Vishay General Semiconductor - Diodes Division T4F24AHM3/H
- Part No.:
- T4F24AHM3/H
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- DO-219AB
- Datasheet:
-
T4F24AHM3/H.pdf
- Description:
- LOW PROFILE OF 400W PAR TVS PROD
- Quantity:
- Payment:

- Shipping:

Inventory:20,992
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
T4F24AHM3/H from Vishay General Semiconductor is a unidirectional surface-mount PAR® transient voltage suppressor (TVS) in the eSMP® Series, designed for automotive-grade overvoltage protection of sensitive signal lines and power rails. It features a 24.0 V nominal breakdown voltage (VBR), 20.5 V maximum stand-off voltage (VWM), 33.2 V clamping voltage at 12.0 A peak pulse current, 400 W peak pulse power (10/1000 µs), and AEC-Q101 qualification for under-hood sensor interface protection.
For engineers reviewing the T4F24AHM3/H datasheet, T4F24AHM3/H pinout, T4F24AHM3/H application, or T4F24AHM3/H equivalent, this page provides verified package mapping (SMF/DO-219AB), junction temperature derating behavior, clamping performance at rated surge current, and validated alternatives for automotive ESD/surge protection design-in.
Technical Context
The T4F24AHM3/H employs passivated anisotropic rectifier technology with optimized junction passivation to sustain 185 °C maximum junction temperature-enabling operation in high-reliability automotive environments. Its unidirectional architecture supports DC-biased signal line protection without reverse conduction during normal operation.
It delivers 400 W peak pulse power per 10/1000 µs waveform with a thermal resistance of 135–160 °C/W (junction-to-ambient) on FR4 PCB, and meets MSL Level 1 reflow compatibility up to 260 °C peak. The device is halogen-free, RoHS-compliant, and qualified per JESD201 Class 2 whisker test.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR (Nominal) | 24.0 V - Ensures reliable triggering above 20.5 V operating voltage while avoiding false clamping during transients. |
| VWM | 20.5 V - Maximum continuous reverse voltage before leakage exceeds 1 µA; defines safe operating margin for 12 V/24 V automotive systems. |
| VC @ IPPM | 33.2 V - Clamping voltage at 12.0 A surge current; limits downstream IC stress to ≤33.2 V during ISO 7637-2 Pulse 1/2a events. |
| PPPM | 400 W - Peak pulse power handling capability with 10/1000 µs waveform; sufficient for load-dump and inductive switching transients. |
| TJ max. | 185 °C - Enables placement near heat sources (e.g., engine control units) without derating loss in surge capability. |
| Package | SMF (DO-219AB) - Low-profile 2.9 mm × 1.3 mm footprint compatible with automated SMT assembly and high-density PCB layouts. |
| AEC-Q101 | Qualified - Validated for automotive applications including powertrain, body electronics, and ADAS sensor interfaces. |
Pinout & Package
Package: SMF (DO-219AB) - Surface-mount, low-profile case with matte tin-plated leads, cathode indicated by color band. Complies with JEDEC DO-219AB outline and UL 94 V-0 flammability rating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry terminal during clamping | Connected to protected line (e.g., CAN_H, LIN, sensor supply); must be routed with low-inductance trace to minimize overshoot. |
| Cathode | Current exit terminal during clamping | Connected to ground or reference rail; requires low-impedance return path to maintain clamping integrity under fast transients. |
Key Features
| Feature | Design Value |
|---|---|
| 185 °C junction rating | Enables direct placement in high-temperature zones (e.g., near ECUs or motor drivers) without thermal derating penalties. |
| 400 W peak pulse power | Withstands ISO 7637-2 Pulse 5a (load dump) surges up to 40 V/100 ms without failure when properly heatsinked. |
| AEC-Q101 qualification | Validated for automotive reliability including HTOL, temperature cycling, and HAST-reducing qualification effort for Tier 1 suppliers. |
