My Inquiry
My Account
STMicroelectronics STTH810G-TR
- Part No.:
- STTH810G-TR
- Manufacturer:
- STMicroelectronics
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
STTH810G-TR.pdf
- Description:
- DIODE GEN PURP 1KV 8A D2PAK
- Quantity:
- Payment:
- Shipping:
Inventory:1,497
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STTH810G-TR from STMicroelectronics is an ultrafast recovery, high-voltage silicon rectifier diode in D²PAK (TO-263) package, rated for 1000 V repetitive peak reverse voltage, 8 A average forward current, and 47 ns typical reverse recovery time at 125°C. It delivers soft recovery, low conduction losses (VF = 1.30 V typ. @ 8 A, 150°C), and high junction temperature capability (Tj = 175°C), making it suitable for industrial switch-mode power supply output rectification and freewheeling in motor drives.
For engineers reviewing the STTH810G-TR datasheet, STTH810G-TR pinout, STTH810G-TR application, or STTH810G-TR equivalent, key selection criteria include reverse recovery softness (S factor = 2), thermal resistance (Rth(j-c) = 2.5 °C/W), insulation requirements, and pulsed current handling (IFSM = 60 A) in high-reliability rectifier designs.
Technical Context
This diode employs a platinum-doped lifetime-controlled silicon structure to achieve ultrafast, soft reverse recovery with minimal ringing and EMI generation. Its dynamic performance is characterized under standardized test conditions: IF = 8 A, dIF/dt = –200 A/µs, VR = 600 V, Tj = 125°C - yielding trr = 47–65 ns and IRM = 12–16 A.
The device's thermal design centers on low Rth(j-c) = 2.5 °C/W (D²PAK), enabling high-power dissipation with moderate heatsinking. Static parameters include low IR = 2 µA max @ 125°C and VF = 1.3–1.7 V across 25–150°C, supporting stable operation in thermally demanding environments without thermal runaway risk.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 1000 V - supports primary-side rectification in 800 V DC bus systems and PFC stages |
| IF(AV) | 8 A @ Tc = 130°C - enables continuous conduction mode operation in 300–500 W SMPS outputs |
| trr (typ) | 47 ns @ Tj = 125°C - reduces switching losses and EMI in 100–500 kHz converters |
| VF (typ) | 1.30 V @ IF = 8 A, Tj = 150°C - lowers conduction loss to ~10.4 W at full load |
| Rth(j-c) | 2.5 °C/W - allows 32 W dissipation with ≤80°C case-to-junction rise (ΔT = 80°C) |
| S factor | 2 - ensures soft, non-oscillatory turn-off critical for snubberless designs and IGBT gate drive protection |
| Tj max | 175°C - extends operational margin in sealed enclosures or high-ambient industrial environments |
Pinout & Package
STTH810G-TR uses the surface-mount D²PAK (TO-263) package with isolated tab, featuring three terminals: Anode (pin 1), Cathode (pin 2), and electrically insulated metal tab (pin 3, thermal pad only, not electrically connected). The package meets UL94 V0 flammability rating and supports 2500 VRMS isolation between tab and leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Forward current entry point | Connected to high-side switching node (e.g., IGBT collector or transformer secondary center-tap) |
| Cathode (Pin 2) | Forward current exit point | Connected to output rail or ground return path; carries full load current and recovery tail |
| Tab (Thermal Pad) | Thermal interface only | Electrically isolated copper pad for soldering to PCB copper pour; provides primary heat path to ambient |
Key Features
| Feature | Design Value |
|---|---|
| Ultrafast soft recovery | trr = 47 ns typ. with S factor = 2 - suppresses voltage overshoot and reduces snubber component stress |
| High-temperature ruggedness | Tj(max) = 175°C and IR = 2 µA @ 125°C - enables operation in unventilated motor control cabinets |
| Low thermal resistance | Rth(j-c) = 2.5 °C/W - permits >30 W dissipation with standard 2-layer 2 oz Cu PCB heatsinking |
| Insulated D²PAK package | 2500 VRMS isolation, 7 pF capacitance - eliminates need for insulating washers in high-voltage floating topologies |
| ECOPACK® compliance | Lead-free second-level interconnect per JEDEC JESD97 - supports RoHS-compliant manufacturing and reflow |
Applications
| Industrial SMPS Output Rectification | IGBT Freewheeling Diode |
|---|---|
|
Use Scenario: High-efficiency 400–800 W offline power supplies with active clamp or LLC resonant topology. IC Role / Device Role / Timing Role: Main output rectifier conducting during synchronous or asynchronous flyback/freewheeling phase; handles 8 A DC + ripple. Use Value: 47 ns trr minimizes switching loss contribution at 300 kHz, while soft recovery avoids voltage spikes that could exceed IGBT VCE rating. |
Use Scenario: Three-phase inverter stage in HVAC compressors or servo drives operating at 10–20 kHz PWM frequency. IC Role / Device Role / Timing Role: Anti-parallel freewheeling diode across 600–1200 V IGBTs; conducts reverse current during dead-time and inductive load commutation. Use Value: S factor = 2 prevents oscillatory turn-off, reducing EMI and eliminating need for RC snubbers across IGBTs. |
| Snubber Network Diode | Bootstrap Circuit Diode |
|
Use Scenario: RCD clamp snubber in high-voltage flyback converters powering industrial sensors or PLC I/O modules. IC Role / Device Role / Timing Role: Fast recovery path for leakage inductance energy; conducts brief high-di/dt pulses (≥200 A/µs). Use Value: 100 A IFRM rating and 60 A IFSM support single-pulse energy absorption without degradation over 10⁶ cycles. |
