STMicroelectronics STTH5L06B

Overview

STTH5L06B from STMicroelectronics is a 600 V, 5 A ultrafast high-voltage rectifier diode in DPAK (TO-252) package, optimized for continuous-conduction-mode PFC boost stages and freewheeling in hard-switching SMPS. It delivers 65 ns typical reverse recovery time, 0.85 V typical forward voltage at 150 °C, and 125 µA max reverse leakage at 600 V and 150 °C.

For engineers reviewing the STTH5L06B datasheet, STTH5L06B pinout, STTH5L06B application, or STTH5L06B equivalent, key selection criteria include trr consistency under dIF/dt stress, thermal resistance (Rth(j-c) = 3.5 °C/W), insulation capability, softness factor for EMI control, and ECOPACK®2 compliance for industrial power supply design.

Technical Context

This device employs ST's Turbo 2 600 V silicon process, engineered specifically for low Qrr (typ. 45 nC at IF = 5 A, dIF/dt = −50 A/µs) and soft reverse recovery to minimize switching losses and voltage overshoot in high-frequency PFC and DC-DC converters. Its dynamic behavior is characterized across junction temperatures up to 175 °C and dIF/dt rates up to 100 A/µs.

The DPAK variant (STTH5L06B-TR) features a thermally enhanced surface-mount structure with exposed cathode pad, enabling efficient conduction cooling on PCB copper areas ≥ 4.5 cm². Junction-to-case thermal resistance is specified at 3.5 °C/W, and it supports peak repetitive forward current of 65 A (5 µs square wave).

Key Specifications

Pinout & Package

STTH5L06B is housed in a DPAK (TO-252) surface-mount package with three terminals: anode (A), cathode (K), and exposed thermal pad (cathode-connected). The package provides mechanical robustness, low profile (max height 2.4 mm), and optimized thermal path via the large copper-exposed cathode tab.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with STTH5L06D and VS-5EYH06-M3, STTH5L06B offers superior high-frequency efficiency due to its lower trr and soft recovery, better thermal integration in automated SMT lines, and tighter leakage control at elevated temperature-making it optimal for space-constrained, high-reliability CCM PFC designs.

Availability

STTH5L06B is available at Aetrix Electronics and suitable for server power supplies, industrial AC-DC adapters, and EV onboard chargers requiring stable component supply, long-lifecycle assurance, and RoHS-compliant sourcing.

Supply support for STTH5L06B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, MCU, and sensor solutions for industrial, automotive, and consumer markets.

STTH5L06B belongs to ST's Turbo 2 ultrafast diode product line, developed specifically for high-efficiency, high-frequency power conversion in PFC and SMPS topologies demanding low Qrr, soft recovery, and rugged thermal performance.

FAQ

What is the maximum recommended PCB copper area for optimal thermal performance of STTH5L06B?

The DPAK package achieves its rated Rth(j-c) = 3.5 °C/W when the exposed cathode pad is soldered to ≥ 4.5 cm² of 35 µm-thick FR4 copper (per JEDEC JESD51-3). Larger copper areas further reduce Rth(j-a), but do not improve Rth(j-c); thermal vias under the pad are strongly recommended for multilayer boards.

Does STTH5L06B support bidirectional current flow in resonant topologies?

No-STTH5L06B is a unidirectional PN junction rectifier. While it can conduct forward current and block reverse voltage, it lacks reverse conduction capability. For bidirectional clamping or synchronous rectification, discrete MOSFETs or dedicated bidirectional switches must be used instead.

Is STTH5L06B pin-compatible with other DPAK diodes like STTH8R06D?

No-STTH5L06B has standard DPAK pinout (Anode–Cathode–Pad), but STTH8R06D is a different die with higher IF(AV) (8 A) and distinct thermal characteristics. Mechanical footprint matches, but electrical behavior (VF, trr, Qrr) differs significantly; direct substitution requires full revalidation of thermal and switching loss margins.

What is the softness factor (S-factor) of STTH5L06B, and why does it matter?

STTH5L06B exhibits S-factor > 1.0 across dIF/dt = 25–100 A/µs (per Figure 9), indicating gradual, non-abrupt current decay during reverse recovery. This suppresses peak IRM and associated voltage overshoot, reducing EMI filter size and improving system-level EMC compliance without added snubbers.