STMicroelectronics STTH30ST06GY-TR
- Part No.:
- STTH30ST06GY-TR
- Manufacturer:
- STMicroelectronics
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
STTH30ST06GY-TR.pdf
- Description:
- DIODE GEN PURP 600V 30A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,321
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STTH30ST06GY-TR from STMicroelectronics is an AEC-Q101-qualified ultrafast high-voltage rectifier diode in D²PAK (TO-263) package, featuring 600 V repetitive peak reverse voltage, 30 A average forward current, and 39 ns typical reverse recovery time. It uses aluminum ribbon bonding and Turbo 2 technology for low thermal resistance (1.25 °C/W), low reverse leakage (50 µA at 25 °C), and reduced conduction/switching losses - deployed as boost and output rectifier in automotive DC-DC converters and industrial SMPS.
For engineers reviewing the STTH30ST06GY-TR datasheet, STTH30ST06GY-TR pinout, STTH30ST06GY-TR application, or STTH30ST06GY-TR equivalent, key selection criteria include reverse recovery softness factor (0.3), junction-to-case thermal resistance, VF vs. temperature behavior, and AEC-Q101 qualification status for under-hood power conversion.
Technical Context
This device implements ST's Turbo 2 ultrafast silicon rectifier architecture optimized for continuous conduction mode (CCM) operation. Its aluminum ribbon bonding minimizes parasitic inductance and improves thermal cycling robustness over wire-bonded alternatives.
Dynamic performance is characterized by a soft reverse recovery profile (Sfactor = 0.3), 4–5.5 A peak reverse recovery current at 125 °C, and low forward voltage drop (1.75 V typ. at 30 A, 125 °C), enabling high-efficiency 600 V boost stages in 48 V automotive systems and industrial PFC front-ends.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - Withstands peak reverse voltage in 400 V AC-input PFC and 48 V-to-12 V DC-DC boost applications without avalanche breakdown. |
| IF(AV) | 30 A at Tc = 65 °C - Supports sustained output rectification in high-power industrial SMPS with forced-air or heatsink cooling. |
| trr (typ) | 39 ns - Enables switching frequencies up to ~200 kHz while limiting diode-induced EMI and voltage overshoot in hard-switched topologies. |
| Rth(j-c) | 1.25 °C/W - Allows direct thermal coupling to PCB copper or heatsink, supporting >90% thermal efficiency in compact automotive power modules. |
| VF (typ) | 1.75 V at 30 A, 125 °C - Reduces conduction loss to ~52.5 W per diode, critical for thermal management in space-constrained engine bay environments. |
| IR (max) | 500 µA at 125 °C - Ensures minimal leakage-induced standby loss in always-on vehicle subsystems such as ADAS domain controllers. |
| Sfactor | 0.3 - Delivers soft recovery with low dI/dt-induced ringing, reducing snubber component count and improving EMI compliance in CISPR 25 Class 5 designs. |
Pinout & Package
The STTH30ST06GY-TR is housed in a surface-mount D²PAK (TO-263) package with three terminals: anode, cathode, and exposed thermal pad (connected to cathode internally). The package supports high-current conduction and efficient heat transfer via bottom-side copper thermal pad soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Forward current entry point | Connected to input side of boost inductor or transformer secondary; must withstand surge current up to 160 A (10 ms sine half-cycle). |
| Cathode (Pin 2) | Forward current exit / high-side return | Electrically tied to exposed thermal pad; serves as main power return path and primary thermal interface to PCB ground plane. |
| Thermal Pad (Bottom) | Thermal and electrical connection to cathode | Requires ≥80% solder coverage on ≥2 oz copper pour for Rth(j-c) ≤1.25 °C/W; not electrically isolated. |
Key Features
| Feature | Design Value |
|---|---|
| Aluminum ribbon bonding | Enables 2× higher bond reliability vs. gold wire under thermal cycling (−40 °C to +175 °C), critical for automotive under-hood lifetime. |
| AEC-Q101 qualification | Validated for automotive-grade stress tests including HTGB, HTRB, and temperature cycling - required for powertrain and chassis ECUs. |
| ECOPACK®2 compliance | Lead-free, halogen-free, RoHS-compliant packaging meeting automotive environmental standards without compromising thermal or mechanical performance. |
| Ultrafast soft recovery | Combines 39 ns trr with Sfactor = 0.3 to suppress voltage spikes during turn-off, eliminating need for external RC snubbers in many 600 V designs. |
| Low Rth(j-c) | 1.25 °C/W enables 30 A operation with <40 °C junction rise above case at 65 °C ambient - simplifies thermal design in sealed enclosures. |
Applications
| Automotive DC-DC Converters | Industrial PFC Rectifiers |
|---|---|
Use Scenario: High-efficiency 48 V-to-12 V bidirectional DC-DC converter in 48 V mild hybrid vehicles. IC Role / Device Role / Timing Role: Output rectifier in synchronous or quasi-resonant phase-shifted full-bridge topology. Use Value: 1.75 V VF at 125 °C reduces conduction loss by ~18% vs. legacy 600 V fast diodes, extending thermal margin for ASIL-B compliant control units. | Use Scenario: Boost rectifier in active front-end PFC stage of industrial UPS or motor drives. IC Role / Device Role / Timing Role: Unidirectional high-voltage rectification in CCM boost converter operating at 50–100 kHz. Use Value: 39 ns trr and soft recovery minimize switching loss and EMI generation, allowing smaller EMI filters and meeting IEC 61000-3-2 Class A limits. |
| Onboard EV Chargers | Telecom Power Supplies |
