STMicroelectronics STTH5L06

Overview

STTH5L06 from STMicroelectronics is a 600 V, 5 A ultrafast high-voltage rectifier diode using Turbo 2 technology, optimized for continuous-conduction-mode (CCM) PFC boost stages and freewheeling in hard-switching SMPS. It delivers 65 ns typical reverse recovery time, 0.85 V typical forward voltage at 150 °C, and 2000 VRMS insulation in TO-220FPAC package.

For engineers reviewing the STTH5L06 datasheet, STTH5L06 pinout, STTH5L06 application, or STTH5L06 equivalent, key selection criteria include reverse recovery performance under dIF/dt = –50 A/µs, thermal resistance (Rth(j-c) = 6 °C/W), junction temperature limit (175 °C), and insulation compliance for isolated power stage design.

Technical Context

This diode employs ST's Turbo 2 silicon process to achieve soft, low-IRM reverse recovery with 65 ns trr (typ) at IF = 1 A, VR = 30 V, dIF/dt = –50 A/µs. Its low Qrr and softness factor (S ≈ 1.2–1.6 across dIF/dt range) minimize switching stress in high-frequency PFC and LLC resonant converters.

The TO-220FPAC variant integrates reinforced electrical isolation (2000 VRMS) between cathode/anode and mounting tab, enabling direct heatsink attachment without insulating washers. Thermal performance is defined by Rth(j-c) = 6 °C/W and Rth(j-a) = 75 °C/W (free air), supporting sustained 5 A average current at TC ≤ 135 °C.

Key Specifications

Pinout & Package

STTH5L06 in TO-220FPAC package features a 3-terminal insulated construction: anode (pin 1), cathode (pin 2), and electrically isolated metal tab (pin 3, thermally connected to cathode but galvanically isolated). The tab serves as primary thermal path and must be mounted to heatsink with torque 0.55 N·m (max 0.7 N·m).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with STTH8L06 and IXYS MUR560E, STTH5L06 uniquely combines 5 A rating with 2000 VRMS isolation and 65 ns trr in a single TO-220FPAC package-enabling simplified, compact, and safety-compliant designs in isolated CCM PFC and high-reliability freewheeling roles.

Availability

STTH5L06 is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, telecom rectification, and EV onboard charger PFC stages requiring stable component supply, long-lifecycle support, and certified insulation integrity.

Supply support for STTH5L06 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

STTH5L06 belongs to ST's Turbo 2 ultrafast diode product line, engineered specifically for high-efficiency, high-frequency power conversion in PFC, SMPS, and motor drive applications demanding low trr, soft recovery, and robust thermal performance.

FAQ

What is the maximum allowable case temperature for continuous operation?

The STTH5L06 in TO-220FPAC package is rated for IF(AV) = 5 A at TC = 135 °C, as specified in Table 2 of the datasheet. Exceeding this temperature risks derating of forward current and accelerated parametric drift. Thermal design must ensure case temperature remains ≤135 °C under worst-case load and ambient conditions, verified via Rth(j-c) = 6 °C/W and measured junction temperature.

Does STTH5L06 require external insulation when mounted to a heatsink?

No-STTH5L06 in TO-220FPAC package provides 2000 VRMS reinforced insulation between the internal die and the metal tab, allowing direct mounting to grounded or floating heatsinks without mica washers, silicone pads, or insulating hardware. This is confirmed in the "Insulated package: TO-220FPAC" feature list and Table 7 mechanical data.

How does trr vary with dIF/dt and temperature?

Per Figure 7 in the datasheet, trr decreases with increasing dIF/dt (e.g., from ~95 ns at 10 A/µs to ~65 ns at 50 A/µs) and increases with junction temperature (Figure 10 shows ~20% increase from 25 °C to 125 °C). Designers must use the worst-case trr value (95 ns max) for loss estimation and snubber sizing under high dIF/dt and elevated Tj.

Can STTH5L06 replace STTH5L06D in the same footprint?

No-STTH5L06D uses TO-220AC (non-isolated) package with different pin assignment and no insulation rating, while STTH5L06 (TO-220FPAC) has isolated tab and distinct mechanical dimensions (e.g., L3 = 28.6–30.6 mm vs. TO-220AC L2 = 16.4 mm typ). PCB layout, thermal interface, and safety certification are incompatible; substitution requires full requalification.