| SMF (DO-219AB) package | 0.85 mm height enables use in space-constrained modules (e.g., radar sensors, camera ECUs) while maintaining 1.0 W steady-state dissipation. |
| Halogen-free & RoHS | Meets global environmental compliance requirements for automotive OEMs including VW 80101 and GMW3172. |
Applications
| Automotive Sensor Protection | CAN/LIN Bus Protection |
|---|---|
|
Use Scenario: Protecting analog output sensors (e.g., pressure, temperature) in engine bay against load dump and inductive kickback. IC Role / Device Role / Timing Role: Unidirectional TVS diode placed between sensor output and ECU input to clamp transients before they reach ADC front-end. Use Value: Limits voltage excursion to ≤33.2 V during 12.0 A surge, preventing latch-up or damage to 3.3 V/5 V signal conditioning ICs. |
Use Scenario: Shielding CAN_H/CAN_L lines in body control modules from ESD and coupled noise in 12 V vehicle networks. IC Role / Device Role / Timing Role: Bidirectional protection not required; T4F24AHM3/H used on single-ended supply rail (e.g., CAN transceiver VCC) with separate GND reference. Use Value: Provides 400 W surge immunity while maintaining <1 µA leakage at 20.5 V, preserving bus bias stability and low-power sleep modes. |
| Power Supply Rail Clamp | ADAS Camera Module Protection |
|
Use Scenario: Safeguarding 24 V input rails of infotainment head units and telematics gateways against battery reversal and jump-start spikes. IC Role / Device Role / Timing Role: Primary overvoltage clamp upstream of DC-DC converters, sized to absorb energy before downstream LDOs or PMICs. Use Value: Clamps to 33.2 V within nanoseconds, limiting input stress on 36 V-rated buck controllers and enabling smaller input capacitors. |
Use Scenario: Hardening image sensor power and I²C lines in surround-view cameras exposed to under-hood EMI and thermal cycling. IC Role / Device Role / Timing Role: Discrete TVS on 1.8 V/3.3 V sensor IO rails and 5 V camera module supply, leveraging low capacitance and AEC-Q101 reliability. Use Value: Maintains <1 µA leakage at 20.5 V and operates up to 185 °C ambient-ensuring signal integrity across -40 °C to +125 °C operating range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ24A-E3/57T | Higher RthJA (180 °C/W), lower PPPM (400 W same), but VC = 38.9 V at 10.3 A - less effective clamping. | Less suitable for tight-clamp designs; acceptable where board layout allows larger copper pour for thermal relief. | Select when cost sensitivity outweighs clamping voltage optimization and thermal constraints are relaxed. |
| 1.5SMC24AHE3/A | Same VBR/VWM, but DO-214AB package (larger footprint, 4.5 mm × 3.5 mm); higher IPPM (12.5 A), VC = 36.0 V. | Requires PCB redesign due to larger case; better for high-surge industrial applications, not automotive space-constrained modules. | Choose only if SMF footprint is unavailable and thermal mass requirement exceeds 1.0 W steady-state dissipation. |
Compared with SMAJ24A-E3/57T and 1.5SMC24AHE3/A, the T4F24AHM3/H offers superior clamping (33.2 V vs. ≥36.0 V), lower profile (0.85 mm vs. ≥2.2 mm), and tighter automotive qualification scope-including explicit JESD201 Class 2 whisker testing-making it optimal for next-gen ADAS and powertrain modules.
Availability
T4F24AHM3/H is available at Aetrix Electronics and suitable for automotive sensor protection, CAN/LIN bus rail clamping, and ADAS camera module hardening requiring stable component supply across extended temperature and lifecycle demands.
Supply support for T4F24AHM3/H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, and TVS devices for automotive, industrial, and computing markets.
The T4F24AHM3/H belongs to Vishay's eSMP® PAR® TVS family, engineered specifically for AEC-Q101-compliant transient suppression in harsh automotive environments-emphasizing high-temperature stability, low-profile packaging, and repeatable clamping performance.