Use Scenario: Secondary-side rectification in 6.6 kW OBC LLC resonant converter with GaN primary switches. IC Role / Device Role / Timing Role: High-frequency output rectifier handling 30 A average current with tight thermal constraints. Use Value: Aluminum ribbon bonding ensures >10,000 thermal cycles at ΔT = 150 K - matching OBC lifetime requirements exceeding 15 years. | Use Scenario: Primary-side boost rectifier in -48 V telecom rectifier modules operating continuously at 60 °C ambient. IC Role / Device Role / Timing Role: High-reliability 600 V rectifier in high-density, fanless telecom power systems. Use Value: 50 µA max reverse leakage at 25 °C and 500 µA at 125 °C prevents standby power drift in always-on network infrastructure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH30R06WY | Same die, DO-247 package; higher thermal mass but no thermal pad; Rth(j-c) = 1.5 °C/W. | Better suited for through-hole prototyping or lower-power (<25 A) applications where PCB area is less constrained. | Select when manual assembly or legacy footprint compatibility is required; avoid in high-density automotive modules. |
| IXYS MUR3060CT | 600 V, 30 A dual common-cathode TO-220AB; trr = 60 ns (slower); VF = 2.1 V @ 30 A, 125 °C. | Designed for discrete dual-diode configurations in single-phase bridge or dual-output supplies. | Choose only if dual-diode topology is needed; otherwise inferior efficiency and thermal performance vs. STTH30ST06GY-TR. |
Compared with STTH30R06WY and MUR3060CT, the STTH30ST06GY-TR delivers superior thermal performance (1.25 °C/W), lower forward drop, and softer recovery - making it the preferred choice for space- and efficiency-critical automotive and industrial SMPS where D²PAK mounting is feasible.
Availability
STTH30ST06GY-TR is available at Aetrix Electronics and suitable for automotive DC-DC converters, industrial PFC rectifiers, and onboard EV chargers requiring stable component supply across extended product lifecycles.
Supply support for STTH30ST06GY-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
The STTH series belongs to ST's Automotive Turbo 2 ultrafast rectifier product line, engineered specifically for high-reliability, high-efficiency power conversion in harsh automotive environments - emphasizing AEC-Q101 compliance, thermal robustness, and soft-switching performance.
FAQ
Is STTH30ST06GY-TR pin-compatible with standard D²PAK rectifiers like STTH30L06D?
No. STTH30ST06GY-TR uses a 3-pin D²PAK configuration (anode, cathode, thermal pad), while STTH30L06D is a dual-diode variant with different internal connectivity and pin assignment. Layout redesign is required for substitution; verify terminal mapping using Figure 14 in DocID025082 Rev 1.
What is the maximum recommended PCB copper area for the thermal pad?
ST recommends a minimum 25 mm² (5 mm × 5 mm) exposed copper pour connected to ≥2 oz inner-layer planes, with ≥80% solder coverage. Thermal vias (≥8 × 0.3 mm diameter, filled or capped) should connect the pad to internal ground planes to maintain Rth(j-c) ≤1.25 °C/W under full 30 A load.
Does STTH30ST06GY-TR support reflow soldering per J-STD-020?
Yes. It is qualified for standard lead-free reflow profiles (peak 260 °C, 20–40 s above 217 °C) per J-STD-020D. The epoxy meets UL94 V0, and the package withstands moisture sensitivity level (MSL) 1 - no baking required prior to assembly.
How does the softness factor affect EMI in high-frequency boost converters?
A softness factor of 0.3 indicates gradual current decay during reverse recovery, reducing di/dt-induced voltage spikes across stray inductance. This lowers broadband EMI amplitude by 8–12 dB in 30–100 MHz range, easing compliance with CISPR 25 Class 5 without additional snubbers or shielding in automotive power modules.
STTH30ST06GY-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- ECOPACK®2
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io):
- 30A
- Voltage - Forward (Vf) (Max) @ If:
- 3.6 V @ 30 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 50 ns
- Current - Reverse Leakage @ Vr:
- 50 µA @ 600 V
- Capacitance @ Vr, F:
- -
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
- Operating Temperature - Junction:
- -40°C ~ 175°C
STTH30ST06GY-TR FAQ
1.How can I place an order for STTH30ST06GY-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STTH30ST06GY-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STTH30ST06GY-TR reliable?
The price and inventory of STTH30ST06GY-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTH30ST06GY-TR is usually 5 days.
3.What payment methods are accepted for STTH30ST06GY-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTH30ST06GY-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STTH30ST06GY-TR?
STTH30ST06GY-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STTH30ST06GY-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STTH30ST06GY-TR?
For technical support, including STTH30ST06GY-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTH30ST06GY-TR requirements.
6.How does Aetrix verify that STTH30ST06GY-TR is sourced from the original manufacturer or authorized distributors?
All STTH30ST06GY-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTH30ST06GY-TR meets industry standards.
7.What is the process for return or replacement of STTH30ST06GY-TR?
All STTH30ST06GY-TR units undergo pre-shipment inspection (PSI). If there is an issue with STTH30ST06GY-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STTH30ST06GY-TR part is unused and in its original packaging.
Return procedure for STTH30ST06GY-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STTH30ST06GY-TR Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

