STMicroelectronics T1650H-6G

Overview

T1650H-6G from STMicroelectronics is a 16 A, 600 V snubberless triac in D²PAK surface-mount package, designed for high-power AC switching in universal motor control and inrush current limiting. It delivers 50 mA gate trigger current (IGT), supports 150 °C junction operation, and features 1000 V/µs dV/dt immunity at 150 °C - enabling robust commutation in vacuum cleaners and coffee brewers without external snubbers.

For engineers reviewing the T1650H-6G datasheet, T1650H-6G pinout, T1650H-6G application, or T1650H-6G equivalent, this part is selected for compact SMD-based mains-switching designs requiring high thermal performance, low I²t stress, and reliable 3-quadrant turn-off at elevated junction temperatures.

Technical Context

This triac operates as a bidirectional AC switch with symmetrical conduction in all four quadrants, where triggering occurs via gate current referenced to MT1 (A1). Its high dV/dt (1500 V/µs) and critical rate of decrease of main current (28 A/ms) are validated at Tj = 150 °C, ensuring reliable commutation under fast voltage transients and inductive load conditions.

The device uses clip-bonding construction to achieve low Rth(j–c) = 1.15 °C/W and on-state dynamic resistance RD = 23 mΩ at 150 °C, directly reducing heatsink requirements versus conventional triacs. Internal ceramic insulation is not present - the D²PAK variant is non-insulated, distinguishing it from TO-220AB Ins. versions rated for 2500 VRMS isolation.

Key Specifications

Pinout & Package

D²PAK (TO-263) surface-mount package with three terminals: MT1 (A1), MT2 (A2), and Gate (G). The exposed metal tab (MT2) serves as both power terminal and thermal path; soldering to ≥2 cm² copper area reduces Rth(j–a) to 45 °C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triac-based AC switching applications.

Compared with BTB16-600CW and T1650H-6T, the T1650H-6G offers superior thermal efficiency (1.15 vs. 1.5 °C/W), automated assembly readiness, and identical 150 °C commutation capability - making it optimal for space-constrained, high-volume consumer appliance designs.

Availability

T1650H-6G is available at Aetrix Electronics and suitable for vacuum cleaner motor control, coffee brewer heating circuits, and inrush current limiting in inverter-based home appliances requiring stable component supply and RoHS-compliant sourcing.

Supply support for T1650H-6G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, MCU, and sensor solutions for industrial, automotive, and consumer markets.

The T1650H-6G belongs to ST's H-series snubberless triac family, engineered specifically for high-power-density AC switching in universal motor and resistive load applications where reliability at elevated junction temperatures is critical.

FAQ

What is the maximum allowable case temperature for continuous 16 A RMS operation?

The T1650H-6G supports 16 A RMS at Tc = 130 °C in D²PAK and TO-220AB packages per Table 1. Exceeding this temperature requires derating per Figure 2; at Tc = 100 °C, RMS current capability rises to ~18 A. Thermal interface quality and PCB copper area directly impact achievable case temperature.

Does the D²PAK package provide electrical isolation between MT2 and PCB ground?

No. The D²PAK package is non-insulated: the exposed MT2 tab is electrically connected to the main terminal and must be isolated from conductive surfaces using insulating thermal pads or dielectric coatings. Only the TO-220AB Ins. variant (e.g., T1650H-6I) provides 2500 VRMS isolation.

Can T1650H-6G replace T1635H-6G in existing designs?

Yes, with verification of gate drive capability: T1650H-6G requires up to 50 mA IGT versus 35 mA for T1635H-6G. If the existing driver delivers ≥50 mA with <100 ns rise time, replacement is functionally valid; otherwise, gate resistor or driver stage adjustment may be needed.

What is the recommended PCB footprint for thermal performance?

Per Figure 15, use a 16.90 × 10.30 mm copper pad with 3.70 mm clearance around the tab. For optimal Rth(j–a), connect the pad to ≥2 cm² internal or external copper plane; FR4 board with 35 µm copper achieves 45 °C/W ambient thermal resistance per Table 4.