FAQ
What is the maximum clamping voltage of the T4F24AHM3/H at its rated peak pulse current?
The T4F24AHM3/H has a maximum clamping voltage (VC) of 33.2 V at 12.0 A peak pulse current (IPPM) under 10/1000 µs waveform conditions. This value is measured per ANSI/IEEE C62.35 standards and ensures downstream components remain within safe voltage limits during surge events. The T4F24AHM3/H maintains this clamping performance across its full operating temperature range.
Is the T4F24AHM3/H suitable for bidirectional transient protection?
No, the T4F24AHM3/H is unidirectional only, as confirmed in the Vishay datasheet revision 14-Feb-2023. It is intended for DC-biased applications such as power rail or signal line protection where reverse conduction is not required. For bidirectional protection, a different device like the SMBJ24A or equivalent dual-diode configuration would be necessary-not the T4F24AHM3/H.
What does the "HM3/H" suffix indicate in T4F24AHM3/H?
The "HM3" suffix denotes halogen-free, RoHS-compliant construction with AEC-Q101 qualification and JESD201 Class 2 whisker resistance. The "/H" indicates packaging in 7-inch plastic tape and reel with 3000 units per reel. This full designation-T4F24AHM3/H-is the orderable part number reflecting both material compliance and delivery format.
Does the T4F24AHM3/H meet automotive reliability standards beyond AEC-Q101?
Yes, the T4F24AHM3/H meets MSL Level 1 per J-STD-020 (reflow peak of 260 °C), passes JESD201 Class 2 whisker testing, and uses UL 94 V-0 molding compound. These qualifications-alongside AEC-Q101-are explicitly documented in the Vishay datasheet for T4F24AHM3/H and support use in safety-critical automotive subsystems including powertrain and ADAS.
How does the thermal resistance of the T4F24AHM3/H affect its surge capability at elevated ambient temperatures?
The T4F24AHM3/H has RthJA = 135–160 °C/W on FR4 PCB. At 125 °C ambient, its usable surge energy drops ~40% versus 25 °C due to junction temperature derating (per Fig. 2 in the datasheet). Designers must limit pulse repetition rate or add copper thermal relief to maintain TJ ≤ 185 °C. This behavior is inherent to the T4F24AHM3/H's SMF package and must be modeled in thermal simulations.
T4F24AHM3/H Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- DO-219AB
- Series:
- PAR®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 20.5V
- Voltage - Breakdown (Min):
- 22.8V
- Voltage - Clamping (Max) @ Ipp:
- 33.2V
- Current - Peak Pulse (10/1000µs):
- 12A
- Power - Peak Pulse:
- 400W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -65°C ~ 185°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-219AB (SMF)
T4F24AHM3/H FAQ
1.How can I place an order for T4F24AHM3/H through Aetrix?
Please submit a Request for Quotation (RFQ) for T4F24AHM3/H on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for T4F24AHM3/H reliable?
The price and inventory of T4F24AHM3/H are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for T4F24AHM3/H is usually 5 days.
3.What payment methods are accepted for T4F24AHM3/H?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for T4F24AHM3/H transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for T4F24AHM3/H?
T4F24AHM3/H orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your T4F24AHM3/H order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for T4F24AHM3/H?
For technical support, including T4F24AHM3/H datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your T4F24AHM3/H requirements.
6.How does Aetrix verify that T4F24AHM3/H is sourced from the original manufacturer or authorized distributors?
All T4F24AHM3/H products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that T4F24AHM3/H meets industry standards.
7.What is the process for return or replacement of T4F24AHM3/H?
All T4F24AHM3/H units undergo pre-shipment inspection (PSI). If there is an issue with T4F24AHM3/H, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The T4F24AHM3/H part is unused and in its original packaging.
Return procedure for T4F24AHM3/H:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
T4F24AHM3/H Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

