STMicroelectronics T1050H-6G

Overview

T1050H-6G from STMicroelectronics is a high-temperature, snubberless 10 A triac in D2PAK package, rated for 600 V repetitive peak off-state voltage (VDRM/VRRM), 50 mA maximum gate trigger current (IGT), and 150 °C maximum junction temperature. It delivers robust 3-quadrant commutation and low thermal resistance (Rth(j-c) = 1.45 °C/W), enabling reliable AC mains switching in compact universal motor drives.

For engineers reviewing the T1050H-6G datasheet, T1050H-6G pinout, T1050H-6G application, or T1050H-6G equivalent, key selection criteria include dV/dt immunity at 150 °C (1500 V/µs), critical commutation dI/dt capability (18 A/ms), on-state voltage drop (1.5 V max at 14 A), and insulated thermal performance in high-power-density appliances.

Technical Context

This triac operates as a bidirectional AC power switch with gate-controlled turn-on in all three quadrants, supporting phase-angle and zero-crossing control topologies. Its internal ceramic pad provides 2500 V_rms isolation between MT1/MT2 terminals and heatsink, eliminating need for external insulation washers in D2PAK mounting.

The device leverages clip-bonding construction to achieve low dynamic resistance (34 mΩ at 150 °C) and stable latching behavior across -40 to +150 °C ambient, with guaranteed turn-off commutation up to 150 °C junction temperature-critical for vacuum cleaner and washing machine drum motor applications where thermal cycling and surge stress are severe.

Key Specifications

Pinout & Package

D2PAK (TO-263) surface-mount package with isolated tab; thermally optimized for direct PCB copper area attachment. Tab is electrically connected to MT2 (A2) terminal.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triac-based AC switching applications.

Compared with BTA12-600BWRG and Q6010LH4, T1050H-6G uniquely combines D2PAK surface-mount compatibility, 150 °C commutation guarantee, and integrated 2500 V_rms isolation-enabling smaller, safer, and thermally superior designs in high-density consumer motor controls.

Availability

T1050H-6G is available at Aetrix Electronics and suitable for vacuum cleaner motor control, washing machine drum drive, and compact HVAC blower systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for T1050H-6G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.

The T10xxH series belongs to ST's Snubberless™ Triac product line, engineered specifically for high-temperature, high-reliability AC mains switching in universal motor and resistive load applications where thermal density and EMI resilience are critical.

FAQ

Is T1050H-6G compatible with standard D2PAK footprint layouts?

Yes. T1050H-6G uses the industry-standard D2PAK (TO-263) outline per Table 6 in Doc ID 13565 Rev 2, with exact dimensions: 10.28 mm × 9.35 mm body, 15.85 mm length including leads, and 5.28 mm height. The tab is electrically connected to A2 (MT2), and thermal pad alignment matches IPC-7351B SOIC-263A recommendations.

What gate drive circuitry is recommended for reliable triggering?

A 12 V, 50 mA pulse with <100 ns rise time is sufficient. ST recommends using an MOC3041 or IL420 optocoupler with 33 Ω series gate resistor to limit peak current to 360 mA while ensuring full turn-on within 1 µs. Avoid DC gate bias; use single-shot pulses synchronized to AC zero-crossing for reduced EMI.

Does T1050H-6G require a heatsink in 10 A continuous operation?

Yes. At 10 A RMS and 135 °C case temperature, power dissipation reaches ~15 W. With Rth(j-c) = 1.45 °C/W, junction temperature would exceed 150 °C without heatsinking. A minimum 25 cm² copper pour (35 µm thick) is required; forced-air cooling reduces needed area by 60%.

How does the 2500 V_rms isolation rating impact PCB layout?

The isolation applies between the D2PAK tab (A2) and leads (A1/G). Layout must maintain ≥4.5 mm creepage/clearance from tab to any other net, and avoid solder mask over the tab. No thermal vias are permitted under the tab; use solid copper pour directly bonded to tab for optimal thermal transfer and isolation integrity.