STMicroelectronics STTH30RQ06GY-TR

Overview

STTH30RQ06GY-TR from STMicroelectronics is an AEC-Q101-qualified ultrafast high-voltage rectifier diode in D²PAK package, rated for 600 V repetitive peak reverse voltage, 30 A average forward current, and 30 ns maximum reverse recovery time at 25 °C. It delivers soft recovery behavior, low thermal resistance (0.7 °C/W), and operates up to +175 °C junction temperature - designed for LLC full-bridge secondary rectification in automotive and industrial power supplies.

For engineers reviewing the STTH30RQ06GY-TR datasheet, STTH30RQ06GY-TR pinout, STTH30RQ06GY-TR application, or STTH30RQ06GY-TR equivalent, key selection criteria include its 5.38 mm creepage distance (D²PAK HV variant), 1.45 V typical forward voltage at 15 A/150 °C, AEC-Q101 qualification, and suitability for PFC stages and high-efficiency AC/DC converters requiring low conduction and switching losses.

Technical Context

This device is a planar silicon ultrafast recovery rectifier optimized for high-frequency switching topologies including LLC resonant converters and active clamp forward designs. Its soft recovery characteristic minimizes EMI generation during turn-off, while the low QRR (485 nC) and controlled dIF/dt-dependent trr (95 ns max at 125 °C) support stable operation under high di/dt conditions.

The D²PAK package enables efficient conduction cooling with Rth(j–c) = 0.7 °C/W, and the device maintains VRRM guarantee across –40 °C to +175 °C. It exhibits low IR (≤800 µA at 150 °C, VR = VRRM) and VF stability over temperature - critical for thermal management in compact, high-power-density systems like on-board chargers and UPS modules.

Key Specifications

Pinout & Package

D²PAK (TO-263) surface-mount package with isolated tab (anode-connected), single cathode terminal, and thermal pad optimized for PCB copper area conduction cooling. Mechanical footprint per ST DS12165 Rev 3: 9.35 mm × 10.40 mm × 15.85 mm height, 1.48 g weight, tape-and-reel packaging (1000 pcs).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with STTH30RQ06GY-TR, STTH30R06CW offers superior thermal performance but lacks automotive qualification, while MUR3060CT trades soft recovery and high-temperature capability for lower cost and dual-diode convenience - making STTH30RQ06GY-TR optimal for thermally constrained, safety-critical automotive and industrial converters demanding consistent 175 °C operation.

Availability

STTH30RQ06GY-TR is available at Aetrix Electronics and suitable for automotive on-board chargers, industrial uninterruptible power supplies, and air conditioning inverter modules requiring stable component supply, AEC-Q101 compliance, and high-temperature reliability.

Supply support for STTH30RQ06GY-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

This device belongs to ST's Automotive Turbo 2 ultrafast rectifier product line, engineered specifically for high-efficiency, high-reliability secondary-side rectification in next-generation EV chargers, server PSUs, and industrial motor drives operating at elevated junction temperatures.

FAQ

Is STTH30RQ06GY-TR pin-compatible with other D²PAK rectifiers?

No - STTH30RQ06GY-TR uses a single-anode (tab) / single-cathode configuration in D²PAK, unlike dual-diode variants such as STTH30L06CW. Its pinout matches standard D²PAK rectifiers (e.g., STTH30R06), but thermal pad layout and creepage requirements differ from D²PAK HV versions. Always verify footprint against DS12165 Figure 17.

What is the maximum recommended PCB copper area for thermal performance?

Per DS12165 Figure 12, a 30 cm² copper area under the D²PAK thermal pad reduces Rth(j–a) to ~35 °C/W on FR4. For optimal Rth(j–c) = 0.7 °C/W, the tab must be soldered directly to a solid internal or external heatsink plane - minimum 10 cm² of 70 µm copper is required to sustain 30 A continuous current at TC = 125 °C.

Does STTH30RQ06GY-TR support bidirectional current flow?

No - it is a unidirectional silicon PN junction rectifier. Forward conduction occurs from anode (tab) to cathode (lead); reverse bias blocks up to 600 V. It cannot conduct in reverse direction, nor does it support synchronous rectification control - use only in conventional rectifier, freewheeling, or clamping roles.

How does the D²PAK HV variant differ in layout requirements?

The D²PAK HV version (e.g., STTH30RQ06G2Y-TR) features extended creepage distance (5.38 mm) via modified mold compound and cutouts - requiring wider isolation gaps between anode and cathode traces. Its footprint differs: L3 = 6.85–7.25 mm vs. 7.50–8.00 mm in standard D²PAK, and E = 0.50–0.90 mm vs. 10.00–10.40 mm - necessitating separate PCB land patterns.