STMicroelectronics STTH802B-TR

Overview

STTH802B-TR from STMicroelectronics is an ultrafast recovery silicon planar diode optimized for high-frequency switching applications, featuring 200 V repetitive peak reverse voltage (V_RRM), 8 A average forward current (I_F(AV)), 17 ns typical reverse recovery time (t_rr), and 0.8 V typical forward voltage drop (V_F) at 25 °C - deployed in low-voltage inverters, freewheeling paths, and polarity protection circuits.

For engineers reviewing the STTH802B-TR datasheet, STTH802B-TR pinout, STTH802B-TR application, or STTH802B-TR equivalent, key selection criteria include thermal resistance (R_th(j-c) = 3.2 °C/W), junction temperature rating (T_j(max) = 175 °C), insulated package compliance (TO-220FPAC/DPAK/D²PAK), and dynamic recovery performance under dI_F/dt stress up to 200 A/µs.

Technical Context

This device employs platinum-doped planar junction technology to achieve low conduction losses (V_F ≤ 1.05 V at 8 A, 25 °C) and negligible switching losses via ultrafast charge removal. Its t_rr remains stable across temperature (17–22 ns at 25–125 °C) and dI_F/dt (100–200 A/µs), enabling reliable operation in hard-switched SMPS base-drive and IGBT freewheeling topologies.

The DPAK package (TO-252AA) provides surface-mount compatibility with 3.2 °C/W junction-to-case thermal resistance and 175 °C maximum junction temperature, supporting continuous conduction mode operation at elevated ambient temperatures when mounted on ≥25 cm² copper area per Figure 11.

Key Specifications

Pinout & Package

STTH802B-TR is supplied in the DPAK (TO-252AA) surface-mount package, featuring a single molded plastic body with three terminals: anode, cathode, and exposed thermal pad (electrically connected to cathode). The package complies with ECOPACK®2 environmental standards and supports reflow soldering per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast recovery diode applications.

Compared with STTH802B-TR, STTH8R02DJ-TR offers superior thermal and dynamic performance in a larger package, while MBR8200CT-TP eliminates t_rr entirely but sacrifices high-temperature leakage stability - choice depends on thermal budget, EMI constraints, and operating temperature envelope.

Availability

STTH802B-TR is available at Aetrix Electronics and suitable for high-frequency DC-DC converters, solar microinverters, IGBT snubbers, and automotive polarity protection requiring stable component supply across production lifecycles.

Supply support for STTH802B-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.

The STTH series targets high-efficiency power conversion systems demanding ultrafast recovery, low forward drop, and robust thermal performance - specifically engineered for SMPS, motor drives, and renewable energy inverters.

FAQ

What is the maximum allowable case temperature for continuous operation of STTH802B-TR?

The STTH802B-TR is rated for I_F(AV) = 8 A at T_C = 145 °C in DPAK package. Exceeding this case temperature requires derating per Figure 1 in the datasheet; operation above 145 °C reduces average current capacity linearly to zero at 175 °C junction limit, assuming proper PCB thermal design.

Can STTH802B-TR replace a standard FR107 diode in a 60 kHz flyback converter?

Yes - STTH802B-TR's 17 ns t_rr and 0.8 V V_F significantly reduce switching loss and EMI versus FR107's 500 ns t_rr and 1.3 V V_F. However, layout must minimize parasitic inductance, and snubber networks may require adjustment due to faster voltage rise times.

Is the thermal pad of STTH802B-TR electrically isolated from the cathode?

No - the exposed thermal pad in the DPAK package is internally connected to the cathode terminal. It must be routed to the cathode net on the PCB and cannot be used for isolation or floating thermal planes without violating electrical safety and datasheet specifications.

Does STTH802B-TR support lead-free reflow soldering per JEDEC J-STD-020?

Yes - STTH802B-TR is qualified for lead-free reflow with a peak temperature of 260 °C (10 s max), compliant with ECOPACK®2 and RoHS directives. The DPAK package uses matte tin plating and passes MSL Level 1 moisture sensitivity testing per J-STD-020.