STMicroelectronics STTH4R02D

Overview

STTH4R02D from STMicroelectronics is an ultrafast recovery silicon rectifier diode optimized for high-frequency switching applications including low-voltage inverters, freewheeling paths, and polarity protection circuits. It features a 200 V repetitive peak reverse voltage (VRRM), 4 A average forward current (IF(AV)), 16 ns typical reverse recovery time (trr), 0.76 V typical forward voltage at 150 °C, and DPAK surface-mount package with thermal resistance Rth(j-c) = 3.5 °C/W.

For engineers reviewing the STTH4R02D datasheet, STTH4R02D pinout, STTH4R02D application, or STTH4R02D equivalent, key selection criteria include ultrafast trr performance under high dIF/dt conditions, low conduction loss at elevated junction temperature (Tj ≤ 175 °C), thermal management in DPAK layout, and compatibility with 200 V DC bus systems in SMPS and motor drive outputs.

Technical Context

The STTH4R02D employs platinum-doped planar junction technology to achieve tightly controlled minority carrier lifetime, enabling sub-20 ns reverse recovery with minimal tail current. Its dynamic behavior is characterized by low IRM (4.4–5.5 A peak reverse recovery current at Tj = 125 °C, dIF/dt = −200 A/µs) and stable trr across temperature and dIF/dt variation.

Static performance centers on low VF (0.76 V typ @ Tj = 150 °C, IF = 4 A) and negligible leakage (≤20 µA @ Tj = 125 °C, VR = VRRM), supporting high-efficiency operation in thermally constrained DPAK layouts. The device's Rth(j-c) = 3.5 °C/W enables direct heatsinking via the exposed thermal pad.

Key Specifications

Pinout & Package

STTH4R02D is supplied in the DPAK (TO-252) surface-mount package with three terminals: Anode (pin 1), Cathode (pin 2), and exposed thermal pad (pin 3, electrically connected to cathode). The cathode is marked by a band on the package body.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast recovery diode applications.

Compared with STTH4L02D and MBR420F, the STTH4R02D uniquely balances 200 V capability, 16 ns trr, and DPAK thermal performance-making it optimal for space-constrained, high-frequency 24–48 V industrial power supplies where both voltage rating and recovery speed are critical.

Availability

STTH4R02D is available at Aetrix Electronics and suitable for DC-DC converter freewheeling, motor drive polarity protection, and inverter output snubber applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for STTH4R02D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

The STTH ultrafast diode product line targets high-efficiency, high-frequency power conversion systems-including SMPS, UPS, solar microinverters, and motor drives-where low trr and high Tj capability directly improve system power density and reliability.

FAQ

What is the maximum recommended PCB copper area for optimal thermal performance of STTH4R02D?

The DPAK thermal pad must be soldered to a minimum 2 cm² copper pour on the primary side of the PCB, with ≥2 thermal vias (0.3 mm diameter, filled or plated) connecting to an internal ground plane. This achieves the specified Rth(j-c) = 3.5 °C/W and keeps Tj ≤ 150 °C at 4 A DC with 20 °C ambient.

Does STTH4R02D support reflow soldering per JEDEC J-STD-020?

Yes, STTH4R02D is qualified for standard Pb-free reflow per JEDEC J-STD-020D. Peak temperature must not exceed 260 °C for ≤30 seconds, with ramp-up rate ≤3 °C/s. The ECOPACK®2 epoxy meets UL94 V0 and passes MSL Level 1 moisture sensitivity testing.

Can STTH4R02D replace a standard FR107 in a 200 V flyback design?

Yes-STTH4R02D provides identical VRRM and higher IF(AV), but with 16 ns trr versus FR107's 500 ns. This reduces switching loss by >70% and eliminates need for snubber networks. Ensure PCB layout accommodates DPAK footprint and thermal pad soldering.

Is the cathode connection on the thermal pad electrically isolated?

No-the exposed thermal pad on STTH4R02D is internally bonded to the cathode terminal (Pin 2). It must be routed to the same net as Pin 2 and cannot be used as a floating thermal interface. Isolation requires external insulation or alternative package types like SMB/SMC.