STMicroelectronics STTH60RQ06CWL

Overview

STTH60RQ06CWL from STMicroelectronics is a 600 V, 2 × 30 A ultrafast high-voltage rectifier diode in TO-247 LL package, designed for secondary rectification in HV LLC full-bridge topologies and high-voltage boost functions. It delivers soft recovery behavior (trr ≤ 30 ns), low VF(max) = 1.45 V at 150 °C, and Tj(max) = 175 °C, enabling high-efficiency solar boost, PFC, and EV on-board charger (OBC) applications.

For engineers reviewing the STTH60RQ06CWL datasheet, STTH60RQ06CWL pinout, STTH60RQ06CWL application, or STTH60RQ06CWL equivalent, key selection criteria include reverse recovery time under high dIF/dt, thermal resistance (Rth(j–c) = 0.45 °C/W per device), junction temperature derating, softness factor, and ECOPACK2 compliance for industrial and automotive power systems.

Technical Context

This dual-die ultrafast rectifier integrates two independent 30 A diodes in a single TO-247 LL package with isolated cathodes (K) and shared anode terminals (A1, A2), supporting parallel or interleaved operation. Its soft recovery minimizes EMI in high-frequency switching converters, while low Qrr (485 nC) and controlled IRM (≤11 A) reduce turn-off losses in PFC and LLC resonant stages.

The device operates up to 175 °C junction temperature with Rth(j–c) = 0.45 °C/W for the full device, enabling compact heatsink designs in space-constrained UPS and air conditioning inverters. Reverse leakage remains ≤800 µA at 150 °C and VR = 600 V, ensuring stable blocking performance under thermal stress.

Key Specifications

Pinout & Package

STTH60RQ06CWL uses the TO-247 Long Leads (LL) package with three terminals: one common cathode (K) and two anodes (A1, A2). The dual-diode configuration allows independent control of each 30 A path, supporting interleaved PFC or redundant rectification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast high-voltage rectifier applications.

Compared with MUR6060CT and VS-60CPH06, STTH60RQ06CWL offers superior thermal robustness (175 °C), lower conduction loss (1.45 V), and tighter trr control (30 ns), making it optimal for high-density, high-reliability EV and solar applications demanding dual-path flexibility and EMI reduction.

Availability

STTH60RQ06CWL is available at Aetrix Electronics and suitable for solar boost diode, PFC rectifier, and EV on-board charger (OBC) applications requiring stable component supply, long-lifecycle support, and automotive-grade reliability.

Supply support for STTH60RQ06CWL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, microcontrollers, and automotive ICs.

This device belongs to ST's high-voltage ultrafast diode product line, engineered specifically for high-efficiency, high-frequency power conversion in renewable energy, EV infrastructure, and industrial motor drives.

FAQ

What is the maximum continuous forward current per diode at TC = 103 °C?

The STTH60RQ06CWL supports 30 A average forward current per diode at case temperature TC = 103 °C with 50% duty cycle square-wave excitation. This rating assumes proper heatsinking to maintain junction temperature ≤175 °C and accounts for thermal derating beyond 103 °C per the datasheet's derating curve.

How is the dual-diode configuration wired in a PFC interleaved design?

In interleaved PFC, A1 and A2 connect to separate boost inductors, while K serves as the common output node to the DC bus. This arrangement enables phase-shifted conduction, reducing input current ripple and allowing smaller EMI filters. The internal isolation between A1 and A2 prevents cross-conduction.

Does STTH60RQ06CWL require a thermal pad or insulator when mounted to a heatsink?

No insulator is required if the heatsink is electrically grounded and the mounting surface is non-conductive relative to system ground. However, ST recommends using a thermally conductive but electrically isolating pad (e.g., silicone-based) when the heatsink is at a different potential than the cathode (K), as K is the common output node and may be referenced to high-voltage DC bus.

What is the typical softness factor (S-factor) at 125 °C and dIF/dt = 200 A/µs?

The typical softness factor is ≥1.2 under those conditions, as shown in Figure 9 of DS13257 Rev 3. A value >1.0 confirms predominantly soft recovery behavior-characterized by gradual current decay and minimal voltage overshoot-critical for minimizing EMI in high-frequency LLC and PFC circuits.