Use Scenario: High-side gate driver bootstrap supply in half-bridge motor controllers (e.g., BLDC inverters). IC Role / Device Role / Timing Role: Unidirectional charge pump diode charging bootstrap capacitor during low-side conduction; blocks HV rail during high-side turn-on. Use Value: Low VF (1.3 V) minimizes bootstrap voltage drop, ensuring sufficient VGS for 100% duty-cycle high-side operation at 150°C junction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast high-voltage diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH8R06D | Same VRRM (600 V), lower VF (1.15 V typ.), but trr = 55 ns @ 125°C and no insulation | Not suitable where 1000 V rating or 2500 VRMS isolation is required | Select only if system VR < 600 V and isolation is unnecessary |
| IXYS MUR8100E | 1000 V VRRM, 8 A IF(AV), trr = 60 ns, Rth(j-c) = 3.0 °C/W, TO-220AC package (non-isolated) | Requires insulating hardware and larger heatsink due to higher thermal resistance and lack of integrated isolation | Prefer when through-hole mounting and mechanical robustness outweigh surface-mount density benefits |
Compared with STTH810G-TR, STTH8R06D trades off voltage rating and isolation for lower forward loss, while IXYS MUR8100E offers comparable ratings but demands external insulation and delivers 20% less thermal efficiency - making STTH810G-TR optimal for space-constrained, high-reliability D²PAK designs requiring intrinsic isolation.
Availability
STTH810G-TR is available at Aetrix Electronics and suitable for industrial power supplies, motor control inverters, and high-voltage snubber circuits requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for STTH810G-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
The STTH series targets high-reliability power conversion applications, with STTH810G-TR specifically engineered for ultrafast, soft-recovery rectification in high-voltage, high-temperature industrial systems.
FAQ
What is the maximum allowable case temperature for continuous operation?
The STTH810G-TR supports continuous operation up to Tc = 130°C when delivering its rated 8 A average forward current, as specified in Table 1. Exceeding this temperature requires derating per the thermal curves in Figure 3, and sustained operation above 130°C risks accelerated parameter drift and reduced reliability.
Does the D²PAK tab require electrical isolation from the PCB ground plane?
No - the D²PAK tab is electrically isolated (2500 VRMS) and may be soldered directly to a large copper pour for thermal management without additional insulation. This simplifies layout and improves thermal performance compared to TO-220 variants requiring mica washers or silicone pads.
Can STTH810G-TR replace STTH810D in existing TO-220AC designs?
No - STTH810G-TR uses a surface-mount D²PAK footprint incompatible with through-hole TO-220AC layouts. While electrical specs overlap, mechanical redesign (PCB, thermal pad, assembly process) is mandatory. STTH810D remains the direct replacement for legacy TO-220AC implementations.
What is the recommended reflow profile for STTH810G-TR?
STTH810G-TR complies with JEDEC J-STD-020D for lead-free reflow, requiring peak temperature ≤260°C for ≤30 seconds, with ramp-up rate ≤3°C/s and ramp-down rate ≤6°C/s. Preheat (150–200°C) and soak (200–220°C) durations must follow manufacturer-specified ECOPACK® guidelines to avoid delamination or voiding in the thermal pad solder joint.
STTH810G-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 1000 V
- Current - Average Rectified (Io):
- 8A
- Voltage - Forward (Vf) (Max) @ If:
- 2 V @ 8 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 85 ns
- Current - Reverse Leakage @ Vr:
- 5 µA @ 1000 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
- Operating Temperature - Junction:
- 175°C (Max)
STTH810G-TR FAQ
1.How can I place an order for STTH810G-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STTH810G-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STTH810G-TR reliable?
The price and inventory of STTH810G-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STTH810G-TR is usually 5 days.
3.What payment methods are accepted for STTH810G-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STTH810G-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STTH810G-TR?
STTH810G-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STTH810G-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STTH810G-TR?
For technical support, including STTH810G-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STTH810G-TR requirements.
6.How does Aetrix verify that STTH810G-TR is sourced from the original manufacturer or authorized distributors?
All STTH810G-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STTH810G-TR meets industry standards.
7.What is the process for return or replacement of STTH810G-TR?
All STTH810G-TR units undergo pre-shipment inspection (PSI). If there is an issue with STTH810G-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STTH810G-TR part is unused and in its original packaging.
Return procedure for STTH810G-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STTH810G-TR Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
