STMicroelectronics STTH5R06B

Overview

STTH5R06B from STMicroelectronics is a 600 V, 5 A ultrafast high-voltage rectifier diode in DPAK (TO-252) package, featuring 25 ns max reverse recovery time, 1.40 V typical forward voltage at 125 °C, and 175 °C maximum junction temperature - optimized for continuous-conduction-mode PFC boost stages and hard-switching flyback/freewheeling applications.

For engineers reviewing the STTH5R06B datasheet, STTH5R06B pinout, STTH5R06B application, or STTH5R06B equivalent, key selection criteria include trr ≤ 25 ns at IF = 0.5 A, softness factor ≥ 0.35, low thermal resistance (Rth(j-c) = 3.0 °C/W), and insulated DPAK mounting compatibility with PCB-level isolation requirements.

Technical Context

This Turbo 2 silicon diode employs optimized carrier lifetime control to achieve ultrafast switching with low Qrr (110 nC) and soft reverse recovery (Sfactor ≥ 0.35), minimizing EMI and voltage overshoot in high-dV/dt environments. Its 600 V VRRM rating supports universal-input AC/DC front-ends up to 400 V DC bus.

The DPAK package provides 3.0 °C/W junction-to-case thermal resistance and UL 94 V0 epoxy encapsulation, enabling surface-mount integration in space-constrained power supplies while maintaining safe isolation margins under transient overvoltage conditions.

Key Specifications

Pinout & Package

DPAK (TO-252) package: surface-mount, 3-terminal, single-diode configuration with isolated tab (cathode-connected tab). Thermal pad on underside requires soldered copper area per Figure 18 (DocID7976 Rev 12, p.12).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with STTH5R06B, STTH5L06D offers identical electrical performance but sacrifices isolation and surface-mount compatibility, while MUR560E trades off recovery speed, softness, and forward drop for lower unit cost - making STTH5R06B the optimal choice for high-density, high-efficiency, and EMI-critical PFC and flyback designs.

Availability

STTH5R06B is available at Aetrix Electronics and suitable for server power supplies, industrial AC/DC adapters, and LED driver flyback converters requiring stable component supply, consistent DPAK packaging, and guaranteed ECOPACK®2 compliance.

Supply support for STTH5R06B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

STTH5R06B belongs to the Turbo 2 ultrafast diode product line, engineered specifically for high-efficiency, high-frequency power conversion in PFC, SMPS, and motor drive applications where low Qrr, soft recovery, and thermal reliability are critical.

FAQ

What is the maximum allowable case temperature for continuous operation of STTH5R06B?

The device is rated for IF(AV) = 5 A at TC = 135 °C in DPAK package. Exceeding this temperature reduces current capability per derating curves in Figure 1 (DocID7976 Rev 12, p.3); sustained operation above 135 °C requires proportional current reduction to maintain junction temperature ≤ 175 °C.

Does STTH5R06B have reinforced insulation between cathode and PCB?

No - unlike the TO-220FPAC variant, the DPAK package has no internal insulation barrier. The exposed cathode tab is electrically connected to Pin 2; isolation must be achieved externally via minimum creepage/clearance distances and PCB slotting per IEC 62368-1 requirements.

Can STTH5R06B replace STTH8R06 in the same PCB footprint?

No - STTH8R06 uses D²PAK (TO-263) package with different pin pitch (2.54 mm vs. 2.286 mm), larger body dimensions, and higher thermal mass. The DPAK footprint for STTH5R06B (5.97 × 6.73 mm) is incompatible with D²PAK's 8.95 × 10.40 mm outline and 4.88 mm lead spacing.

What is the recommended minimum copper area for the DPAK thermal pad?

Per Figure 18 (DocID7976 Rev 12, p.12), a minimum 100 mm² (10 × 10 mm) solid copper pour connected to the tab via ≥ 4 thermal vias (0.3 mm diameter, 0.8 mm pitch) is required to achieve Rth(j-a) ≈ 45 °C/W; smaller areas increase thermal resistance nonlinearly and risk junction overheating at full load.