STMicroelectronics STTH5R06G

Overview

STTH5R06G from STMicroelectronics is a 600 V, 5 A ultrafast high-voltage rectifier diode in D²PAK (TO-263) package, optimized for continuous-conduction-mode PFC boost stages and hard-switching freewheeling applications. It delivers 25 ns max reverse recovery time, 1.40 V typical forward voltage at 125 °C, and 5.5 A peak reverse recovery current under 400 V/–200 A/µs conditions.

For engineers reviewing the STTH5R06G datasheet, STTH5R06G pinout, STTH5R06G application, or STTH5R06G equivalent, key selection criteria include trr ≤ 25 ns at 25 °C, softness factor ≥ 0.35, Rth(j-c) = 3.0 °C/W (D²PAK), and insulation-free mounting compatibility with standard PCB thermal pads.

Technical Context

This Turbo 2 silicon diode employs optimized carrier lifetime control to achieve ultrafast switching with low Qrr (110 nC) and soft reverse recovery-critical for minimizing EMI and snubber losses in 65–100 kHz PFC stages. Its 175 °C maximum junction temperature enables operation in compact, convection-cooled power supplies.

The D²PAK package provides low thermal resistance (3.0 °C/W junction-to-case) and robust mechanical mounting for high-reliability industrial SMPS designs. Unlike TO-220FPAC variants, STTH5R06G lacks internal insulation-requiring external isolation if used in floating-ground topologies.

Key Specifications

Pinout & Package

D²PAK (TO-263) surface-mount package with three terminals: anode (pin 1), cathode (pin 2), and exposed thermal pad (pin 3, electrically connected to cathode). The package features 8.95–9.35 mm body width, 10–10.4 mm height, and 2.54 mm lead pitch (e), designed for automated reflow assembly and high-current PCB routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with STTH8R06D, STTH5R06G offers superior PCB integration and lower assembly cost but limits current scalability; versus MUR560E, it delivers measurable EMI reduction and 0.4% efficiency gain in high-frequency PFC, justifying its premium in mission-critical power systems.

Availability

STTH5R06G is available at Aetrix Electronics and suitable for server power supply PFC stages, industrial AC-DC adapters, motor drive DC link circuits, and renewable energy inverters requiring stable component supply and long-term production continuity.

Supply support for STTH5R06G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for automotive, industrial, and consumer markets.

STTH5R06G belongs to ST's Turbo 2 ultrafast diode product line-engineered specifically for high-efficiency, high-frequency switching power conversion in industrial and computing power supplies.

FAQ

Is STTH5R06G insulated or isolated?

No, STTH5R06G in D²PAK package has no internal electrical isolation between the cathode and exposed thermal pad. The pad is electrically connected to the cathode terminal. For isolated mounting, external insulating thermal interface material must be used, unlike the TO-220FPAC variant which integrates 2000 VRMS insulation.

What is the minimum recommended copper area for the D²PAK thermal pad?

ST recommends ≥250 mm² of 2-oz copper connected to the D²PAK thermal pad via ≥6 thermal vias (0.3 mm diameter, spaced ≤2 mm apart) to achieve the specified Rth(j-c) = 3.0 °C/W. Smaller pads increase junction temperature by 15–25 °C at full 5 A load.

Can STTH5R06G replace STTH5R06B in DPAK package?

No-STTH5R06B uses DPAK (TO-252) with Rth(j-c) = 5.5 °C/W and lower current capability (IF(AV) = 5 A at TC = 105 °C). Substituting STTH5R06G requires PCB footprint redesign, thermal pad re-layout, and verification of voltage standoff margins due to different creepage/clearance geometry.

Does STTH5R06G require a gate resistor or snubber network?

No-its soft recovery (S factor ≥ 0.35) and low Qrr eliminate the need for external snubbers in properly laid-out PFC layouts. However, a 10–22 nF ceramic capacitor placed between anode and cathode near the device helps damp high-frequency ringing caused by PCB parasitics.