at 150 °C, 65 ns max reverse recovery time, and 1.1 °C/W junction-to-case thermal resistance.

For engineers reviewing the STTH30L06G datasheet, STTH30L06G pinout, STTH30L06G application, or STTH30L06G equivalent, key selection criteria include conduction loss modeling (P = 0.95 × IF(AV) + 0.010 × IF²(RMS)), soft recovery behavior (S factor > 1.0), and thermal performance under Tc = 125 °C continuous operation.

Technical Context

The STTH30L06G employs ST's Turbo 2 silicon technology to achieve ultrafast recovery with low Qrr and soft reverse recovery characteristics-critical for reducing EMI and snubber losses in high-frequency PFC converters. Its 175 °C maximum junction temperature enables high-power density designs without derating at elevated ambient temperatures.

Designed specifically for hard-switched topologies, it supports dIF/dt up to 500 A/µs while maintaining stable trr ≤ 80 ns (typ.) and IRM ≤ 16 A (at Tj = 125 °C, VR = 400 V), enabling reliable operation in 100–300 kHz SMPS and active clamp flyback circuits.

Key Specifications

Pinout & Package

D2PAK (TO-263) surface-mount package with isolated tab (pin 1 = anode, pin 2 = cathode, tab = cathode). The molded epoxy body meets UL94 V0 flammability rating; recommended solder footprint per Figure 13 in datasheet.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with MUR3060CT and VS-30CPH06, the STTH30L06G offers superior softness (S > 1.0), lowest VF at high temperature, and best thermal resistance-making it optimal for space-constrained, high-efficiency PFC and SMPS rectification where EMI control and thermal headroom are critical.

Availability

STTH30L06G is available at Aetrix Electronics and suitable for industrial switching power supplies, discontinuous-mode PFC boost stages, and UPS rectification requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for STTH30L06G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs, discrete devices, and MEMS sensors for industrial, automotive, and consumer markets.

The STTH series targets high-efficiency power conversion systems, with Turbo 2 technology specifically engineered for ultrafast, soft-recovery rectifiers in high-frequency, high-reliability industrial power supplies.

FAQ

What is the maximum allowable case temperature for continuous 30 A operation?

The STTH30L06G is rated for IF(AV) = 30 A at Tc = 125 °C with 50% duty cycle (δ = 0.5). Operation at Tc > 125 °C requires derating per Figure 1 in the datasheet; sustained 30 A at Tc = 135 °C reduces allowable duty cycle to ~40% to maintain Tj ≤ 175 °C.

Does the D2PAK package provide electrical isolation between the cathode tab and PCB ground?

No-the D2PAK (STTH30L06G) has a non-isolated cathode tab electrically connected to Pin 2. For isolation, use the DOP3I variant (STTH30L06PI), which provides 2500 VRMS insulation between cathode and mounting surface.

How does reverse recovery charge (Qrr) vary with dIF/dt and temperature?

Qrr increases with dIF/dt and decreases with rising junction temperature. At Tj = 125 °C and dIF/dt = 100 A/µs, Qrr is ~1200 nC (Figure 6); at 25 °C and same dIF/dt, it rises to ~2200 nC. This inverse thermal dependence helps stabilize losses in thermally stressed PFC stages.

Can STTH30L06G replace STTH30L06D in a TO-220AC footprint?

No-STTH30L06G uses D2PAK (TO-263) with different pad layout, thermal pad requirements, and soldering profile. Direct replacement requires PCB redesign. For drop-in compatibility with TO-220AC, use STTH30L06D or STTH30L06W (DO-247).